Diodes-Incorporated-DMN3033LSNQ-13

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Diodes-Incorporated-DMN3033LSNQ-13
DMN3033LSN  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Features  
Mechanical Data  
•
•
Low Gate Charge  
Low R

DS(ON)  

•
•
Case: SC59  
:
Case Material – Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish – Matte Tin Annealed over Copper Leadframe.  
•
•
30m
Ω
@V

GS

= 10V  
40m
Ω
@V

GS

= 4.5V  
•
•
•
•
•
•
Low Input/Output Leakage  
e3  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Weight: 0.014 grams (Approximate)  
•
•
Drain  
D
SC59  
Gate  
S
G
Source  
Top View  
Equivalent Circuit  
Pin Configuration  
Ordering Information
 
(Note 4)  
Part Number  
Case  
Packaging  
DMN3033LSN-7  
SC59  
3000/Tape & Reel  
Notes:  
1
. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. Se

r more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

.
Marking Information  
A5 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: D = 2016)  
A5  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2007  
~
2016  
2017  
2018  
2019  
2020  
2021  
2022  
Code  
U
~
D
E
F
G
H
I
J
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 5  
July 2016  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 7 – 2  

DMN3033LSN  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
30  
Unit  
V
Gate-Source Voltage  
V
±
20  
V

GSS  

Continuous Drain Current (Note 5)  
T

A

= +25°C  
T

A

= +70°C  
6
5
A
I

D  

Pulsed Drain Current (Note 6)  
24  
A
A
I

DM  

I

S  

Body-Diode Continuous Current (Note 5)  
2.25  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

R

θ  

Value  
1.4  
Unit  
W
Thermal Resistance, Junction to Ambient (Note 5) t
≤10s  
90  
°
C/W  
°
C  
JA  
Operating and Storage Temperature Range  
-55 to +150  
T

J

, T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
STATIC PARAMETERS  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
30  
V
BV

DSS  

I

DSS  

1
5
I

D

= 250
µ
A, V

GS

= 0V  
T

J

= +25
°
C  
T

J

= +55
°
C  
µ
A  
V

DS

= 30V, V

GS

= 0V  
Gate-Body Leakage Current  
Gate Threshold Voltage  
nA  
V
1.0  
25  
36  
±
100  
2.1  
I

GSS  

V

DS

= 0V, V

GS

=
±
20V  
V

DS

= V

GS

, I

D

= 250
µ
A  
V

GS

= 10V, I

D

= 6A  
V

GS

= 4.5V, I

D

= 5A  
V

DS

= 10V, I

D

= 8A  
I

S

= 2.25A, V

GS

= 0V  
V

GS(TH)  

30  
40  
Static Drain-Source On-Resistance (Note 7)  
m
Ω  
R

DS(ON)  

Forward Transconductance (Note 7)  
Diode Forward Voltage (Note 7)  
DYNAMIC PARAMETERS (Note 8)  
Total Gate Charge  
5
S
V
g

FS  

1.1  
0.7  
V

SD  

10.5  
3.8  
2.9  
11  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
Q

g  

Q

gs  

Q

gd  

t

D(ON)  

t

R  

V

GS

= 5V, V

DS

= 15V, I

D

= 6A  
V

GS

= 10V, V

DS

= 15V, I

D

= 6A  
V

GS

= 10V, V

DS

= 15V, I

D

= 6A  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
7
V

DD

= 15V, V

GS

= 10V,  
R

D

= 1.8
Ω
, R

G

= 6
Ω  
Turn-Off Delay Time  
63  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
30  
Input Capacitance  
755  
136  
108  
C

iss  

C

oss  

C

rss  

V

DS

= 10V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Notes:  
5. Device mounted on 1″x1″, FR-4 PC board with 2 oz. Copper and test pulse width t
≤
10s.  
6. Repetitive Rating, pulse width limited by junction temperature.  
7. Test pulse width t = 300ms.  
8. Guaranteed by design.
 
Not subject to production testing.  
2 of 5  
July 2016  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 7 – 2  

DMN3033LSN  
20  
18  
16  
V
= 5V  
DS  
Pulsed  
14  
12  
10  
8
6
4
2
0
0
1
2
3
4
0.06  
0.05  
1,200  
1,000  
f = 1 MHz  
V
= 0V  
GS  
800  
600  
C
iss  
0.04  
0.03  
V
= 4.5V  
GS  
400  
V
= 10V  
GS  
0.02  
0.01  
200  
0
C
oss  
C
rss  
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
10 12 14 16 18 20  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
I

D

, DRAIN CURRENT (A)  
Fig. 4
 
Typical
T
o
tal Capacitance  
Fig. 3
 
On-Resistance vs. Drain Current and Gate Voltage  
2
V
= 10V  
= 6A  
GS  
I
1.5  
1
D
V
= 4.5V  
= 5A  
GS  
I
D
0.5  
0
-50 -25  
0
25  
50  
75 100 125
 
150  
(

o

C)  
T

A

, AMBIENT TEMPERATURE
Fig. 6 Normalized Static Drain-Source On-Resistance  
vs. Ambient
T
emperature  
3 of 5  
July 2016  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 7 – 2  

DMN3033LSN  
Package Outline Dimensions  
Please see

the latest version.  
SC59  
Min  
0.35  
1.50  
2.70  
–
A
Dim  
A
B
C
D
G
H
J
K
L
Max  
0.50  
1.70  
3.00  
–
Typ  
0.38  
1.60  
2.80  
0.95  
1.90  
3.00  
0.05  
1.10  
0.40  
0.15  
0.75  
–
C
B
–
–
G
H
2.90  
3.10  
0.013 0.10  
1.00  
0.35  
0.10  
0.70  
0°  
1.30  
0.55  
0.20  
0.80  
8°  
K
J
M
N
M
N
α
L
D
All Dimensions in mm  
Suggested Pad Layout  
Please see

the latest version.  
Dimensions Value
 
(in mm)  
Y
Z
X
Y
C
E
3.4  
0.8  
1.0  
2.4  
1.35  
Z
C
X
E
4 of 5  
July 2016  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 7 – 2  

DMN3033LSN  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference.
 
Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2016, Diodes Incorporated  
5 of 5  
July 2016  
© Diodes Incorporated  
DMN3033LSN  
Document number: DS31116 Rev. 7 – 2