Convert-Semiconductor-CTU20N700
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Suzho
u Convert Semiconductor Co., Ltd.
CTU20N700
200V N-Channel Trench MOSFET
FE
A
T
URES
⚫
Super Low Gate Charge
⚫
100% EAS Guaranteed
⚫
Green Device Available
⚫
Excellent CdV/dt effect decline
⚫
Advanced high cell density Trench technology
APPLIC
A
T
IONS
⚫
Power switching application
⚫
Uninterruptible Power Supply
⚫
Hard switched and high frequency circuits
Device Marking and Package Information
Device
Package
Marking
CTU20N700
TO-251
CTU20N700
Absolute Maximum Ratings
at T
j
= 25ºC
unless otherwise noted
Parameter
Drain-Source Voltage (V
GS
= 0V)
Symbol
Value
Unit
V
V
DSS
200
Continuous Drain Current
T
C
= 25ºC
Continuous Drain Current
T
C
= 100ºC
Drain Current-Continuous@ Current-Pulsed
Gate-Source Voltage (VDS=0V)
(note1)
(note1)
(note2)
2.8
A
I
D
1.5
A
I
DM
V
GSS
E
As
8
±
20
A
V
Single Pulse Avalanche Energy
(note3)
(note4)
8
mJ
W
ºC
Maximum Power Dissipation(Tc=25
℃
)
P
D
42
Operating Junction and Storage Temperature Range
T
J
, T
stg
-55~+175
Thermal Characteristics
Parameter
Symbol
Value
3.6
Unit
Thermal Resistance, Junction-to-Case
R
θJ
C
ºC /W
Thermal Resistance, Junction-to-Ambient
(note1)
62
R
θJ
A
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Electrical Characteristics
T
j
= 25ºC
unless otherwise specified
Value
Parameter
Symbol
Test Conditions
Unit
Min.
Typ.
Max.
Static
Drain-Source Breakdown Voltage
V
(BR)DSS
I
DSS
V
GS
= 0V, I
D
= 250µA
V
DS
= 200V, V
GS
= 0V, T
J
= 25ºC
V
DS
= 200V, V
GS
= 0V, T
J
= 55ºC
V
GS
=
±
20V
200
—
—
1
V
—
—
—
—
Zero Gate Voltage Drain Current
uA
—
5
Gate-Source Leakage
I
GSS
—
nA
V
±
100
3.0
700
900
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250µA
V
GS
= 10V, I
D
= 1A
1.0
—
2.0
560
650
m
Ω
Ω
Drain-Source On-Resistance
R
DS(on)
V
GS
= 4.5V, I
D
= 1A
—
Dynamic
Input Capacitance
C
iss
C
oss
C
rss
Q
g
900
130
4.6
15
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
V
GS
= 0V,
V
DS
= 25V,
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
pF
nC
V
DS
= 160V, I
D
= 1A,
V
GS
= 10V
Gate-Source Charge
Gate-Drain Charge
Q
gs
Q
gd
t
d(on)
t
r
3
5.2
22
Turn-on Delay Time
Turn-on Rise Time
V
DS
= 100V, I
D
= 1A,
34
ns
R
G
= 3
Ω,
V
GS
=10V,
Turn-off Delay Time
Turn-off Fall Time
t
d(off)
t
f
45
11
Body Diode Characteristics
Continuous Body Diode Current
I
S
—
—
—
—
—
—
2.8
8
A
V
Pulsed Diode Forward Current
Body Diode Voltage
I
SM
V
SD
T
J
= 25ºC, I
SD
= 1A, V
GS
= 0V
1.2
I
F
= 1A
di
F
/dt = 100A/
μs
TJ=25
℃
Reverse Recovery Time
Reverse Recovery Charge
t
rr
85
—
—
ns
—
—
Q
rr
257
nC
Notes
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is VDD =25V,VGS =10V,L=0.1mH
4.The power dissipation is limited by 175
℃
junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Typical Characteristics
T
J
= 25
º
C, unless otherwise noted
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. G-S Voltage
Fig.3 Forward Characteristics of ReverseDiode
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized VGS(th)vs. TJ
Fig.6 Normalized RDSONvs. TJ
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CTU20N700
Typical Characteristics
T
J
= 25
º
C, unless otherwise noted
Fig.8 Safe Operating Area
Fig.7 Capacitance
Fig.9 Normalized Maximum Transient Thermal Impedance
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Figure A
:
Gate Charge Test Circuit and Waveform
Figure B
:
Resistive Switching Test Circuit and Waveform
Figure C
:
Unclamped Inductive Switching Test Circuit and Waveform
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CTU20N700
TO-251
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CTU20N700
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