Diodes-Incorporated-DMN53D0U-13

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Diodes-Incorporated-DMN53D0U-13
DMN53D0U  
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR  
Product Summary  
Features and Benefits  
•
•
•
•
•
•
•
•
•
•
N-Channel MOSFET  
I

D  

V

(BR)DSS  

R

DS(ON)  

Low On-Resistance  
T

A

= +25°C  
300 mA  
200 mA  
2
Ω
@ V

GS

= 5V  
Very Low Gate Threshold Voltage  
Low Input Capacitance  
50V  
2.5
Ω
@ V

GS

= 2.5V  
Fast Switching Speed  
Low Input/Output Leakage  
ESD Protected  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
Mechanical Data  
Description and Applications  
•
•
Case: SOT23  
This MOSFET has been designed to minimize the on-state resistance  
(R

DS(ON)

) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.
 
UL  
Flammability Classification Rating 94V-0  
•
•
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating). Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
•
•
Weight: 0.008 grams (approximate)  
SOT23  
D
ESD protected  
S
G
Top View  
Top View  
Equivalent Circuit  
Ordering Information
 
(Note 4)  
Part Number  
DMN53D0U-7  
DMN53D0U-13  
Case  
SOT23  
SOT23  
Packaging  
3000/Tape & Reel  
10000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. S

more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
53D = Product Type Marking Code  
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)  
= Date Code Marking for CAT (Chengdu Assembly/ Test site)  
YM  
Y or
 
= Year (ex: B = 2014)  
Y
M = Month (ex: 9 = September)  
Shanghai A/T Site  
Chengdu A/T Site  
Date Code Key  
Year  
2014  
2015  
2016  
2017  
2018  
2019  
2020  
Code  
B
C
D
E
F
G
H
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2  

DMN53D0U  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
V

DSS  

Value  
50  
Unit  
V
Drain Source Voltage  
Gate-Source Voltage  
Drain Current (Note 5)  
Continuous  
V
V

GSS  

±
12  
Continuous  
Pulsed  
I

D  

I

DM  

300  
500  
mA  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

R

θ  

Value  
520  
Unit  
mW  
Thermal Resistance, Junction to Ambient (Note 5)  
Operating and Storage Temperature Range  
246  
°
C/W  
°
C  
JA  
-55 to +150  
T

J

, T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 6)  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
50  
⎯
⎯
V
BV

DSS  

I

DSS  

⎯
⎯
⎯
⎯
1
V

GS

= 0V, I

D

= 250µA  
V

DS

= 50V, V

GS

= 0V  
V

GS

= ±12V, V

DS

= 0V  
µA  
µA  
Gate-Body Leakage  
±10  
I

GSS  

ON CHARACTERISTICS (Note 6)  
Gate Threshold Voltage  
0.4  
1.0  
V
Ω
V
V

GS(th)  

R

DS(ON)  

V

SD  

⎯
V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 5.0V, I

D

= 50mA  
V

GS

= 2.5V, I

D

= 50mA  
V

GS

= 1.8V, I

D

= 50mA  
⎯
⎯
⎯
⎯
⎯
⎯
2.0  
2.5  
3.0  
Static Drain-Source On-Resistance  
Source-Drain Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 7)  
Input Capacitance  
1.4  
⎯
⎯
V

GS

= 0V, I

S

=115mA  
C

iss  

C

oss  

C

rss  

Q

g  

37.1  
8.4  
4.0  
0.6  
0.1  
0.1  
2.1  
2.8  
21  
pF  
pF  
pF  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
V

DS

= 25V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
V

GS

= 4.5V, V

DS

= 10V,  
I

D

= 250mA  
Gate-Source Charge  
Q

gs  

Q

gd  

t

D(on)  

t

r  

Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
V

DD

= 30V, V

GS

= 10V,  
R

G

= 25
ꢀ
, I

D

= 200mA  
Turn-Off Delay Time  
t

D(off)  

t

f  

Turn-Off Fall Time  
14  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate  
6. Short duration pulse test used to minimize self-heating effect.  
7. Guaranteed by design. Not subject to product testing.  
2 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2  

DMN53D0U  
2.0  
1.5  
1.0  
0.5  
0.0  
1.5  
1.2  
0.9  
V
= 10V  
V
= 5.0V  
GS  
DS  
V
= 3.0V  
GS  
V
= 3.5V  
GS  
V
= 4.0V  
GS  
V
= 2.5V  
GS  
0.6  
0.3  
0
T
= 150°C  
A
V
= 2.0V  
GS  
T
= 85°C  
A
T
A
= 125°C  
V
= 1.8V  
GS  
T
= 25°C  
A
V
= 1.5V  
GS  
T
= -55°C  
A
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 1 Typical Output Characteristics  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
2.5  
2
8
7
6
5
4
3
2
1
0
V
= 1.8V  
GS  
1.5  
V
= 2.5V  
V
I
= 50mA  
D
GS  
1
= 5V  
GS  
0.5  
0
0
2
4
6
8
10 12 14 16 18 20  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4 Typical Transfer Characteristics  
0.01  
0.1  
1
10  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
3
2.5  
2
2.4  
2.2  
2
V
= 4.5V  
GS  
V
= 5V  
GS  
T
= 150°C  
A
1.8  
1.6  
1.4  
1.2  
1
I
= 500mA  
D
T
= 125°C  
A
1.5  
1
V
I
= 2.5V  
GS  
T
T
= 85°C  
= 25°C  
A
= 100mA  
D
0.8  
0.6  
0.4  
0.2  
0
A
T
= -55°C  
A
0.5  
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
-50 -25  
T

J

, JUNCTION TEMPER
A
T
URE (  
Figure 6 On-Resistance Variation with
T
e
mperature  
0
25  
50  
75 100
 
125 150  
I

D

, DRAIN CURRENT (A)  
°
C)  
Figure 5 Typical On-Resistance vs.  
Drain Current and
T
e
mperature  
3 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2  

DMN53D0U  
2
1.8  
1.6  
1.4  
1.2  
1
1.8  
1.5  
1.2  
0.9  
0.6  
0.3  
0
V
= 2.5V  
GS  
I
= 100mA  
D
I
= 1mA  
D
I
= 250µA  
V
= 5V  
D
GS  
0.8  
0.6  
0.4  
0.2  
0
I
= 500mA  
D
-50 -25  
0
25  
50  
75 100
 
125 150  
C)  
-50 -25  
0
25  
50  
75 100
 
125 150  
C)  
Figure 7 On-Resistance Variation with
T
e
mperature  
T

J

, JUNCTION TEMPERATURE (  
°
T

J

, JUNCTION TEMPER
A
T
URE (  
°
Figure 8 Gate Threshold Variation vs. Ambient
T
emperature  
1
0.8  
0.6  
0.4  
0.2  
0
f = 1MHz  
C
iss  
T
= 150°C  
= 125°C  
A
T
A
= 25°C  
C
A
oss  
T
A
T
= 85°C  
A
T
= -55°C  
C
rss  
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
5
10  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 10 Typical Junction Capacitance  
15  
20  
25  
30  
35  
40  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
10  
8
6
V
I
= 10V  
DS  
= 250mA  
D
4
2
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
Q

g

, TOTAL GATE CHARGE (nC)  
Figure 11 Gate Charge  
4 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2  

DMN53D0U  
Package Outline Dimensions  
A
ll
7
°  
H
SOT23  
Min Max  
G
A
U
G
E P
L
A
N
E  
0.
2
5  
Dim  
A
B
C
D
F
G
H
Typ  
0.40  
1.30  
2.40  
J
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
K
K1  
a
M
A
L
L1  
2.05  
3.00  
1.83  
2.90  
0.05  
J
0.013 0.10  
K
K1  
L
L1  
M
α
0.890 1.00 0.975  
0.903 1.10 1.025  
C
B
0.45  
0.25  
0.61  
0.55  
0.55  
0.40  
0.085 0.150 0.110  
8°  
D
All Dimensions in mm  
G
F
Suggested Pad Layout  
Y
Dimensions Value
 
(in mm)  
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
Z
C
E
X
5 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2  

DMN53D0U  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference.
 
Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2014, Diodes Incorporated  
6 of 6  
May 2014  
© Diodes Incorporated  
DMN53D0U  
Document number: DS37098
 
Rev. 2 – 2