Diodes-Incorporated-DMN32D2LV-7

Part #Diodes-Incorporated-DMN32D2LV-7
Download 
Diodes-Incorporated-DMN32D2LV-7
DMN32D2LV  
DUAL N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR  
Features  
Mechanical Data  
Dual N-Channel MOSFET  
Case: SOT563  
Low On-Resistance  
Case Material:
Molded Plastic, “Green” Molding
Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections: See Diagram  
Very Low Gate Threshold Voltage, 1.2V max  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Terminals: Finish
–
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.006 grams (Approximate)  
Ultra-Small Surface Mount Package  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
SOT563  
D

2  

G

1  

S

1  

S

2  

G

2  

D

1  

Top View  
Schematic and Transistor Diagram  
Top View  
ES
D
P
ROTECTED  
Ordering Information
(Note 4)  
Part Number  
DMN32D2LV-7  
Case  
SOT563  
Packaging  
3,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br
+ Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
SOT563  
G
S
1
D
2
1
DV = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: U = 2007)  
DV YM  
M = Month (ex: 9 = September)  
S
G
2
D
2
1
Date Code Key  
Year  
2007  
—  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
2021  
Code  
U
—  
B
C
D
E
F
G
H
I
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2  

DMN32D2LV  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain Source Voltage  
Symbol  
V

DSS  

V

GSS  

I

D  

Value  
30  
Unit  
V
Gate-Source Voltage  
V
10  
400  
Drain Current (Note 5)  
mA  
Thermal Characteristics  
Total Power Dissipation (Note 5)  
450  
313  
mW  
°C/W  
°C  
P

D  

Thermal Resistance, Junction to Ambient (Note 5)  
Operating and Storage Temperature Range  
R

θ
JA  

-55 to +150  
T

J

, T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 6)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
30  
V
  
  
1  
1
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μ
A  
V

DS

= 30V, V

GS

= 0V  
V

GS

= ±10V, V

DS

= 0V  
V

GS

= ±5V, V

DS

= 0V  
V

GS

= ±2.5V, V

DS

= 0V  
μ
A  
@T

J

= +25°C  
@T

J

= +25°C  
10  
500  
100  
μ
A  
nA  
nA  
Gate-Body Leakage  
I

GSS  

Gate-Body Leakage (Note 7)  
@T

J

= +105°C  
@T

J

= +125°C  
8  
15  
100  
100  
nA  
nA  
I

GSS  

V

GS

= ±2.5V, V

DS

= 0V  
ON CHARACTERISTICS
(Note 6)  
Gate Threshold Voltage  
0.6  
1.2  
V
V

GS(TH)  

R

DS(ON)  

|Y

FS  

V

DS

= V

GS

, I

D

= 250
μ
A  
V

GS

= 1.8V, I

D

= 20mA  
V

GS

= 2.5V, I

D

= 20mA  
V

GS

= 4.0V, I

D

= 100mA  
V

DS

=10V, I

D

= 0.1A  
  
  
100  
0.5  
  
  
2.2  
1.5  
1.2  
Static Drain-Source On-Resistance  
Ω
Forward Transconductance  
Source-Drain Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 7)  
Input Capacitance  
mS  
V
1.4  
|
V

SD  

V

GS

= 0V, I

S

= 115mA  
39  
10  
3.6  
11  
51  
pF  
pF  
pF  
ns  
ns  
  
  
  
  
C

ISS  

C

OSS  

C

RSS  

t

ON  

V

DS

= 3V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-On Time  
Turn-Off Time  
V

DD

= 5V, I

D

= 10 mA,  
V

GS

= 5V  
Switching Time  
t

OFF  

Notes:  
5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can  
6. Short duration pulse test used to minimize self-heating effect.  
7. Guaranteed by design. Not subject to production testing.  
2 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2  

DMN32D2LV  
3 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2  

DMN32D2LV  
1.8  
1.6  
V
I
= 4V  
GS  
= 100mA  
D
1.4  
1.2  
1.0  
V
I
= 2.5V  
GS  
= 20mA  
D
V
I
= 1.8V  
GS  
= 20mA  
D
0.8  
0.6  
-75 -50 -25  
0
25 50 75
 
100 125 150  
T

A

, AMBIENT TEMPERATURE (C°)  
Fig. 7 Normalized Static Drain-Source On-Resistance  
vs. Ambient
T
emperature  
50  
40  
f = 1 MHz  
C
iss  
30  
20  
10  
0
C
oss  
C
rss  
0
5
10  
15  
20  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 10 Typical Capacitance  
10000  
1000  
100  
10000  
1000  
100  
10  
T
= 125°C  
T
= 125°C  
A
A
T
= 105°C  
T
= 105°C  
A
A
T
= 25°C  
T
= 25°C  
A
A
10  
1
1
0.1  
0.1  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Fig.11 Gate-Source
 
Leakage Current vs Voltage  
12  
V

GS

, GATE-SOURCE VOLTAGE (-V)  
Fig.12 Gate-Source
 
Leakage Current vs Voltage  
4 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2  

DMN32D2LV  
Package Outline Dimensions  
Please see AP02002 at

r the latest version.  
SOT563  
A
SOT-563  
Dim Min
 
Max Typ  
A
B
C
D
G
H
K
L
0.15 0.30 0.20  
1.10 1.25 1.20  
1.55 1.70 1.60  
B
C
—
—
0.50  
0.90 1.10 1.00  
1.50 1.70 1.60  
0.55 0.60 0.60  
0.10 0.30 0.20  
0.10 0.18 0.11  
D
G
H
M
All Dimensions in mm  
M
K
L
Suggested Pad Layout  
Please see AP02001 at

r the latest version.  
SOT563  
C2  
C2  
Dimensions Value
 
(in mm)  
Z
G
2.2  
1.2  
X
Y
0.375  
0.5  
C1  
G
Y
C1  
C2  
1.7  
0.5  
Z
X
5 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2  

DMN32D2LV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2015, Diodes Incorporated  
6 of 6  
December 2015  
© Diodes Incorporated  
DMN32D2LV  
Document number: DS31121 Rev. 10 – 2