Diodes-Incorporated-BSP75GTA

Part #Diodes-Incorporated-BSP75GTA
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Diodes-Incorporated-BSP75GTA
BSP75G  
60V self-protected low-side IntelliFET

TM

MOSFET switch  
Summary  
Continuous drain source voltage  
On-state resistance  
V
=60V  
DS  
550m
⍀
 
SOT223  
Nominal load current  
Clamping energy  
1.4A (V
 
= 5V)  
IN  
550mJ  
Description  
S
Self-protected low side MOSFET. Monolithic over temperature, over  
current, over voltage (active clamp) and ESD protected logic level  
power MOSFET intended as a general purpose switch.  
D
D
IN  
Note:  
Features  
The tab is connected to the drain pin, and must  
be electrically isolated from the source pin.  
Connection of significant copper to the tab is  
recommended for best thermal performance.  
•
•
•
•
•
•
•
•
Short circuit protection with auto restart  
Over-voltage protection (active clamp)  
Thermal shutdown with auto restart  
Over-current protection  
Input protection (ESD)  
High continuous current rating  
Load dump protection (actively protects load)  
Logic level input  
Ordering information  
Device  
Reel size  
(inches)  
T
a
pe width  
Quantity per reel  
(mm)  
BSP75GTA  
BSP75GTC  
7
12mm embossed  
12mm embossed  
1,000  
4,000  
13  
Device marking  
BSP75G  
© Zetex Semiconductors plc 2006  

BSP75G  
Functional block diagram  
D
Over voltage  
protection  
dV/dt  
limitation  
IN  
Over current  
protection  
Human body  
Logic  
ESD protection  
Over temperature  
protection  
S
Applications  
•
•
Especially suited for loads with a high in-rush current such as lamps and motors.  
All types of resistive, inductive and capacitive loads in switching applications.  
•
␮
C compatible power switch for 12V and 24V DC applications.  
•
•
•
Automotive rated.  
Replaces electromechanical relays and discrete circuits.  
Linear mode capability – the current-limiting protection circuitry is designed to de-activate at  
low Vds, in order not to compromise the load current during normal operation. The design  
maximum DC operating current is therefore determined by the thermal capability of the  
package/board combination, rather than by the protection circuitry.  
© Zetex Semiconductors plc 2006  

BSP75G  
Absolute maximum ratings  
Parameter  
Symbol  
Limit  
Unit  
Continuous drain-source voltage  
V
60  
V
DS  
Drain-source voltage for short circuit protection  
Continuous input voltage  
Peak input voltage  
V
36  
V
V
DS(SC)  
V
V
-0.2 … +10  
-0.2 … +20  
-40 to +150  
-55 to +150  
2.5  
IN  
IN  
V
Operating temperature range  
Storage temperature range  
(a)  
T ,  
°C  
°C  
W
j
T
stg  
P
Power dissipation at T
 
=25
°
C  
D
A
(a)  
I
I
1.6  
1.4  
A
A
Continuous drain current @ V
 
=10V; T
 
=25°C  
D
IN  
A
(a)  
Continuous drain current @ V
 
=5V; T
 
=25°C  
D
IN  
A
Pulsed drain current @ V
 
=10V  
I
5
3
A
A
IN  
DM  
(a)  
I
I
S
Continuous source current (body diode)  
Pulsed source current (body diode)  
5
A
S
Unclamped single pulse inductive energy  
Load dump protection  
E
550  
80  
mJ  
V
AS  
V
LoadDump  
Electrostatic discharge (human body model)  
V
4000  
V
ESD  
DIN humidity category, DIN 40 040  
IEC climatic category, DIN IEC 68-1  
E
40/150/56  
Thermal resistance  
Parameter  
Symbol  
Limit  
Unit  
(a)  
R
R
R
50  
°C/W  
⍜
JA  
⍜
JA  
⍜
JA  
Junction to ambient  
(b)  
24  
°C/W  
°C/W  
Junction to ambient  
(c)  
208  
Junction to ambient  
NOTES:  
(a) For a device surface mounted on 37mm x 37mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight  
copper.  
(b
)
F
or a device surface mounted on FR4 board and measured at t<=10s.  
(c) For a device mounted on FR4 board with the minimum copper required for electrical connections.  
© Zetex Semiconductors plc 2006  

BSP75G  
Characteristics  
© Zetex Semiconductors plc 2006  

BSP75G  
Electrical characteristics (at
T
amb = 25°C unless otherwise stated)  
Parameter  
Symbol  
Min. Typ. Max. Unit Conditions  
Static characteristics  
Drain-source clamp voltage  
V
60  
1
70  
0.1  
3
75  
3
V
␮
A
 
␮
A  
V
I =10mA  
D
DS(AZ)  
Off-state drain current  
Off-state drain current  
I
I
V
V
V
=12
V
, V
 
=
0V  
IN  
DSS  
DS  
DS  
DS  
15  
=32
V
, V
 
=
0V  
IN  
DSS  
(*)  
V
2.1  
0.7  
1.5  
4
=V ,
 
I =1mA  
GS D  
Input threshold voltage  
IN(th)  
Input current  
Input current  
Input current  
I
I
I
1.2  
2.7  
7
mA V
 
=+5V  
IN  
IN  
IN  
IN  
mA V
 
=+7V  
IN  
mA V
 
=+10V  
IN  
Static drain-source on-state  
resistance  
Static drain-source on-state  
resistance  
R
R
520  
675  
m
⍀
V =+5V,
 
I =0.7A  
IN D  
DS(on)  
DS(on)  
385  
550  
m
⍀
V =+10V,
 
I =0.7A  
IN D  
(†)  
I
I
0.7  
2
1.1  
3
1.75  
4
A
A
V =+5V,
 
V >5V  
IN DS  
D(LIM)  
Current limit  
(†)  
V =+10
V
,
 
V
>
5V  
D(LIM)  
IN  
DS  
Current limit  
Dynamic characteristics  
T
u
rn-on time (V
 
to 90% I
 
)  
t
2.2  
13  
10  
20  
20  
10  
␮
s  
␮
s  
R =22
⍀
, V
 
=12
V
,  
L DD  
IN  
D
on  
V =0
 
to +10V  
IN  
T
u
rn-off time (V
 
to 90% I
 
)  
t
R =22
⍀
, V
 
=12
V
,  
L DD  
IN  
D
off  
V =+10V
 
to 0V  
IN  
-dV

DS

/dt

on  

dV /dt  
Slew rate on (70 to 50% V  
)
)
10  
V/
␮
s R
 
=22
⍀
, V
 
=12
V
,  
L DD  
DD  
DD  
V =0
 
to +10V  
IN  
Slew rate off (50 to 70% V  
3.2  
V/
␮
s
R

L

=22
⍀
, V

DD

=12
V
,  
DS  
off  
V

IN

=+10V to 0V  
(‡)  
Protection functions  
Required input voltage for  
V
4.5  
V
PROT  
over temperature protection  
Thermal overload trip  
temperature  
T
150  
175  
10  
°
C  
°
C  
JT  
Thermal hysteresis  
Unclamped single pulse  
inductive energy Tj=25
°
C  
Unclamped single pulse  
inductive energy Tj=150
°
C  
Inverse diode  
E
E
550  
200  
mJ  
I
I
=0.7A, V
 
=32V  
DD  
AS  
D(ISO)  
mJ  
=0.7A, V
 
=32V  
AS  
D(ISO)  
DD  
Source drain voltage  
V
1
V =0
V
,
 
–
I =1.4A  
IN D  
SD  
NOTES:  
(*) Protection features may operate outside spec for V

IN

<4.5V.  
(†) The drain current is limited to a reduced value when V

DS

exceeds a safe level.  
(‡) Integrated
 
protection functions are designed to prevent IC destruction under fault conditions described in the  
datasheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed  
for continuous, repetitive operation.  
© Zetex Semiconductors plc 2006  

BSP75G  
Characteristics  
© Zetex Semiconductors plc 2006  

BSP75G  
Intentionally left blank  
© Zetex Semiconductors plc 2006  

BSP75G  
Package outline – SOT223  
Dim.  
Millimeters  
Min. Max.  
Inches  
Min.  
Dim.  
Millimeters  
Min. Max.  
Inches  
Max.  
0.071  
0.004  
0.033  
0.122  
0.013  
0.264  
Min.  
0.0905 BSC  
0.181 BSC  
Max.  
A
A1  
b
–
1.80  
0.10  
0.84  
3.10  
0.33  
6.70  
–
e
e1  
E
2.30 BSC  
4.60 BSC  
0.02  
0.66  
2.90  
0.23  
6.30  
0.0008  
0.026  
0.114  
0.009  
0.248  
6.70  
7.30  
0.264  
0.287  
b2  
C
E1  
L
3.30  
0.90  
–
3.70  
0.130  
0.355  
–
0.146  
–
–
–
–
D
–
Note:
Controlling dimensions are in millimeters. Approximate dimensions are provided in inches  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex GmbH  
Zetex Inc  
Zetex (Asia Ltd)  
Zetex Semiconductors plc  
Zetex
T
e
chnology Park, Chadderton  
Oldham, OL9 9LL  
Streitfeldstraße 19  
D-81673 München  
Germany  
700 Veterans Memorial Highway  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza
T
o
wer 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
United Kingdom  
T
e
lefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
T
e
lephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
T
e
lephone: (852) 26100 611  
Fax: (852) 24250 494  
T
e
lephone: (44) 161 622 4444  
Fax: (44) 161 622 4446  
These offices are supported by agents and distributors in major countries world-wide.  
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or  
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.  
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.  
© Zetex Semiconductors plc 2006