Diodes-Incorporated-DMN4800LSSL-13

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Diodes-Incorporated-DMN4800LSSL-13
DMN4800LSSL  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefitss  
•
14m
Ω
@ V

GS

= 10V  
I

D

max  
•
•
•
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
V

(BR)DSS  

R

DS(on)  

T

A

= +25°C  
8.0A  
14m
Ω
@ V
GS
= 10V  
20m
Ω
@ V
GS
= 4.5V  
30V  
•
•
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
6.7A  
Description  
Mechanical Data  
This new generation MOSFET has been designed to minimize the on-  
state resistance (R
DS(on)
) and yet maintain superior switching  
performance, making it ideal for high efficiency power management  
applications.  
•
•
Case: SO-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
•
•
•
Moisture Sensitivity:
 
Level 1 per J-STD-020  
Terminals Connections: See Diagram  
Terminals: Finish – Matte Tin annealed over Copper lead frame.  
Solderable per MIL-STD-202, Method 208  
Applications  
•
•
DC-DC Converters  
Power management functions  
•
Weight: 0.072 grams (approximate)  
D
S
S
S
G
D
SO-8  
D
G
D
D
S
Top View  
Equivalent circuit  
Top View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMN4800LSSL-13  
SO-8  
2500/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. S

more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
8
5
8
5
= Manufacturer’s Marking  
N4800LS = Product Type Marking Code  
YYWW = Date Code Marking  
YY or YY = Year (ex: 13 = 2013)  
N4800LS  
YY WW  
N4800LS  
YY  
WW  
WW = Week (01 – 53)  
YY = Date Code Marking for SAT (Shanghai Assembly/ Test site)  
YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)  
1
4
1
4
Chengdu A/T Site  
Shanghai A/T Site  
1 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2  

DMN4800LSSL  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
30  
Units  
V
V
Gate-Source Voltage  
V

GSS  

±
20  
T

A

= +25°C  
T

A

= +70°C  
Drain Current (Note 5)
 
V
GS
= 10V  
Drain Current
 
(Note 5)
 
V
GS
= 10V  
Pulsed Drain Current (Note 6)  
Steady  
State  
8.0  
6.4  
A
I

D  

T

A

= +25°C  
Steady  
State  
6.7  
5.3  
A
A
I

D  

T

A

= +70°C  
50  
I

DM  

Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
Value  
1.46  
Unit  
W
P

D  

Thermal Resistance, Junction to Ambient  
Operating and Storage Temperature Range  
86  
°C/W  
°C  
R

θ  

JA  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
⎯
⎯
V
BV

DSS  

I

DSS  

⎯
⎯
⎯
⎯
1
V

GS

= 0V, I

D

= 250
μ
A  
μ
A  
nA  
V

DS

= 30V, V

GS

= 0V  
I

GSS  

±
100  
V

GS

=
±
20V, V

DS

= 0V  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
0.8  
1.2  
1.6  
V
V

GS(th)  

V

DS

= V

GS

, I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 8A  
V

GS

= 4.5V, I

D

= 7A  
V

DS

= 10V, I

D

= 8A  
V

GS

= 0V, I

S

= 1A  
11  
14  
14  
20  
Static Drain-Source On-Resistance  
m
Ω  
R

DS (ON)  

⎯
Forward Transconductance  
Diode Forward Voltage (Note 7)  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
8
S
V
g

fs  

⎯
⎯
⎯
0.94  
0.72  
V

SD  

798  
128  
122  
1.37  
8.7  
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

G  

⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
V

DS

= 10V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1.0MHz  
V

GS

= 5V, V

DS

= 15V, I

D

= 9A  
Total Gate Charge  
Q

g  

Gate-Source Charge  
Gate-Drain Charge  
1.7  
nC  
Q

gs  

Q

gd  

t

d(on)  

t

r  

2.4  
Turn-On Delay Time  
Rise Time  
5.03  
4.50  
26.33  
8.55  
V

DD

= 15V, V

GEN

= 10V,  
R

L

= 15
Ω
,
R

G

= 6.0
Ω
,
I

D

= 1A  
ns  
Turn-Off Delay Time  
Fall Time  
t

d(off)  

t

f  

Notes:  
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.  
6. Repetitive rating, pulse width limited by junction temperature.  
7. Short duration pulse test used to minimize self-heating effect.  
2 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2  

DMN4800LSSL  
30  
25  
30  
25  
V
= 10V  
GS  
V
= 5V  
V
= 4.5V  
DS  
GS  
20  
20  
15  
V
= 3.0V  
GS  
15  
10  
10  
5
T
= 150°C  
V
= 2.5V  
A
GS  
T
= 125°C  
T
= 85°C  
A
A
5
0
T
= 25°C  
A
T
= -55°C  
A
V
= 2.0V  
GS  
0
0
0.5  
1
1.5  
2
1
1.5  
2
2.5  
3
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 1 Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Fig. 2
 
Typical Transfer Characteristic  
0.03  
0.02  
0.08  
0.07  
V
= 4.5V  
GS  
T
= 150°C  
A
0.06  
0.05  
T
= 125°C  
= 85°C  
A
T
A
0.04  
0.03  
0.02  
T
= 25°C  
A
0.01  
T
= -55°C  
A
V
= 4.
5
V  
GS  
0.01  
0
0
0
5
10  
I

D

, DRAIN CURRENT (A)  
Fig. 4 Typical On-Resistance  
vs. Drain Current and
T
e
mperature  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
I

D

, DRAI
N
–
S
OURCE CURRENT (A)  
F
i
g. 3
 
T
y
pical On-Resistance  
vs. Drain Current and Gate Voltage  
1.8  
0.03  
1.6  
1.4  
1.2  
1.0  
0.025  
0.02  
V
= 4.5V  
GS  
I
= 10A  
D
0.015  
0.01  
V
= 4.5V  
V
= 10V  
GS  
GS  
I
= 10A  
I
= 11.6A  
D
D
0.8  
0.6  
0.005  
0
V
= 10V  
GS  
I
= 11.6A  
D
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 6 On-Resistance Variation with
T
e
mperature  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 5 On-Resistance Variation with
T
e
mperature  
3 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2  

DMN4800LSSL  
1.6  
1.2  
20  
16  
T
= 25°C  
A
I
= 1mA  
D
I
= 250µA  
12  
8
D
0.8  
0.4  
0
4
0
0.4  
0.5  
0.6  
0.7  
0.8  
0.9  
1.0  
-50 -25  
0
25  
50  
75 100
 
125 150  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient
T
e
mperature  
10,000  
10  
8
1,000  
C
iss  
I
= 11.6A  
6
4
2
0
D
I
= 9A  
D
C
oss  
100  
10  
C
rss  
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
10  
12  
14 16  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Q

G

, TOTAL GATE CHARGE (nC)  
Fig. 10
T
o
tal Gate Charge  
Fig. 9 Typical
T
o
tal Capacitance  
10,000  
1,000  
T
T
= 150°C  
= 125°C  
A
A
100  
T
= 85°C  
A
10  
1
T
= 25°C  
A
T
= -55°C  
A
0
5
10  
15  
20  
25  
30  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Fig. 11 Typical Leakage Current vs. Drain-Source Voltage  
4 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2  

DMN4800LSSL  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
R
(t) = r(t) * R  
θ
JA  
θ
R
JA  
D = 0.02  
D = 0.01  
D = 0.005  
= 85°C/W  
θ
JA  
0.01  
P(pk)  
t
1
t
2
T
– T
 
= P * R
 
(t)  
J
A
θ
JA  
Duty Cycle, D = t
 
/t  
1
2
D = Single Pulse  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t

1

, PULSE DUR
A
T
ION TIME (s)  
Fig. 12 Transient Thermal Response  
Package Outline Dimensions  
SO-8  
Min  
–
0.10  
1.30  
0.15  
0.3  
Dim  
A
A1  
A2  
A3  
b
Max  
1.75  
0.20  
1.50  
0.25  
0.5  
E1  
E
Gauge Plane  
Seating Plane  
A1  
L
D
E
E1  
e
h
L
θ
4.85  
5.90  
3.85  
1.27 Typ  
–
0.62  
0
°  
4.95  
6.10  
3.95  
Detail ‘A’  
7
°~
9
°  
h
°
45  
0.35  
0.82  
8
°  
Detail ‘A’  
A2  
A3  
A
b
All Dimensions in mm  
e
D
Suggested Pad Layout  
X
Dimensions Value
 
(in mm)  
X
Y
C1  
C2  
0.60  
1.55  
5.4  
C1  
1.27  
C2  
Y
5 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2  

DMN4800LSSL  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference.
 
Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
6 of 6  
November 2013  
© Diodes Incorporated  
DMN4800LSSL  
Document number: DS35016 Rev. 4 – 2