Chongqing-Pingwei-Tech-20N65MF

Part #Chongqing-Pingwei-Tech-20N65MF
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Chongqing-Pingwei-Tech-20N65MF
20N65MF  
20 Amps,650 Volts N-CHANNEL MOSFET  
FEATURE  
TO-220MF  
20A,650
V
,
R

DS(ON)MAX

=0.50
Ω
@V

GS

=10V/10A  
Low gate charge  
Low C

iss  

Fast switching  
100% avalanche tested  
Improved dv/dt capability  
Absolute Maximum Ratings
(T

C

=25
℃
,unless otherwise noted)  
Parameter  
Symbol  
UNIT  
20N65MF  
Drain-Source
V
o
ltage  
V

DSS  

V

GSS  

I

D  

650  
±
30  
20  
V
Gate-Source
V
o
ltage  
Continuous Drain Current  
A
Pulsed Drain Current(Note1)  
I

DM  

80  
Single Pulse Avalanche Energy (Note 2)  
Avalanche Current(Note1)  
E

AS  

900  
mJ  
A
I

AR  

20  
Repetitive Avalanche Energy (Note1)  
Reverse Diode dV/dt (Note 3)  
Operating Junction and Storage Temperature Range  
Maximum lead temperature for soldering purposes,  
1/8
“
from case for 5 seconds  
E

AR  

28  
mJ  
V/ns  
℃
dv/dt  
T

J

,T

STG  

4.5  
-55 to +150  
T

L  

260  
℃
Thermal Characteristics  
Parameter  
Symbol  
R

thJC  

TO-220MF  
Units  
℃
/W  
W
Maximum Junction-to-Case  
2.3  
54  
Maximum Power Dissipation  
T

C

=25
℃  
P

D  

Electrical Characteristics
 
(T

c

=25
℃
,unless otherwise noted)  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
Drain-Source Breakdown
V
o
ltage  
Breakdown Temperature Coefficient  
BV

DSS  

ΔBV

DSS  

/ΔT

J  

V

GS

=0
V
,
I

D

=250uA  
650  
-
-
-
V
Reference to 25
℃,  
I

D

=250uA  
-
0.6  
V/
℃  
Zero Gate
V
o
ltage Drain Current  
Gate-Body Leakage Current,Forward  
Gate-Body Leakage Current,Reverse  
On Characteristics  
I

DSS  

V

DS

=650
V
,
V

GS

=0V  
V

GS

=30
V
,
V

DS

=0V  
V

GS

=-30
V
,
V

DS

=0V  
-
-
-
-
-
-
1
μ
A  
nA  
I

GSSF  

100  
-100  
I

GSSR  

nA  
Gate-Source Threshold
V
o
ltage  
Drain-Source On-State Resistance  
Dynamic Characteristics  
Input Capacitance  
V

GS(th)  

R

DS(on)  

V

DS

=10
V
,
I

D

=250uA  
V

GS

=10
V
,
I

D

=10A  
2
-
4
V
-
0.32  
0.5  
Ω
C

iss  

C

oss  

C

rss  

pF  
pF  
pF  
V

DS

=25
V
,
V

GS

=0
V
,  
f=1.0MHZ  
-
-
-
2370  
1280  
95  
-
-
-
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
t

d(on)  

t

r  

t

d(off)  

t

f  

ns  
ns  
V

DD

=325
V
,
I

D

=20A,  
-
-
-
-
40  
5
62  
140  
230  
65  
-
-
R

G

=25Ω  
(Note4,5)  
ns  
-
ns  
-
Qg  
Qgs  
Qgd  
nC  
nC  
nC  
V

DS

=480
V
,
I

D

=20A,  
V

GS

=10
V
,
(
Note4,5)  
75  
100  
25  
50  
13.5  
36  
10  
Drain-Source Body Diode Charcteristics and Maximum Ratings  
Continuous Diode Forward
 
Current  
Pulsed Diode Forward Current  
Diode Forward
V
o
ltage  
I

S  

I

SM  

V

SD  

t

rr  

A
A
-
-
-
-
-
-
-
20  
80  
1.5  
-
V
I

S

=20A,V

GS

=0V  
V

GS

=0
V
,
I

S

=20A,  
dI

F

/dt=100A/us,  
-
Reverse Recovery Time  
ns  
530  
10.5  
Reverse Recovery Charge  
Q

rr  

(Note4)  
μ
C  
-
Notes  
1.  
2.  
3.  
4.  
5.  
Repetitive Rating:pulse width limited by maximum junction temperature.  
V

DD

=50
V
,
L=10mH,R

g

=25
Ω
,I

AS

=20A , starling T

J

=25
℃
.  
I

SD

≤
I

D

,dI/dt=200A/us,V

DD

≤
BV

DSS

,starting T

J

=25
℃
.  
Pulse width≤300us;duty cycle≤2%.  
Repetitive rating; pulse width limited by maximum junction temperature.  

RATINGAND CHARACTERISTIC CURVES  

RATINGAND CHARACTERISTIC CURVES  
24  
20  
30  
15V TOP  
14V  
13V  
12V  
25  
11V  
10V  
9V  
8V  
16  
12  
8
20  
15  
10  
5
V
T
J
=25℃  
0
8
4
=
V

DS  

7V  
6V  
5V  
4
0
0
0
20  
40  
60  
80  
100 120  
0
5
10  
15  
20  
25  
30  
Q
g
,Total Gate Charge(nC)  
V
DS
,Drain-to-Source Voltage(V)  
10000  
1000  
100  
100  
10  
1
C
iss  
C
oss  
T
J
=150℃  
T
J
=25℃  
V
GS
= 0
V,f = 1MHz  
C
iss
=
C
gs
C
g
d
,C
ds
Shorted  
C
rss
=
C
g
d  
C
oss
=
C
ds
+ C
gd  
C
rss  
10  
V
GS
=0
V  
1
0.1  
0
100 200 300 400 500 600  
V
DS
,Drain-to-Source Voltage(V)  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
V
DS
,Source-Drain Voltage(V)  
800  
750  
3
I
D
=10.0
A  
2.5  
700  
650  
600  
550  
500  
2
1.5  
1
V
GS
=10
V  
0.5  
0
-60 -40 -20  
0
25 50 75
 
100 125
 
150 175  
-75 -50 -25  
0
25 50 75
 
100125 150 175  
T
J
, Junction Temperature(
℃
)  
T
J
, Junction Temperature(
℃
)  

10  
Operation in this Area  
Limited by R
DS(on)  
Common Source  
Tc=25
℃  
Pulse Test  
I
DM
=Limited  
100  
10  
100
μ
s  
1
Limited by R
DS(on)  
1
1ms  
V
GS
=10
V  
10ms  
0.1  
0.01  
T
C
=25
℃  
T
J
=150
℃  
Single Pulse  
BVDSS Limited  
100  
0.1  
0.1  
1
10  
100  
1
10  
1000  
I
D
, Drain Current(A)  
V
DS
,Drain-to-Source Voltage(V)  
1000  
800  
600  
400  
200  
0
5
4
3
2
1
0
Common Source  
V
DS
=10V  
I
D
=250uA  
Pulse Test  
25  
50  
75  
100  
125  
150  
-80 -40  
0
40  
80  
120 140  
T
CH
, Channel Temperature(Initial) (
℃
)  
T
C
, Case Temperature(
℃
)  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
10  
Pulse Time(s)  

PACKAGE OUTLINE DIMENSIONS  
TO-220MF  
TO-220MF  
Min  
B
L
Dim  
Max  
A
.590(15.0) .650(16.5)  
B
.393(10.0) .414(10.5)  
C
.118(3.00) .138(3.50)  
D
.118(3.00) .146(3.70)  
E
.512(13.0) .551(14.0)  
F
.028(0.70) .035(0.90)  
G
.114(2.90) .138(3.50)  
H
.255(6.50) .280(7.10)  
I
.173(4.40) .197(5.00)  
J
.102(2.60) .110(2.80)  
K
.018(0.45) .026(0.65)  
L
.092(2.35) .109(2.75)  
G
I
C
H
A
PIN 1  
2
3
D
E
J
P
.890(2.25) .113(2.85)  
F
P
K