Convert-Semiconductor-CTU03N8P5
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CTU03N8P5
Suzho
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30V N-Channel Trench MOSFET
FE
A
T
URES
⚫
Super Low Gate Charge
⚫
100% EAS Guaranteed
⚫
RoHS compliant
⚫
Green Device Available
⚫
Excellent CdV/dt effect decline
⚫
Advanced high cell density Trench technology
APPLIC
A
T
IONS
⚫
Switch Mode Power Supply (SMPS)
⚫
Uninterruptible Power Supply (UPS)
⚫
Hard switched and high frequency circuits
Device Marking and Package Information
Device
Package
Marking
CTU03N8P5
TO-251
CTU03N8P5
Absolute Maximum Ratings
at T
j
= 25ºC
unless otherwise noted
Parameter
Drain-Source Voltage (V
GS
= 0V)
Continuous Drain Current
T
C
= 25ºC
Continuous Drain Current
T
C
= 100ºC
Pulsed Drain Current
Symbol
Value
30
Unit
V
V
DSS
(note1)
(note1)
(note2)
60
A
I
D
40
A
I
DM
V
GSS
E
AS
120
A
Gate Source Voltage
V
±
20
57.8
41
Single Pulse Avalanche Energy
Power Dissipation
(note3)
(note4)
mJ
W
ºC
P
D
Operating Junction and Storage Temperature Range
T
J
, T
stg
-55~+175
Thermal Characteristics
Parameter
Symbol
Value
3.6
Unit
Thermal Resistance, Junction-Case
Thermal Resistance, Junction-Ambient
(note1)
(note1)
R
θJ
C
ºC /W
62
R
θJ
A
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Electrical Characteristics
T
j
= 25ºC
unless otherwise specified
Value
Parameter
Symbol
Test Conditions
Unit
Min.
Typ.
Max.
Static
Drain-Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0V, I
D
= 250µA
30
—
—
—
—
V
V
DS
= 24V, V
GS
= 0V, T
J
= 25ºC
V
DS
= 24V, V
GS
= 0V, T
J
= 55ºC
V
GS
=
±
20V
1
5
uA
uA
nA
V
Zero Gate Voltage Drain Current
I
DSS
—
—
—
—
Gate-Source Leakage
I
GSS
±
100
2.5
8.5
14
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10V, I
D
= 30A
1.2
—
—
7.3
11
mΩ
mΩ
Drain-Source On-Resistance
(note3)
R
DS(on)
V
GS
= 4.5V, I
D
= 15A
—
Dynamic
Input Capacitance
C
iss
C
oss
C
rss
Q
g
1317
163
131
12.6
4.2
1843
228
183
17.6
5.9
7.1
9.2
22
—
—
—
—
—
—
—
—
—
—
V
GS
= 0V,
V
DS
= 15V,
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
pF
V
DD
= 15V, I
D
= 15A,
V
GS
= 4.5V
Gate-Source Charge
Gate-Drain Charge
Q
gs
Q
gd
t
d(on)
t
r
nC
5.1
Turn-on Delay Time
Turn-on Rise Time
4.6
12.2
26.6
8
V
DS
= 15V, I
D
= 15A
V
GS
= 10V,R
G
= 3.3
Ω
ns
Turn-off Delay Time
Turn-off Fall Time
t
d(off)
t
f
53
16
Body Diode Characteristics
Continuous Body Diode Current
I
S
—
—
60
—
—
T
C
= 25ºC
A
Pulsed Diode Forward Current
I
SM
120
Body Diode Voltage
V
SD
t
rr
T
J
= 25ºC, I
SD
= 30A, V
GS
= 0V
—
1.2
—
V
—
—
Reverse Recovery Time
9.2
ns
I
F
= 30A
di
F
/dt = 100A/
μs
Reverse Recovery Charge
Q
rr
2.0
—
nC
—
Notes
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3. The EAS data shows Max. rating . The test condition is VDD =25V,VGS =10V,L=0.1mH
4. The power dissipation is limited by 175
℃
junction temperature
5. The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Typical Characteristics
T
J
= 25
º
C, unless otherwise noted
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CTU03N8P5
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Typical Characteristics
T
J
= 25
º
C, unless otherwise noted
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CTU03N8P5
Suzho
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Figure A
:
Gate Charge Test Circuit and Waveform
Figure B
:
Resistive Switching Test Circuit and Waveform
Figure C
:
Unclamped Inductive Switching Test Circuit and Waveform
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CTU03N8P5
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TO-251
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hereunder.
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Convert’s
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