Diodes-Incorporated-DMN4020LFDE-13

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Diodes-Incorporated-DMN4020LFDE-13
DMN4020LFDE  
40V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
•
•
•
•
•
•
•
0.6mm Profile – Ideal for Low Profile Applications  
PCB Footprint of 4mm

2  

I

D

max  
BV

DSS  

R

DS(ON)

max  
Low Gate Threshold Voltage  
T

A

= +25°C  
Low On-Resistance  
20m
Ω
@ V

GS

= 10V  
28
mΩ @ V

GS

= 4.5V  
8.0A  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change  
control (i.e.: parts qualified to AEC-Q100/101/200, PPAP  
capable, and manufactured in IATF 16949 certified facilities),  
please refer to the related automotive grade (Q-suffix) part.  
A listing can be found at  
40V  
6.7A  
•
This part is qualified to JEDEC standards (as references in  
AEC-Q) for High Reliability.  
Description and Applications  
Mechanical Data  
•
•
Case: U-DFN2020-6 (Type E)  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) yet maintain superior switching performance,  
making it ideal for high-efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
•
•
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish – NiPdAu over Copper Leadframe. Solderable  
•
•
General Purpose Interfacing Switch  
Power Management Functions  
e4  
per MIL-STD-202, Method 208  
•
Weight: 0.0065 grams (Approximate)  
D
U-DFN2020-6 (Type E)  
G
S
Pin Out  
Equivalent Circuit  
Bottom View  
Ordering Information
(Note 4)  
Part Number  
DMN4020LFDE-7  
DMN4020LFDE-13  
Marking  
NE  
NE  
Reel Size (inches)  
Quantity Per Reel  
3000  
7
13  
10,000  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

.  
1 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
Marking Information  
Site 1:  
NE = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: H = 2020)  
NE  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2013  
…
2019  
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
Code  
A
…
G
H
I
J
K
L
M
N
O
P
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Site 2:  
NE = Product Type Marking Code  
YWX = Date Code Marking  
Y = Year (ex: H = 2020)  
W = Week (ex: a = week 27; z represents week 52 and 53)  
X = Internal code (ex: U = Monday)  
Date Code Key  
Year  
2020  
0
2021  
1
2022  
2
2023  
3
2024  
4
2025  
5
2026  
6
2027  
7
2028  
8
Code  
Week  
Code  
1-26  
A-Z  
27-52  
a-z  
53  
z
Internal Code  
Code  
Sun  
T
Mon  
U
Tue  
V
Wed  
W
Thu  
X
Fri  
Y
Sat  
Z
2 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
40  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

Steady  
State  
T

A

= +25°C  
8.0  
6.3  
A
A
A
A
I

D  

I

D  

I

D  

I

D  

T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
Continuous Drain Current (Note 6) V

GS

= 10V  
Continuous Drain Current (Note 6) V

GS

= 4.5V  
9.5  
7.5  
t < 10s  
Steady  
State  
6.7  
5.3  
8.0  
6.4  
t < 10s  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Maximum Body Diode Continuous Current  
32  
A
A
I

DM  

I

S  

2.5  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
P

D  

Value  
0.66  
Unit  
T

A

= +25°C  
Total Power Dissipation (Note 5)  
W
0.42  
189  
132  
2.03  
T

A

= +70°C  
Steady State  
t < 10s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
R

θ  

JA  
T

A

= +25°C  
P

D  

1.31  
61  
43  
T

A

= +70°C  
Steady State  
t < 10s  
Thermal Resistance, Junction to Ambient (Note 6)  
R

θ  

JA  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
9.3  
R

θ  

JC  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
40  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μA  
V

DS

= 40V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
µA  
nA  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
±100  
I

GSS  

ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1.4  
—
—
15  
20  
0.7  
2.4  
20  
28  
1
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 8A  
V

GS

= 4.5V, I

D

= 4A  
V

GS

= 0V, I

S

= 1A  
Static Drain-Source On-Resistance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1060  
84  
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 20V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
58  
1.6  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
8.8  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

19.1  
3.0  
Q

g  

V

DS

= 20V, I

D

= 8A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
2.5  
Turn-On Delay Time  
5.3  
Turn-On Rise Time  
7.1  
V

DS

= 20V, R

L

= 2.5
Ω  
V

GS

= 10V, R

G

= 3
Ω  
Turn-Off Delay Time  
15.1  
4.8  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
10.5  
4.15  
t

RR  

I

F

= 8A, di/dt = 10
0A/μs  
Q

RR  

Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
3 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
20.0  
18.0  
16.0  
14.0  
12.0  
10.0  
8.0  
20  
16  
12  
8
V
DS  
= 5.0V  
V

GS

= 10V  
V

GS

= 4.5V  
V

GS

= 4.0V  
V

GS

= 3.5V  
T
= 150°C  
A
T
= 125°C  
A
6.0  

T
= 85°C  
A
4
4.0  
T
= 25°C  
V

GS

= 3.0V  
A
T
= -55°C  
2.0  
A
V

GS

= 2.8V  
0
0.0  
0
0.5  
1
1.5  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 1 Typical Output Characteristic  
0.024  
0.022  
0.02  
0.2  
0.18  
0.16  
0.14  
0.12  
0.1  
0.018  
0.016  
0.014  
0.012  
0.01  
V
= 4.5V  
GS  
0.08  
0.06  
0.04  
0.02  
0
V
= 10V  
GS  
I
= 8A  
D
I
= 4A  
D
0.008  
0
2
4
6
8
10 12 14 16 18 20  
2
4
6
8
10 12 14 16 18 20  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOL
T
A
GE (V)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Figure 4 Typical Transfer Characteristics  
2
0.04  
0.035  
0.03  
V
= 4.5V  
GS  
1.8  
1.6  
1.4  
1.2  
1
T
= 150°C  
= 125°C  
V
= 10V  
A
GS  
= 10A  
I
D
T
A
T
= 85°C  
A
V
= 4.5V  
= 5A  
GS  
0.025  
0.02  
I
D
T
= 25°C  
A
0.015  
0.01  
T
= -55°C  
A
0.8  
0.6  
0
2
4
6
8
10 12 14 16 18 20  
-50 -25  
0
25  
50  
75 100
 
125 150  
I

D

, DRAIN CURRENT (A)  
T

J

, JUNCTION TEMPER
A
T
URE (
°
C)  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
Figure 6 On-Resistance Variation with
T
e
mperature  
4 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
0.04  
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
3
2.8  
2.6  
2.4  
2.2  
2
V
= 4.5V  
= 5A  
GS  
I
D
I

D

= 1mA  
V
= 10V  
= 8A  
GS  
1.8  
1.6  
1.4  
1.2  
1
I

D

= 250
μ
A  
I
D
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPER
A
T
URE (
°
C)  
Figure 7 On-Resistance Variation with
T
e
mperature  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8 Gate Threshold Variation vs Temperature  
20  
18  
16  
14  
12  
10  
8
T
= 150°C  
A
T
= 125°C  
A

T
= 85°C  
= 25°C  
A
6
T
A
4
T
= -55°C  
A
2
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

S
D

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.05  
D = 0.02  
0.01  
D = 0.01  
D = 0.005  
R

θ
JA

(t) = r(t) * R

θ  

J
A

R

θ
JA

= 177
℃
/W  

D = Single Pulse  
Duty Cycle, D = t1 / t2  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 10 Transient Thermal Resistance  
5 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
Package Outline Dimensions  
U-DFN2020-6 (Type E)  
U-DFN2020-6  
Type E  
Dim Min Max  
A3  
Typ  
0.60  
0.03  
0.15  
0.30  
A1  
A
A
A1  
A3  
b
0.57 0.63  
0
0.05  
−
−
D
0.25 0.35  
b1
0.185 0.285
 
0.235  
D
D2  
E
E2  
e
1.95 2.05  
0.85 1.05  
1.95 2.05  
1.40 1.60  
2.00  
0.95  
2.00  
1.50  
0.65  
0.30  
0.87  
0.305  
0.225  
0.20  
b1  
K1  
D2  
E
E2  
L1  
−
−
L( 2X)  
L
0.25 0.35  
0.82 0.92  
K2  
L1  
K1  
K2  
Z
−
−
−
−
−
−
Z( 4X)  
e
b( 6X)  
All Dimensions in mm  
Suggested Pad Layout  
U-DFN2020-6 (Type E)  
Value  
Dimensions  
(in mm)  
0.650  
0.400  
0.285  
1.050  
0.500  
0.920  
1.600  
2.300  
C
X
X1  
X2  
Y
Y1  
Y2  
Y3  
X2  
Y1  
Y3 Y2  
X1  
Y (
 
2x)  
X( 6x)  
C
6 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2  

DMN4020LFDE  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
March 2020  
© Diodes Incorporated  
DMN4020LFDE  
D
atasheet number: DS35819
 
Rev. 5 – 2