Diodes-Incorporated-DMG6402LDM-7

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Diodes-Incorporated-DMG6402LDM-7
NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Features  
Mechanical Data  
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•
•
•
Case: SOT-26  
•
•
•
•
•
•
•
Low R

DS(ON)  

Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Lead Free By Design/RoHS Compliant (Note 1)  
Qualified to AEC-Q101 Standards for High Reliability  
“Green” Device (Note 2)  
Case Material – Molded Plastic. UL Flammability Rating 94V-0  
Moisture Sensitivity:
 
Level 1 per J-STD-020  
Terminals: Finish – Matte Tin Solderable per MIL-STD-202,  
Method 208  
Terminal Connections: See Diagram  
Marking Information: See Page 2  
Ordering Information: See page 2  
Weight: 0.008 grams (approximate)  
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•
•
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SOT-26  
D
D
S
D
D
G
TOP VIEW  
Internal Schematic  
TOP VIEW  
Maximum Ratings
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
Drain-Source Voltage  
Symbol  
Value  
30  
Unit  
V
V

DSS  

V

GSS  

Gate-Source Voltage  
V
±
20  
T

A

= 25°C  
T

A

= 70°C  
Steady  
State  
5.3  
4.2  
Continuous Drain Current (Note 3)  
Pulsed Drain Current (Note 4)  
A
A
I

D  

31  
I

DM  

Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 3)  
Symbol  
Value  
1.12  
Unit  
W
P

D  

111  
Thermal Resistance, Junction to Ambient T

A

= 25°C (Note 3)  
Operating and Storage Temperature Range  
°
C/W  
°
C  
R

θ  

JA  
-55 to +150  
T

J

, T

STG  

Notes:  
1. No purposefully added lead.  
2. Diodes Inc’s “Green” policy can be found on our webs

3. Device mounted on FR-4 PCB, with minimum recommended pad layout.  
4. Repetitive Rating, pulse width limited by junction temperature.  
1 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3  

NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
Electrical Characteristics
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 5)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
–
–
–
–
–
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μ
A  
μ
A  
nA  
1.0  
Zero Gate Voltage Drain Current T

J

= 25°C  
Gate-Source Leakage  
V

DS

= 30V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
–
±100  
I

GSS  

ON CHARACTERISTICS (Note 5)  
Gate Threshold Voltage  
1.0  
–
1.5  
2.0  
V
V

GS(th)  

V

DS

= V

GS

, I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 7A  
V

GS

= 4.5V, I

D

= 5.6A  
V

DS

= 5V, I

D

= 7A  
22  
32  
27  
40  
m
Ω  
Static Drain-Source On-Resistance  
R

DS (ON)  

Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 6)  
Input Capacitance  
–
–
10  
–
S
V
|Y

fs

|  
V

SD  

0.75  
1.0  
V

GS

= 0V, I

S

= 1A  
–
–
–
–
–
–
–
–
–
–
–
404  
52  
–
–
–
–
–
–
–
–
–
–
–
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

=15V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
45  
1.51  
9.2  
V

DS

=0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Q

g  

Gate-Source Charge  
Gate-Drain Charge  
1.2  
Q

gs  

Q

gd  

t

D(on)  

t

r  

V

GS

=10V, V

DS

= 15V, ID =5.8A  
1.8  
Turn-On Delay Time  
3.41  
6.18  
13.92  
2.84  
Turn-On Rise Time  
V

DD

= 15V, V

GS

= 10V,  
R

L

= 2.6
Ω
, R

G

= 3
Ω  
Turn-Off Delay Time  
t

D(off)  

t

f  

Turn-Off Fall Time  
Notes:  
5. Short duration pulse test used to minimize self-heating effect.  
6. Guaranteed by design.
 
Not subject to production testing.  
30  
20  
16  
V
= 8.0V  
GS  
V
= 4.5V  
= 4.0V  
GS  
25  
V
= 5V  
DS  
V
GS  
GS  
20  
15  
12  
V
= 3.5V  
8
4
T
= 150°C  
10  
A
T
= 125°C  
A
V
V
V
= 3.0V  
= 2.8V  
= 2.5V  
GS  
GS  
GS  
T
= 85°C  
A
5
0
T
= 25°C  
A
T
= -55°C  
A
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Fig. 1 Typical Output Characteristics  
V

GS

, GATE SOURCE VOLTAGE (V)  
Fig. 2 Typical Transfer Characteristics  
2 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3  

NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
0.08  
0.08  
0.07  
V
= 4.5V  
GS  
T
= 150°C  
A
0.06  
0.05  
0.04  
0.03  
0.02  
0.06  
0.04  
T
= 125°C  
A
T
= 85°C  
= 25°C  
A
V
= 4.5V  
= 8.0V  
GS  
T
A
V
GS  
T
= -55°C  
A
0.02  
0
0.01  
0
0
5
10  
15  
20  
25  
30  
0
4
8
12  
16  
20  
I

D

, DRAIN CURRENT (A)  
Fig. 4
 
Typical Drain-Source On-Resistance  
vs. Drain Current and
T
e
mperature  
I

D

, DRAIN-SOURCE CURRENT (A)  
Fig. 3 Typical On-Resistance  
vs. Drain Current and Gate Voltage  
1.7  
1.5  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
V
= 4.5V  
= 5A  
GS  
I
1.3  
1.1  
0.9  
D
V
= 10V  
GS  
I
= 10A  
V
= 4.5V  
= 5A  
D
GS  
I
D
V
= 10V  
GS  
I
= 10A  
D
0.7  
0.5  
0.01  
0
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (°C)  
T

J

, JUNCTION TEMPERATURE (°C)  
Fig. 6 On-Resistance Variation with
T
e
mperature  
Fig. 5 On-Resistance Variation with
T
emperature  
20  
18  
16  
14  
12  
2.0  
1.6  
I
= 1mA  
D
I
= 250µA  
D
1.2  
0.8  
10  
T
= 25°C  
A
8
6
4
0.4  
0
2
0
-50 -25  
0
25  
50  
75 100 125
 
150  
0.2  
0.4  
0.6  
0.8  
1
1.2  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient
T
e
mperature  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
3 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3  

NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
1,000  
100  
10  
10,000  
T
= 150°C  
= 125°C  
A
C
1,000  
iss  
T
A
100  
C
oss  
T
= 85°C  
= 25°C  
A
C
rss  
10  
1
T
A
f = 1MHz  
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 9 Typical Capacitance  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 10 Typical Drain-Source Leakage Current  
vs. Drain-Source Voltage  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
D = 0.02  
R
(t) = r(t) * R  
θ
JA  
θ
JA  
R
= 120°C/W  
θ
JA  
0.01  
D = 0.01  
P(pk)  
T
t
1
D = 0.005  
t
2
– T
 
= P * R
 
(t)  
J
A
θ
JA  
Duty Cycle, D = t
 
/t  
1
2
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t

1

, PULSE DUR
A
T
ION TIME (s)  
Fig. 11 Transient Thermal Response  
Ordering Information
 
(Note 7)  
Part Number  
Case  
Packaging  
DMG6402LDM-7  
SOT-26  
3000/Tape & Reel  
Notes:  
7. For
 
packaging details, go to our website at

Marking Information  
34N= Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: V = 2008)  
34N  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
V
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
4 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3  

NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
Package Outline Dimensions  
A
SOT-26  
Dim Min Max
 
Typ  
A
B
C
D
H
J
K
L
M
0.35 0.50
 
0.38  
1.50 1.70
 
1.60  
2.70 3.00
 
2.80  
B
C
0.95  
⎯
⎯
2.90 3.10
 
3.00  
0.013 0.10 0.05  
1.00 1.30
 
1.10  
0.35 0.55
 
0.40  
0.10 0.20
 
0.15  
H
K
J
M
0°  
8°  
α
⎯
L
D
All Dimensions in mm  
Suggested Pad Layout  
E
E
Dimensions Value
 
(in mm)  
Z
G
X
Y
C
E
3.20  
1.60  
0.55  
0.80  
2.40  
0.95  
C
G
Z
Y
X
5 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3  

NOT RECOMMENDED FOR NEW DESIGN  
USE DMG6402LVT  
DMG6402LDM  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause  
the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2009, Diodes Incorporated  
6 of 6  
December 2012  
© Diodes Incorporated  
DMG6402LDM  
Document number: DS31839 Rev. 4 – 3