Diodes-Incorporated-DMN2041UFDB-7

Part #Diodes-Incorporated-DMN2041UFDB-7
Download 
Diodes-Incorporated-DMN2041UFDB-7
DMN2041UFDB  
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Low On-Resistance  
I

D MAX  

T

A

= +25°C  
4.7A  
Device  
BV

DSS  

R

DS(ON) MAX  

Low Input Capacitance  
40m
Ω @ V

GS

= 4.5V  
65m
Ω @ V

GS

= 2.5V  
Low Profile, 0.6mm Max Height  
N-Channel  
20V  
3.7A  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
Description  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Mechanical Data  
Applications  
Case: U-DFN2020-6  
Load Switch  
Case Material:
Molded Plastic, “Green” Molding Compound
;  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe; Solderable per  
MIL-STD-202, Method 208
e4  
Power Management Functions  
Portable Power Adaptors  
Terminal Connections: See Diagram Below  
Weight: 0.0065 grams (Approximate)  
U-DFN2020-6 (Type B)  
D2  
D1  
S2  
G2  
D2  
G2  
G1  
D1  
D1  
D2  
ESD PROTECTED  
G1  
Gate Protection  
Diode  
Gate Protection  
Diode  
S2  
S1  
S1  
Pin1  
Q1 N-CHANNEL  
Q2 N-CHANNEL  
Bottom View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
DMN2041UFDB
-7  
DMN2041UFDB
-13  
Case  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
U-DFN2020-6 (Type B)  
U-DFN2020-6 (Type B)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm b
romine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
1 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
Marking Information  
Site 1  
U-DFN2020-6 (Type B)  
D7 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: H = 2020)  
D7  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2014  
…
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
Code  
B
…
H
I
J
K
L
M
N
O
P
R
Aug  
Sep  
Oct  
Nov  
Dec  
Month  
Code  
Jan  
Feb  
Mar  
Apr  
May  
Jun  
Jul  
8
9
O
N
D
1
2
3
4
5
6
7
Site 2  
D7 = Product Type Marking Code  
YWX = Date Code Marking  
Y = Year (ex: 0 = 2020)  
D7  
W = Week (ex: a = week 27; z represents week 52 and 53)  
X = Internal Code (ex: U = Monday)  
Date Code Key  
Year  
2014  
4
…
…
2020  
0
2021  
1
2022  
2
2023  
3
2024  
4
2025  
5
2026  
6
2027  
7
2028  
8
2029  
9
Code  
Week  
Code  
1-26  
27-52  
53  
A-Z  
a-z  
z
Internal Code  
Code  
Sun  
Mon  
Tue  
Wed  
Thu  
Fri  
Sat  
T
U
V
W
X
Y
Z
2 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
20  
Unit  
V
Gate-Source Voltage  
±12  
V
V

GSS  

Steady  
State  
4.7  
3.8  
T

A

= +25°C  
T

A

= +70°C  
A
A
I

D  

I

D  

Continuous Drain Current (Note 5) V

GS

= 4.5V  
6.1  
4.9  
T

A

= +25°C  
T

A

= +70°C  
t < 5s  
Maximum Continuous Body Diode Forward Current (Note 5)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
2
A
A
I

S  

20  
I

DM  

Thermal Characteristics  
Characteristic  
Symbol  
Value  
Unit  
Steady State  
1.4  
2.2  
92  
Total Power Dissipation (Note 5)  
W
P

D  

t < 5s  
Steady State  
t < 5s  
Thermal Resistance, Junction to Ambient (Note 5)  
R

JA  

55  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 5)  
Operating and Storage Temperature Range  
30  
R

JC  

-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 6)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
20  
—
—
—
—
—
—
1.0  
±10  
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250μA  
V

DS

= 20V, V

GS

= 0V  
V

GS

= ±8V, V

DS

= 0V  
μA  
μA  
I

GSS  

ON CHARACTERISTICS (Note 6)  
Gate Threshold Voltage  
0.35  
—
—
23  
1.4  
40  
V
mΩ  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 4.5V, I

D

= 4.2A  
V

GS

= 2.5V, I

D

= 3.3A  
V

GS

= 0V, I

S

= 4.4A  
Static Drain-Source On-Resistance  
—
26  
65  
Diode Forward Voltage  
—
0.75  
1.2  
DYNAMIC CHARACTERISTICS
 
(Note 7)  
Input Capacitance  
—
—
—
—
—
—
713  
80  
68  
15  
8
—
—
—
—
—
—
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 10V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
V

DS

= 10V, I

D

= 5.5A  
nC  
nC  
Total Gate Charge (V

GS

= 4.5V)  
Q

g  

15  
Total Gate Charge (V

GS

= 8V)  
Gate-Source Charge  
—
—
—
—
—
—
—
1.0  
1.1  
—
—
—
—
—
—
—
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
3.6  
Turn-On Rise Time  
15.9  
16.0  
2.6  
V

DD

= 10V, V

GS

= 4.5V,  
Turn-Off Delay Time  
R

L

= 2.3
Ω, R

G

= 1
Ω  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
6.6  
t

RR  

I

S

= 4.4A, dI/dt = 100A/
μ
s  
I

S

= 4.4A, dI/dt = 100A/
μ
s  
—
1.2  
—
Q

RR  

Notes:  
5.
Device mounted on 1” x 1” FR
-4 PCB with high coverage 2oz. Copper, single sided.  
6. Short duration pulse test used to minimize self-heating effect.  
7. Guaranteed by design. Not subject to product testing.  
3 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
20  
18  
16  
14  
12  
10  
8
20  
18  
16  
14  
12  
10  
8
V
= 8.0V  
GS  
V
= 5.0V  
DS  
V
= 4.5V  
GS  
V
= 1.5V  
GS  
V
= 3.0V  
GS  
V
= 2.5V  
GS  
V
= 2.0V  
GS  
6
6
T =
 
150°C  
A
T
= 85°C  
4
4
A
T
= 25°C  
A
V
= 1.0V  
T
= 125°C  
GS  
A
2
2
T
= -55°C  
A
0
0
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
Figure 1 Typical Output Characteristics  
0.03  
0.029  
0.028  
0.027  
0.026  
0.025  
0.024  
0.023  
0.022  
0.021  
0.02  
0.04  
0.035  
0.03  
V
= 4.5V  
GS  
T
= 150°C  
A
T
= 125°C  
A
V
= 2.5V  
GS  
T
= 85°C  
A
V
= 4.5V  
GS  
T
= 25°C  
0.025  
0.02  
A
T
= -55°C  
A
0.015  
0
2
4
6
8
10 12 14 16 18 20  
0
2
4
6
8
10 12 14 16 18 20  
I

D

, DRAIN-SOURCE CURRENT (A)  
I

D

, DRAIN CURRENT (A)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Figure 4 Typical On-Resistance vs.  
Drain Current and Temperature  
1.8  
1.6  
1.4  
1.2  
1
0.05  
0.04  
0.03  
0.02  
V
= 2.5V  
GS  
I
= 3.3A  
D
V
= 2.5V  
GS  
= 3.3A  
I
D
V
= 4.5V  
GS  
I
= 4.2A  
D
V
= 4.5V  
GS  
= 4.2A  
I
D
0.8  
0.01  
0.6  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
Figure 5 On-Resistance Variation with
T
emperature  
Figure 6 On-Resistance Variation with
T
e
mperature  
4 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
20  
18  
16  
14  
12  
10  
8
1
0.8  
0.6  
0.4  
0.2  
0
I
= 1mA  
D
I
= 250µA  
D
6
T
= 85°C  
T
= 150°C  
A
A
4
T
= 25°C  
T
= 125°C  
A
A
2
T
= -55°C  
A
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
-50 -25  
0
25  
50  
75 100
 
125 150  
V

S
D

, SOURCE-DRAIN VOLTAGE (V)  
Figure 8 Diode Forward Voltage vs. Current  
T ,
 
JUNCTION TEMPERATURE (C)  
Figure 7 Gate Threshold Variation vs. Junction Temperature  
J
10000  
8
7
6
5
4
3
2
1
0
1000  
V
I
= 10V  
C
DS  
= 5.5A  
iss  
D
100  
10  
C
oss  
C
rss  
f =1MHz  
0
2
4
6
8
10  
12  
14  
16  
0
2
4
6
8
10 12 14 16 18 20  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 9 Typical Junction Capacitance  
Q

g

, TO
T
A
L GATE CHARGE (nC)  
Figure 10 Gate Charge  
100  
10  
R
DS(on)  
Limited  
DC  
P
= 10s  
W
1
P
= 1s  
W
P
= 100ms  
W
P
= 10ms  
W
0.1  
0.01  
P
= 1ms  
T
T
= 1
150°C  
W
J(max)  
=
25°C  
A
P
=
100µs  
V
= 4.5V  
W
GS  
Single Pulse  
DUT on 1 * MRP Board  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 11 SOA Safe Operation Area  
5 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
0.01  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
R

JA

(t) = r(t) * R

JA  

R

JA

= 1
Duty Cycle, D = t1/ t2  
163°C/W  
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
F
r
T
T
r
l
s
Figure 12 Transient Thermal Resistance  
6 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
Package Outline Dimensions  
U-DFN2020-6 (Type B)  
A3  
A1  
A
Seating Plane  
U-DFN2020-6  
Type B  
Dim  
A
A1  
A3  
b
D
D2  
e
Min  
Max Typ  
D
0.545 0.605 0.575  
0.00 0.05 0.02  
–
0.20 0.30 0.25  
1.95 2.075 2.00  
0.50 0.70 0.60  
D2  
D2  
–
0.13  
R
0
.150  
–
–
0.65  
z1  
E
E2  
k
1.95 2.075 2.00  
0.90 1.10 1.00  
E
E2  
z1  
–
–
0.45  
k
L
0.25 0.35 0.30  
z
z1  
–
–
–
–
0.225  
0.175  
L
All Dimensions in mm  
e
z
b
Suggested Pad Layout  
U-DFN2020-6 (Type B)  
X2  
C
Value  
Dimensions  
(in mm)  
C
G
G1  
X
X1  
X2  
Y
Y1  
Y2  
0.650  
0.150  
0.450  
0.350  
0.600  
1.650  
0.500  
1.000  
2.300  
X1(2x)  
Y1(2x)  
Y2  
G
Y
G1  
X
7 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2  

DMN2041UFDB  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
8 of 8  
February 2020  
© Diodes Incorporated  
DMN2041UFDB  
Document number: DS37421 Rev. 4 – 2