Diodes-Incorporated-2DD1664Q-13
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2DD1664P/Q/R
32V NPN SURFACE MOUNT TRANSISTOR IN SOT89
Features
Mechanical Data
Case: SOT89
BV
CEO
> 32V
Maximum Continuous Current I
C
= 1A
Epitaxial Planar Die Construction
Complementary PNP Type Available (2DB1132)
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Case Material: M
olded Plastic. “Green” M
olding Compound.
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish
Weight: 0.055 grams (Approximate)
SOT89
C
E
B
Top View
Device Symbol
Pin Out
–
Top View
Ordering Information
(Note 4)
Part Number
2DD1664P-13
2DD1664Q-13
2DD1664R-13
Marking
Reel Size (inches)
Tape Width (mm)
Quantity per Reel
2,500
N13P
N13Q
N13R
13
13
13
12
12
12
2,500
2,500
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See
https://www.diodes.com/quality/lead-
free/ fo
r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and
Lead-free.
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at
https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
= Manufacturer’s Marking
N13x = Product Type Marking Code:
YWW
N13x
Where
N13P = 2DD1664P
N13Q = 2DD1664Q
N13R = 2DD1664R
YWW = Date Code Marking
Y = Last Digit of Year (ex: 9 = 2019)
WW = Week Code (01 to 53)
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
Absolute Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
V
CBO
V
CEO
V
EBO
I
C
Value
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
40
32
6
V
V
Continuous Collector Current
Peak Pulse Current (Note 6)
1
A
2
A
I
CM
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
(Note 5)
1
Power Dissipation
(Note 6)
(Note 7)
(Note 5)
(Note 6)
(Note 7)
(Note 5)
1.5
2.0
125
83
W
P
D
Thermal Resistance, Junction to Ambient Air
°C/W
R
θ
JA
60
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
18
R
θ
JC
R
θ
JL
C/W
°C/W
°C
(Note 8)
22
-55 to +150
T
J,
T
STG
ESD Ratings
(Note 9)
Characteristic
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Machine Model
Symbol
Value
Unit
V
JEDEC Class
ESD HBM
ESD MM
4,000
400
3A
C
V
Notes:
5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper.
7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
Thermal Characteristics and Derating Information
140.0
3
2
1
0
T
A
=25
O
C
2oz copper
1oz copper
120.0
100.0
80.0
1oz copper
60.0
40.0
T
A
=25
O
C
500
2oz copper
2000
0
500
1000
1500
2500
0
1000
1500
2000
2500
Copper Area (sqmm)
Copper Area (sqmm)
120
100
80
60
40
20
0
1.0
0.8
0.6
0.4
0.2
0.0
D=0.5
Single Pulse
D=0.2
D=0.05
D=0.1
0
25
50
75
100 125 150
1
1m 10m
100m
1
10
100
1k
100
Temperature (
O
C)
Pulse Width (s)
Transient Thermal Impedance
Derating Curve
100
10
1
Single Pulse. T
A
=25
O
C
1m 10m
100m
100
1
10
100
1k
Pulse Width (s)
Pulse Power Dissipation
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 10)
Emitter-Base Breakdown Voltage
Collector-Emitter Cut-Off Current
Collector-Base Cut-Off Current
Symbol
BV
CBO
BV
CEO
BV
EBO
I
CES
Min
40
32
6
Typ
—
Max
—
Unit
V
Test Condition
I
C
= 100µA
—
—
V
I
C
= 10mA
I
E
= 100µA
V
CE
= 32V
V
CB
= 36V
V
EB
= 6V
—
—
V
—
—
—
—
100
100
100
180
270
390
400
—
nA
nA
nA
—
I
CBO
Base-Emitter Cut-Off Current
—
I
EBO
2DD1664P
Static Forward Current Transfer
2DD1664Q
82
120
180
—
—
—
h
FE
I
C
= 100mA, V
CE
= 3V
Ratio (Note 10)
2DD1664R
Collector-Emitter Saturation Voltage (Note 10)
Transition Frequency
120
280
10
mV
MHz
pF
V
CE(SAT)
f
T
I
C
= 500mA, I
B
= 50mA
—
I
E
= 50mA, V
CE
= 5V, f = 30MHz
I
E
= 0A, V
CB
= 10V, f = 1MHz
Output Capacitance
—
—
C
ob
Note:
10
. Measured under pulsed conditions. Pulse width = 300µs. Duty cycle ≤ 2%
.
Typical Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
1.8
V
= 3V
400
CE
1.6
1.4
T
T
= 150°C
A
300
200
1.2
1.0
0.8
0.6
0.4
= 85°C
= 25°C
A
T
A
A
T
= -55°C
100
0
0.2
0
0.001
0.01
Figure 2.
0.1
1
10
Figure 1.
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© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
Typical Electrical Characteristics
(continued) (@T
A
= +25°C, unless otherwise specified.)
I
/I =
10
B
C
T
T
= -55°C
A
= 25°C
= 85°C
A
T
= 150°C
A
T
A
T
= 25°C
A
T
= 85°C
V
= 3V
A
CE
T
= 150°C
A
T
= -55°C
A
Figure 3.
Figure 4.
40
30
T
= -55°C
A
20
T
= 25°C
= 85°C
A
T
A
10
0
I
/I =
10
B
T
= 150°C
C
A
Figure 6.
Figure 5.
V
= 5V
CE
f = 100MHz
-I
E
, EMITTER CURRENT
(mA)
Typical Gain-Bandwidth Product vs. Emitter Current
Figure 7.
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
Package Outline Dimensions
SOT89
D1
c
SOT89
Dim Min Max
Typ
1.50
0.56
0.48
0.38
4.50
A
B
1.40
1.60
0.50 0.62
H
E
B1
0.42 0.54
c
D
0.35 0.43
4.40 4.60
D1
1.62 1.83
1.733
D2
1.61 1.81
2.40 2.60
E2
2.05 2.35
1.71
2.50
2.20
1.50
4.10
2.78
1.05
B1
L
E
B
e
e
–
–
D2
H
3.95 4.25
H1
2.63 2.93
0.90 1.20
L
8
°
(
4X)
L1
0.327 0.527
0.427
0.20 0.40
0.30
z
H1
All Dimensions in mm
E2
A
L1
D
z
Suggested Pad Layout
SOT89
X2
Value
Dimensions
(in mm)
Y3
Y1
C
G
X
X1
X2
Y
Y1
Y2
Y3
Y4
1.500
0.244
0.580
0.760
1.933
1.730
3.030
1.500
0.770
4.530
Y4
X
G
Y
Y2
C
X1
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
2DD1664P/Q/R
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2019, Diodes Incorporated
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September 2019
© Diodes Incorporated
2DD1664P/Q/R
Document number: DS31143 Rev. 6 – 2
