Convert-Semiconductor-CTD03P030

Part #Convert-Semiconductor-CTD03P030
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Convert-Semiconductor-CTD03P030
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CTD03P030  
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30V P-Channel Trench MOSFET  
FE
A
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⚫
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⚫
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T
IONS  
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DC/DC converter  
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High side switch for full bridge convert  
Device Marking and Package Information  
Device  
Package  
Marking  
CTD03P030  
TO-252  
CTD03P030  
Absolute Maximum Ratings
at T

j

= 25ºC
 
unless otherwise noted  
Parameter  
Drain-Source Voltage (V

GS

= 0V)  
Drain Current-Continuous(Tc =25
℃
)  
Drain Current-Continuous(Tc =100
℃
)  
Pulsed Drain Current  
Symbol  
Value  
-30  
Unit  
V

DSS  

V
(note1)  
(note1)  
(note2)  
-35  
I

D  

A
-20  
I

DM  

V

GSS  

E

AS  

-54  
A
V
Gate Source Voltage  
±
20  
45  
Single Pulse Avalanche Energy  
Power Dissipation
 
T

C

= 25ºC  
(note3)  
(note4)  
mJ  
W
ºC  
P

D  

31  
Operating Junction and Storage Temperature Range  
T

J

, T

stg  

-55~+150  
Thermal Characteristics  
Parameter  
Symbol  
Value  
4
Unit  
℃
/W  
℃
/W  
Thermal Resistance,Junction-Case  
Thermal Resistance Junction-Ambient  
(note1)  
(note1)  
R

θJ  

C
62  
R

θJA  

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Electrical Characteristics
T

j

= 25ºC
 
unless otherwise specified  
Value  
Parameter  
Symbol  
Test Conditions  
Unit  
Min.  
Typ.  
Max.  
Static  
Drain-Source Breakdown Voltage  
V

(BR)DSS  

I

DSS  

V

GS

= 0V, I

D

= -250µA  
-30  
—  
—  
—  
—  
V
Zero Gate Voltage Drain Current  
Zero Gate Voltage Drain Current  
V

DS

= -30V, V

GS

= 0V, T

J

= 25ºC  
-1  
uA  
I

DSS  

V

DS

= -30V, V

GS

= 0V, T

J

= 55ºC  
—  
—  
-5  
Gate-Source Leakage  
I

GSS  

—  
-1.2  
—  
—  
—  
—  
—  
V

GS

=
±
20V  
±
100  
-2.5  
30  
nA  
V
Gate-Source Threshold Voltage  
V

GS(th)  

V

DS

= V

GS

, I

D

= -250µA  
V

GS

= -10V, I

D

= -15A  
V

GS

= -4.5V, I

D

= -10A  
mΩ  
mΩ  
Drain-Source On-Resistance
 
(note2)  
R

DS(on)  

—  
55  
Dynamic  
Input Capacitance  
C

iss  

C

oss  

C

rss  

Q

g  

930  
148  
115  
9.8  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
—  
V

GS

= 0V,  
V

DS

= -15V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Total Gate Charge
(
4.5V
)  
Gate-Source Charge  
Gate-Drain Charge  
V

DS

= -12V, I

D

= -18A,  
V

GS

= -4.5V  
Q

gs  

Q

gd  

t

d(on)  

t

r  

2.2  
nC  
3.4  
Turn-on Delay Time  
16.4  
20.2  
55  
V

DS

= -15V, I

D

=-2A  
V

GS

= -10V,R

G

= 3.3
Ω
 
Turn-on Rise Time  
ns  
Turn-off Delay Time  
t

d(off)  

t

f  

Turn-off Fall Time  
10  
Body Diode Characteristics  
Continuous Body Diode Current  
Pulsed Diode Forward Current  
Body Diode Voltage  
I

S  

—  
—  
—  
—  
—  
—  
-35  
-54  
T

C

= 25 ºC  
A
V
I

SM  

V

SD  

T

J

= 25ºC, I

SD

= -1A, V

GS

= 0V  
-1.2  
Notes  
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2. The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%  
3. The EAS data shows Max. rating . The test condition is VDD =25V,VGS =10V,L=0.1mH  
4. The power dissipation is limited by 175
℃
junction temperature  
5. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
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Typical Characteristics
 
T

J

= 25
º
C, unless otherwise noted  
Fig.2 On-Resistance vs. G-S Voltage  
Fig.1 Typical Output Characteristics  
Fig.3 Forward Characteristics
 
of Reverse Diode  
Fig.4 Gate-Charge Characteristics  
Fig.5 Normalized VGS(th) vs. TJ  
Fig.6 Normalized RDSON vs. TJ  
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Typical Characteristics
 
T

J

= 25
º
C, unless otherwise noted  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
Fig.9 Normalized Maximum Transient Thermal Impedance  
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CTD03P030  
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Typical Characteristics
 
T

J

= 25
º
C, unless otherwise noted  
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CTD03P030  
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Figure A
:
Gate Charge Test Circuit and Waveform  
Figure B
:
Resistive Switching Test Circuit and Waveform  
Figure C
:
Unclamped Inductive Switching Test Circuit and Waveform  
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CTD03P030  
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TO-252  
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CTD03P030  
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