Diodes-Incorporated-DMN10H220LFDF-13

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Diodes-Incorporated-DMN10H220LFDF-13
DMN10H220LFDF  
100V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
100% Unclamped Inductive Switch (UIS) Test in Production  
Low On-Resistance  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change  
control (i.e. parts qualified to AEC-Q100/101/200, PPAP  
capable, and manufactured in IATF 16949 certified facilities),  
please

or your local Diodes representative.  
I

D

Max  
T

A

= +25°C  
2.2A  
BV

DSS  

R

DS(ON)

Max  
225m
Ω
@ V

GS

= 10V  
290
mΩ @ V

GS

= 4.5V  
100V  
1.9A  
Mechanical Data  
Description and Applications  
Case: U-DFN2020-6  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) and yet maintain superior switching performance,  
making it ideal for high-efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish
–
NiPdAu over Copper Leadframe. Solderable  
per MIL-STD-202, Method 208  
Weight: 0.0065 grams (Approximate)  
Load Switch  
e4  
U-DFN2020-6 (Type F)  
D
G
Pin1  
S
Pin Out  
Bottom View  
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
Case  
Quantity Per Reel  
DMN10H220LFDF-7  
DMN10H220LFDF-13  
U-DFN2020-6
(Type F)  
U-DFN2020-6
(Type F)  
3,000  
10,000  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
U-DFN2020-6 (Type F)  
22 = Product Type Marking Code  
YWX = Date Code Marking  
Y = Year (ex: 0 = 2020)  
22  
W = Week (ex: a = Week 27; z Represents Week 52 and 53)  
X = Internal Code (ex: U = Monday)  
Date Code Key  
Year  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
2030  
Code  
G
H
I
J
K
L
M
N
O
P
R
S
Week  
Code  
1-26  
27-52  
a-z  
53  
A-Z  
z
Internal Code  
Code  
Sun  
T
Mon  
U
Tue  
V
Wed  
W
Thu  
X
Fri  
Y
Sat  
Z
1 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
100  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
T

A

= +70°C  
2.2  
1.7  
A
Continuous Drain Current (Note 6) V

GS

= 10V  
I

D  

Maximum Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Pulsed Source Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 9)  
2.2  
8.8  
8.8  
4.7  
1.1  
A
A
I

S  

I

DM  

I

SM  

I

AS  

E

AS  

A
L = 0.1mH  
L = 0.1mH  
A
Avalanche Energy (Note 9)  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
P

D  

Value  
1.1  
0.7  
Unit  
W
T

A

= +25°C  
Total Power Dissipation (Note 5)  
T

A

= +70°C  
110  
1.6  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
R

JA  

P

D  

T

A

= +25°C  
T

A

= +70°C  
1.0  
Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
80  
12  
R

JA  

R

JC  

°C/W  
°C  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
100  
V
BV

DSS  

I

DSS  

1
V

GS

= 0V, I

D

= 250µA  
V

DS

= 100V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
µA  
nA  
100  
I

GSS  

  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1
2.5  
225  
290  
1.3  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10V, I

D

= 2A  
V

GS

= 4.5V, I

D

= 1A  
V

GS

= 0V, I

S

= 2A  
174  
217  
0.8  
m
Ω  
m
Ω  
V
  
Static Drain-Source On-Resistance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
384  
23  
C

iss  

C

oss  

C

rss  

R

G  

  
  
  
  
  
  
  
  
  
  
V

DS

= 25V, f = 1MHz,  
V

GS

= 0V  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
17  
2.4  
3.7  
6.7  
1.3  
2
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

Q

g  

nC  
ns  
V

DD

= 50V, I

D

= 1.6A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
6.2  
8.7  
7.4  
4.2  
20  
Turn-On Rise Time  
V

DD

= 50V, V

GS

= 4.5V,  
Turn-Off Delay Time  
R

G

= 6.8
Ω
, I

D

= 1.0A  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
t

RR  

I

S

= 1.1A, dI/dt = 100A/
μ
s  
11  
n
C  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
2 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
8.0  
6.0  
4.0  
2.0  
0.0  
8
6
4
2
0
V

GS

= 8.0V  
V

GS

= 10.0V  
V

DS

= 10V  
V

GS

= 4.5V  
V

GS

= 6.0V  
V

GS

= 4.0V  
T

J

= 125
℃
 
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= -55
℃  
T

J

= 150
℃  
V

GS

= 3.5V  
2.5 3  
0
0.5  
1
1.5  
2
1
1.5  
2
2.5  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
3
3.5  
4
4.5  
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
0.3  
0.25  
0.2  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
V

GS

= 4.5V  
0.15  
0.1  
V

GS

= 10V  
I

D

= 6.0A  
0.05  
0
2
4
6
8
10 12 14 16 18 20  
1
2
3
4
5
6
V

GS

, GATE-SOURCE VOLTAGE (V)  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2.4  
2.2  
2
0.5  
0.45  
0.4  
V

GS

= 10V  
T

J

= 150
℃  
1.8  
1.6  
1.4  
1.2  
1
0.35  
0.3  
V

GS

= 10V, I

D

= 2A  
T

J

= 125
℃  
T

J

= 85
℃  
0.25  
0.2  
0.15  
0.1  
T

J

= 25
℃  
T

J

= -55
℃  
V

GS

= 4.5V, I

D

= 1A  
0.8  
0.6  
0.4  
0.05  
0
0
1
2
3
4
5
6
-50  
-25  
0
25  
50  
75  
100 125 150  
I

D

, DRAIN CURRENT (A)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Junction  
Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
3 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
3
2.8  
2.6  
2.4  
2.2  
2
0.4  
0.35  
0.3  
I

D

= 1mA  
V

GS

= 4.5V, I

D

= 1A  
0.25  
0.2  
1.8  
1.6  
1.4  
1.2  
1
I

D

= 250
μ
A  
0.15  
0.1  
V

GS

= 10V, I

D

= 2A  
0.8  
0.6  
0.4  
0.05  
0
-50  
-25  
0
25  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
Figure 7. On-Resistance Variation with Junction  
Temperature  
8
6
4
2
0
10000  
1000  
100  
10  
f = 1MHz  
V

GS

= 0V  
C

iss  

T

J

= 85

o

C  
T

J

= 25

o

C  
T

J

= -55

o

C  
C

oss  

T

J

= 150

o

C  
T

J

= 125

o

C  
C

rss  

1
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
20  
40  
60  
80  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
Figure 10. Typical Junction Capacitance  
100  
10  
10  
8
R

DS(ON)

Limited  
P

W

= 100ms  
P

W

= 10ms  
P

W

= 1ms  
P

W

= 100µs  
1
6
P

W

= 1s  
0.1  
4
T

J(Max)

= 150
℃
 
T

C

= 25
℃
 
Single Pulse  
DUT on 1*MRP  
board  
V

DS

= 50V, I

D

= 1.6A  
P

W

= 10s  
0.01  
0.001  
2
DC  
V

GS

= 10V  
0
0.1  
1
10  
100  
1000  
0
2
4
6
8
Q

g

(nC)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
1
D=0.9  
D=0.5  
D=0.3  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
D=Single Pulse  
0.01  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 100.7
℃
/W  
Duty Cycle, D = t1/t2  
0.001  
1E-05 0.0001 0.001  
0.01  
0.1  
1
10  
100  
1000 10000
 
100000 1000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
Package Outline Dimensions  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
Min Max  
0.57
0.63  
0.00 0.05  
A3  
A1  
A
Dim  
A
A1  
A3  
b
Typ  
0.60
  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
Seating Plane  
–
–
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a
0.33 0.43  
E
E2  
E2a  
e
e2  
e3  
e4  
k
1.95 2.05  
1.05 1.25  
0.65 0.75  
D2a  
E2a  
0.65 BSC  
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
0.15 BSC  
z2  
D2  
E
E2  
k1  
k1  
k2  
L
e2  
L
k
0.36 BSC  
0.225 0.325
 
0.275  
0.20 BSC  
z1  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
z(4x)  
All Dimensions in mm  
Suggested Pad Layout  
U-DFN2020-6 (Type F)  
X3  
Y
Value  
C
X
Dimensions  
(in mm)  
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
C
X
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
6 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

DMN10H220LFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
February 2020  
© Diodes Incorporated  
DMN10H220LFDF  
D
atasheet number: DS42084
 
Rev. 2 – 2  

Mouser Electronics  
Authorized Distributor  
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