Diodes-Incorporated-DMN2230U-7

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Diodes-Incorporated-DMN2230U-7
DMN2230U  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Features  
Mechanical Data  
•
Low On-Resistance  
•
•
Case: SOT23  
Case Material: Molded Plastic, “Green” Molding  
Compound. UL
 
Flammability Classification Rating 94V-0  
Moisture Sensitivity:
 
Level 1 per J-STD-020  
Terminal Connections: See Diagram  
Terminals: Finish
⎯
Matte Tin annealed over Copper  
leadframe. Solderable
 
per MIL-STD-202, Method 208  
Weight: 0.008 grams (approximate)  
•
•
•
110 m
Ω
@ V

GS

= 4.5V  
145 m
Ω
@ V

GS

= 2.5V  
230 m
Ω
@ V

GS

= 1.8V  
•
•
•
•
•
•
•
Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Lead, Halogen and Antimony Free, RoHS Compliant  
“Green” Device (Notes 1, 2 and 3)  
•
•
Qualified to AEC-Q101 Standards for High Reliability  
SOT23  
D
G
S
Top View  
Internal Schematic  
Top View  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMN2230U-7  
SOT23  
3000/Tape & Reel  
Notes:  
1. No purposefully added lead. Halogen and Antimony Free.  
2. Diodes Inc.’s “Green” policy can be found on our webs

3. Product manufactured with Green Molding Compound and does not contain Halogens or Sb

2

O

3

Fire Retardants.  
4. For packaging details, go to our website at

Marking Information  
22N = Marking Code  
YM = Date Code Marking  
Y = Year (ex: U = 2007)  
M = Month (ex: 9 = September)  
22N  
Date Code Key  
Year  
2007  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
2016  
2017  
Code  
U
V
W
X
Y
Z
A
B
C
D
E
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 5  
January 2012  
© Diodes Incorporated  
DMN2230U  
Document number: DS31180 Rev. 5 – 2  

DMN2230U  
Maximum Ratings
@T

A

= 25°C unless otherwise specified  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

V

GSS  

I

D  

Value  
20  
Units  
V
V
A
A
Gate-Source Voltage  
±12  
2.0  
7
Drain Current (Note 5)  
Pulsed Drain Current (Note 6)  
I

DM  

Thermal Characteristics
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
Value  
600  
Units  
mW  
°C/W  
°C  
P

D  

Thermal Resistance, Junction to Ambient  
Operating and Storage Temperature Range  
208  
R

θ  

JA  
-55 to +150  
T

J

, T

STG  

Electrical Characteristics
@T

A

= 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Symbol Min  
Typ Max Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
20  
⎯
⎯
V
BV

DSS  

I

DSS  

⎯
⎯
⎯
⎯
1
V

GS

= 0V, I

D

= 10
μ
A  
μ
A V

DS

= 20V, V

GS

= 0V  
μ
A  
I

GSS  

±
10  
V

GS

=
±
12V, V

DS

= 0V  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
0.5  
1.0  
V
V

GS(th)  

⎯
V

DS

= V

CS

, I

D

= 250
μ
A  

GS

= 4.5V, I

D

= 2.5A  
V
81  
113  
170  
110  
145  
230  
Static Drain-Source On-Resistance  
R

DS (ON)  

⎯
m
Ω
V

GS

= 2.5V, I

D

= 1.5A  
V

GS

= 1.8V, I

D

= 1.0A  
Forward Transfer Admittance  
Diode Forward Voltage (Note 7)  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
5
S
V
|Y

fs

|  
V

SD  

⎯
⎯
⎯
1.1  
V

DS

= 5V, I

D

= 2.4A  
V

GS

= 0V, I

S

= 1.05A  
0.8  
188  
44  
pF  
pF  
pF  
nC  
nC  
nC  
C

iss  

C

oss  

C

rss  

Q

g  

⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
V

DS

= 10V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
30  
2.3  
0.3  
0.5  
8
Gate-Source Charge  
Gate-Drain Charge  
Q

gs  

Q

gd  

t

d(on)  

t

r  

V

DS

= 10V, I

D

= 11.6A  
Turn-On Delay Time  
Rise Time  
3.8  
19.6  
8.3  
V

DD

= 10V, R

L

= 10
Ω  
I

D

= 1A, V

GEN

= 4.5V, R

G

= 6
Ω  
ns  
Turn-Off Delay Time  
Fall Time  
t

d(off)  

t

f  

Notes:  
5. Device mounted on FR-4 PCB, or minimum recommended pad layout  
6. Repetitive rating, pulse width limited by junction temperature.  
7. Short duration pulse test used to minimize self-heating effect.  
2 of 5  
January 2012  
© Diodes Incorporated  
DMN2230U  
Document number: DS31180 Rev. 5 – 2  

DMN2230U  
10  
8
8
7
6
5
4
3
2
6
4
2
0
1
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
1.8  
1.6  
1.4  
1.2  
1
1
V
= 2.5V  
GS  
I
= 1.5A  
D
V
= 4.5V  
GS  
I
= 2.5A  
D
V
= 1.8V  
GS  
V
= 2.5V  
= 4.5V  
0.1  
GS  
V
GS  
V
= 1.8V  
GS  
I
= 1.0A  
D
0.8  
0.6  
0.01  
0.01  
0.1  
1
10  
-50 -25  
0
25  
50  
75  
100 125 150  
I

D

, DRAIN-SOURCE CURRENT  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 4 Normalized Static Drain-Source On-Resistance  
vs. Ambient
T
emperature  
Fig. 3 On-Resistance
 
vs.  
Drain-Source Current & Gate Voltage  
1,000  
100  
10  
1
f = 1MHz  
I
= 250µA  
0.8  
D
0.6  
C
iss  
0.4  
0.2  
0
C
oss  
C
rss  
0
2
4
6
8
10 12
 
14 16 18 20  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
-50 -25  
T

A

, AMBIENT TEMPERATURE (C)  
Fig. 5 Gate Threshold Variation with
T
e
mperature  
0
25  
50  
75 100
 
125 150  
Fig. 6 Typical
T
o
tal Capacitance  
3 of 5  
January 2012  
© Diodes Incorporated  
DMN2230U  
Document number: DS31180 Rev. 5 – 2  

DMN2230U  
10  
1
10  
8
V
I
= 10V  
DS  
= 11.6A  
D
0.1  
0.01  
6
4
0.001  
0.0001  
2
0
0
1
2
3
4
5
0.1 0.2
 
0.3 0.4 0.5 0.6 0.7 0.8 0.9  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Fig. 7 Reverse Drain Current vs. Source-Drain Voltage  
1
Q

g

, TOTAL GATE CHARGE
 
(nC)  
Fig. 8 Gate Charge  
100  
R
DS(on)  
Limited  
10  
1
P
= 10µs  
W
DC  
P
= 10s  
W
P
= 1s  
W
P
= 100ms  
W
P
= 10ms  
W
P
= 1ms  
W
0.1  
P
= 100µs  
T
T
= 150°C  
W
J(max)  
= 25°C  
A
Single Pulse  
DUT on 1 * MRP Board  
= 12V  
V
GS  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Fig. 9 SOA, Safe Operation Area  
Package Outline Dimensions  
SOT23  
A
Dim  
A
B
C
D
F
G
H
J
K
Min  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.013 0.10  
0.903 1.10  
–
0.45  
0.085 0.18  
0° 8°  
Max  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
Typ  
0.40  
1.30  
2.40  
C
B
2.05  
3.00  
1.83  
2.90  
0.05  
1.00  
0.400  
0.55  
0.11  
–
H
G
M
K
J
K1  
K1  
L
M
–
D
0.61  
F
L
α
All Dimensions in mm  
4 of 5  
January 2012  
© Diodes Incorporated  
DMN2230U  
Document number: DS31180 Rev. 5 – 2  

DMN2230U  
Suggested Pad Layout  
Y
Dimensions Value
 
(in mm)  
Z
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
C
E
X
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2012, Diodes Incorporated  
5 of 5  
January 2012  
© Diodes Incorporated  
DMN2230U  
Document number: DS31180 Rev. 5 – 2