Diodes-Incorporated-DMN1014UFDF-7

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Diodes-Incorporated-DMN1014UFDF-7
DMN1014UFDF  
12V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
0.6mm Profile
–
Ideal for Low Profile Applications  
PCB Footprint of 4mm

2  

Low Gate Threshold Voltage  
Fast Switching Speed  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

A

= +25°C  
16
mΩ
@ V

GS

= 4.5V  
25
mΩ
@ V

GS

= 2.5V  
8.0A  
6.5A  
12V  
Description  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Mechanical Data  
Case: U-DFN2020-6 (Type F)  
Case Material: Molded Plastic, ―Green‖ Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish
–
NiPdAu over Copper Leadframe. Solderable  
Applications  
e4  
per MIL-STD-202, Method 208  
Battery Management Application  
Power Management Functions  
DC-DC Converters  
Weight: 0.0065 grams (Approximate)  
D
U-DFN2020-6  
(Type F)  
G
S
Pin Out  
Top View  
Bottom View  
Bottom View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
DMN1014UFDF-7  
DMN1014UFDF-13  
Reel Size (inches)  
Case  
Quantity per Reel  
3,000  
7
13  
U-DFN2020-6 (Type F)  
U-DFN2020-6 (Type F)  
10,000  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and
 
Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-
free “Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
14 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: F = 2018)  
M = Month (ex: 9 = September)  
14  
Date Code Key  
Year  
2016  
2017  
2018  
2019  
2020  
2021  
2022  
2023  
Code  
D
E
F
G
H
I
J
K
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
12  
Unit  
V
Gate-Source Voltage  
±8  
V
V

GSS  

Steady  
State  
T

A

= +25°C  
T

A

= +70°C  
8
6
A
Continuous Drain Current, V

GS

= 4.5V (Note 6)  
I

D  

Pulsed Drain Current (380
μ
s Pulse, Duty Cycle = 1%)  
40  
2.1  
40  
A
A
I

DM  

I

S  

Continuous Source-Drain Diode Current (Note 6)  
T

A

= +25°C  
Pulsed Source-Drain Diode Current (380
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.1mH (Note 7)  
A
I

SM  

I

AS  

E

AS  

10.8  
5.8  
A
Avalanche Energy, L = 0.1mH (Note 7)  
mJ  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
0.7  
Unit  
W
T

A

= +25°C  
Total Power Dissipation (Note 5)  
P

D  

R

θ
JA  

P

D  

0.4  
177  
T

A

= +70°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
1.7  
T

A

= +25°C  
T

A

= +70°C  
Steady State  
1.0  
Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
76  
°C/W  
°C/W  
°C  
R

θ
JA  

R

θ
JC  

15.5  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
12  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μA  
V

DS

= 9.6V, V

GS

= 0V  
V

GS

= ±8V, V

DS

= 0V  
µA  
nA  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
±100  
I

GSS  

ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
0.3  
—
—
12  
1.0  
16  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 4.5V, I

D

= 2A  
V

GS

= 2.5V, I

D

= 2A  
V

GS

= 0V, I

S

= 2A  
Static Drain-Source On-Resistance  
16  
25  
—
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
0.72  
1.2  
—
—
—
—
—
—
—
—
—
—
—
—
—
515  
155  
121  
2.4  
6.4  
0.3  
1.9  
3.0  
3.6  
12.4  
4.4  
9.5  
1.7  
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 6V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
V

DS

= 6V, I

D

= 2A  
Total Gate Charge (V

GS

= 4.5V)  
Gate-Source Charge  
Q

g  

nC  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
V

DS

= 6V, V

GS

= 4.5V,  
R

g

= 2
Ω
, I

D

= 2A  
ns  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
t

RR  

I

F

= 2A, di/dt = 200A/
μ
s  
I

F

= 2A, di/dt = 200A/
μ
s  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
2 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
10  
8
V

GS

= 2.5V  
V

GS

= 3.0V  
V

GS

= 4.0V  
V

DS

= 5V  
V

GS

= 4.0V  
6
V

GS

= 2.0V  
V

GS

= 1.7V  
4
125
℃  
V

GS

=1.5V  
V

GS

= 1.4V  
V

GS

= 1.3V  
V

GS

= 1.2V  
85
℃  
25
℃  
2
150
℃  
-55
℃  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
0
0.5  
1
1.5  
2
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.025  
0.02  
0.015  
0.01  
0.005  
0
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
V

GS

= 2.50V  
V

GS

= 4.50V  
I

D

= 2.0A  
0
5
10  
15  
20  
0
2
4
6
8
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2
1.5  
1
0.021  
0.019  
0.017  
0.015  
0.013  
0.011  
0.009  
0.007  
0.005  
V

GS

= 4.5V  
150
℃  
V

GS

= 2.5V, I

D

= 5A  
125
℃  
85
℃  
25
℃  
V

GS

= 4.5V, I

D

= 10A  
0.5  
0
-55
℃  
1
2
3
4
5
6
7
8
9
10  
-50  
-25  
0
25  
50  
75  
100 125 150  
I

D

, DRAIN CURRENT (A)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
Figure 6. On-Resistance Variation with Junction  
Temperature  
3 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
1.2  
1
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
I

D

= 1mA  
V

GS

= 2.5V, I

D

= 5A  
0.8  
0.6  
0.4  
0.2  
0
I

D

= 250
μ
A  
V

GS

= 4.5V, I

D

= 10A  
-50  
-25  
0
25  
50  
75  
100 125 150  
-50 -25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Junction  
Temperature  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
100000  
10000  
1000  
100  
15  
12  
9
f=1MHz  
V

GS

= 0V  
150
℃  
125
℃  
85
℃  
6
T

J

= 85
℃  
10  
T

J

= 125
℃  
T

J

= 25
℃  
25
℃  
3
1
T

J

= 150
℃  
T

J

= -55
℃  
0
0.1  
0
0.3  
0.6  
0.9  
1.2  
1.5  
1
2
3
4
5
6
7
8
9
10 11 12  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
Figure 10. Typical Drain-Source Leakge Current vs Voltage  
100  
10  
4.5  
4
R

DS(ON)

Limited  
P

W

=100µs  
3.5  
3
2.5  
2
1
P

W

=1ms  
P

W

=10ms  
P

W

=100ms  
P

W

=1s  
1.5  
1
0.1  
0.01  
V

DS

= 6V, I

D

= 2A  
T

J(Max)

= 150
℃
T

C

= 25
℃  
Single Pulse  
DUT on 1*MRP Board  
V

GS

= 10V  
P

W

=10s  
0.5  
0
DC  
0
1
2
3
4
5
6
7
0.01  
0.1  
1
10  
100  
Qg (nC)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
500  
400  
300  
200  
100  
0
Single Pulse  
R

θ
JA

= 174
℃
/W  
R

θ
JA

(t)=R

θ
JA

* r(t)  
T

J

-T

A

=P * R

θ
JA

(t)  
0.00001 0.0001  
0.001  
0.01  
t

1

, PULSE DURATION TIME (sec)  
Figure 13. Single Pulse Maximum Power Dissipation  
0.1  
1
10  
100  
1000  
10000  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
0.01  
0.001  
D=0.005  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 174
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 14. Transient Thermal Resistance  
5 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
Package Outline Dimensions  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
Min Max  
0.57
0.63  
0.00 0.05  
A3  
A1  
A
Dim  
A
A1  
A3  
b
Typ  
0.60
  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
Seating Plane  
–
–
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a
0.33 0.43  
E
E2  
E2a  
e
e2  
e3  
e4  
k
1.95 2.05  
1.05 1.25  
0.65 0.75  
D2a  
E2a  
z2  
0.65 BSC  
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
0.15 BSC  
D2  
E
E2  
k1  
k1  
k2  
L
e2  
L
k
0.36 BSC  
0.225 0.325
 
0.275  
0.20 BSC  
z1  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
z( 4x)  
All Dimensions in mm  
Suggested Pad Layout  
U-DFN2020-6 (Type F)  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
C
X
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
6 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

DMN1014UFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
7 of 7  
June 2018  
© Diodes Incorporated  
DMN1014UFDF  
D
atasheet number: DS39825 Rev. 2 – 2  

Mouser Electronics  
Authorized Distributor  
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