CRMICRO-CRTS095N12N

Part #CRMICRO-CRTS095N12N
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CRMICRO-CRTS095N12N
CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Features  
Product Summary  
V

DS  

120V  
7mΩ  
112A  
• Uses CRM(CQ) advanced Trench technology  
• Extremely low on-resistance R

DS(on)  

• Excellent Q

g

xR

DS(on)

product(FOM)  
• Qualified according to JEDEC criteria  
R

DS(on) typ.  

I

D  

100% DVDS Tested  
Applications  
100% Avalanche Tested  
• Motor control and drive  
• Battery management  
• UPS (Uninterrupible Power Supplies)  
Package Marking and Ordering Information  
Part #  
Marking  
Package  
TO-263  
Reel Size  
N/A  
Tape Width  
N/A  
Qty  
Packing  
Reel  
CRTS095N12N  
CRTS095N12N  
1000pcs  
Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Unit  
V

DS  

Drain-source voltage  
120  
V
Continuous drain current  
T

C

= 25°C (Silicon limit)  
T

C

= 25°C (Package limit)  
T

C

= 100°C (Silicon limit)  
112  
160  
71  
I

D  

A
Pulsed drain current (T

C

= 25°C, t

p

limited by T

jmax  

)
I

D pulse  

E

AS  

448  
256  
A
mJ  
V
Avalanche energy, single pulse (L=0.5mH, Rg=25
Ω
)  
Gate-Source voltage  
V

GS  

±25  
Power dissipation (T

C

= 25°C)  
P

tot  

254  
W
°C  
T

j

,
T

stg  

Operating junction and storage temperature  
-55…+150  
Soldering temperature, wave soldering only allowed at leads  
(1.6mm from case for 10s)  
T

sold  

260  
°C  
©China Resources Microelectronics (Chongqing) Limited  
Page 1  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Thermal Resistance  
Parameter  
Symbol  
Max  
0.49  
91  
Unit  
R

thJC  

Thermal resistance, junction – case.  
°C/W  
R

thJA  

*
Thermal resistance, junction – ambient(min. footprint)  
Electrical Characteristic
(at Tj = 25 °C, unless otherwise specified)  
Value  
Symbol  
Parameter  
Unit  
Test Condition  
min.  
typ.  
max.  
Static Characteristic  
Drain-source breakdown  
voltage  
BV

DSS  

V

GS

=0V, I

D

=250uA  
V

DS

=V

GS

,I

D

=250uA  
120  
2
–
–
V
V
V

GS(th )  

Gate threshold voltage  
3
4
V

DS

=120V,V

GS

=0V  
T

j

=25°C  
Zero gate voltage drain  
current  
I

DSS  

–
–
0.08  
–
1
µA  
nA  
T

j

=150°C  
200  
Gate-source leakage  
current  
I

GSS  

V

GS

=±25V,V

DS

=0V  
–
±10  
±100  
V

GS

=10V, I

D

=75A,  
T

j

=25°C  
Drain-source on-state  
resistance  
R

DS(on)  

–
–
–
7
9.5  
20  
–
mΩ  
S
T

j

=150°C  
16  
g

fs  

V

DS

=5V,I

D

=75A  
Transconductance  
156  
Dynamic Characteristic  
Input Capacitance  
C

iss  

–
–
5996  
410  
–
–
V

GS

=0V, V

DS

=60V,  
f=1MHz  
C

oss  

Output Capacitance  
pF  
Reverse Transfer  
Capacitance  
C

rss  

–
133  
–
Q

G  

Q

gs  

Q

gd  

t

d(on)  

t

r  

Gate Total Charge  
Gate-Source charge  
Gate-Drain charge  
Turn-on delay time  
Rise time  
–
–
–
–
–
–
–
127  
32  
–
–
–
–
–
–
–
V

GS

=10V, V

DS

=60V,  
I

D

=75A, f=1MHz  
nC  
45  
20  
103  
62  
V

GS

=10V, V

DD

=60V,  
R

G_ext

=2.7Ω,I

D

=75A  
ns  
Ω
t

d(off)  

t

f  

Turn-off delay time  
Fall time  
110  
V

GS

=0V, V

DS

=0V,  
f=1MHz  
R

G  

Gate resistance  
–
1.7  
–
©China Resources Microelectronics (Chongqing) Limited  
Page 2  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Body Diode Characteristic  
Value  
typ.  
Symbol  
Parameter  
Unit  
V
Test Condition  
min.  
max.  
Body Diode Forward  
Voltage  
V

SD  

I

S  

V

GS

=0V,I

SD

=75A  
–
0.9  
1.3  
Body Diode Continuous  
Forward Current  
112  
A
T
C
= 25°C  
Body Diode Reverse  
Recovery Time  
t

rr  

–
–
58  
–
–
ns  
nC  
I

F

=75A, dI/dt=100A/µ  
s
Body Diode Reverse  
Recovery Charge  
Q

rr  

154  
*The value of R

thJA

is measured by placing the device in a still air box which is one cubic foot.  
©China Resources Microelectronics (Chongqing) Limited  
Page 3  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Typical Performance Characteristics  
Fig 2: Transfer Characteristics  
Fig 1: Output Characteristics  
400  
250  
200  
150  
100  
50  
10V  
7V  
T

j

=25°C  
V

DS

=5V  
320  
6V  
240  
160  
V

GS

=5V  
150°C  
25°C  
80  
0
0
0
2
4
6
8
10  
2
3
4
5
6
7
V

DS

(V)  
V

GS

(V)  
Fig 3: Rds(on) vs Drain Current and  
Gate Voltage  
Fig 4: Rds(on) vs Gate Voltage  
24  
22  
20  
18  
16  
14  
12  
10  
8
11  
I

D

=75A  
T

j

=25°C  
10  
9
150°C  
V

GS

=7V  
8
V

GS

=10V  
25°C  
7
6
4
6
4
5
6
7
8
9
10  
0
50  
100  
150  
200  
250  
V

GS

(V)  
I

D

(A)  
Fig 6: Capacitance Characteristics  
Fig 5: Rds(on) vs. Temperature  
100000  
10000  
1000  
100  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V

GS

=10V  
I

D

=75A  
Ciss  
Coss  
Crss  
V

GS

=0V  
f=1MHz  
10  
0
24  
48  
72  
96  
120  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tj – Junction Temperature (
°
C)  
V

DS

(V)  
©China Resources Microelectronics (Chongqing) Limited  
Page 4  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Fig 8: Body-diode Forward  
Characteristics  
Fig 7: Gate Charge Characteristics  
1000  
10  
8
V

DS

=60V  
I

D

=75A  
100  
10  
1
6
150
˚C  
25
˚C  
4
2
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
0
26  
52  
78  
104  
130  
V

SD

– Diode Forward Voltage(V)  
Qg (nC)  
Fig 10: Drain Current Derating  
Fig 9: Power Dissipation  
120  
300  
100  
80  
250  
200  
150  
100  
50  
60  
40  
V

GS

≥10V  
20  
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
175  
Tc – Case Temperature (
°
C
)  
Tc – Case Temperature (
°
C
)  
Fig 11: Safe Operating Area  
1000  
1us  
Limited by  
Rds(on)  
10us  
100  
10  
1
100us  
1ms  
10ms  
DC  
Single pulse  
Tc=25
˚C  
0.1  
0.1  
1
10  
100  
V

DS

(V)  
©China Resources Microelectronics (Chongqing) Limited  
Page 5  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Fig 12: Max. Transient Thermal Impedance  
D=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
0.01  
Single pulse  
Duty factor D=t1/t2  
T

JM

-T

C

=P

DM

*Z

thJC

(t)  
0.001  
1E-05  
0.0001  
0.001  
0.01  
0.1  
t

p

(sec)  
©China Resources Microelectronics (Chongqing) Limited  
Page 6  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Test Circuit & Waveform  
©China Resources Microelectronics (Chongqing) Limited  
Page 7  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Package Outline: TO-263  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
Max.  
Min.  
Max.  
A
4.30  
4.86  
0.169  
0.191  
A1  
0.00  
0.25  
0.000  
0.010  
A2  
b
2.34  
0.68  
1.15  
0.33  
1.17  
8.38  
6.90  
2.79  
0.94  
1.35  
0.65  
1.40  
9.45  
8.17  
0.092  
0.027  
0.045  
0.013  
0.046  
0.330  
0.272  
0.110  
0.037  
0.053  
0.026  
0.055  
0.372  
0.322  
b2  
c
c2  
D
D1  
e
2.54 BSC.  
0.100 BSC.  
E
9.78  
6.50  
10.50  
8.60  
0.385  
0.256  
0.413  
0.339  
E1  
H
L
14.61  
2.24  
0.70  
1.00  
0.00  
15.88  
3.00  
1.60  
1.78  
0.25  
0.575  
0.088  
0.028  
0.039  
0.000  
0.625  
0.118  
0.063  
0.070  
0.010  
L1  
L2  
L3  
©China Resources Microelectronics (Chongqing) Limited  
Page 8  

CRTS095N12N  
Trench N-MOSFET 120V, 7mΩ, 112A  
华润微电子(重庆)有限公司  
Revision History  
Revison  
1.0  
Date  
Major changes  
2018/10/30  
Release of formal version  
Increase the environmental labeling, I

S

, T

sold

, I

GSS

test value  
at V

GS

=-25V;Update R

DS(on),

Q

G

/Q

gs

/Q

gd,

g

fs

,V

SD

,t

d(on)

/t

r

/t

d(off

)/t

f  

and t

rr

/Q

rr

test current from 50A to 75A;Update Fig3/Fig4/  
Fig7 of Typical Performance Characteristics;Update Package  
Outline.  
2.0  
2019/7/22  
Disclaimer  
Unless otherwise specified in the datasheet, the product is designed and qulified as a standard commercial  
product and is not intended for use in applications that require extraordinary levels of quality and reliability,  
such as automotive, aviation/aerospace and life-support devices or systems.  
Any and all semicondutor products have certain probability to fail or malfunction, which may result in personal  
injury, death or property damage. Customer are solely responsible for providing adequate safe measures when  
design their systems.  
CRM(CQ) reserves the right to improve product design, function and reliability without notice.  
©China Resources Microelectronics (Chongqing) Limited  
Page 9