Diodes-Incorporated-DMN62D1LFD-13

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Diodes-Incorporated-DMN62D1LFD-13
DMN62D1LFD  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Low On-Resistance  
I

D  

BV

DSS  

R

DS(ON)  

Low Input Capacitance  
T

A

= +25°C  
400mA  
Fast Switching Speed  
2
Ω @ V

GS

= 4V  
60V  
Low Input/Output Leakage  
2.5
Ω @ V

GS

= 2.5V  
350mA  
ESD Protected  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
For automotive applications requiring specific change control  
(i.e.: parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please refer  
to the related automotive grade (Q-suffix) part. A listing can  
be found at  
This part is qualified to JEDEC standards (as references in  
AEC-Q) for High Reliability.  
An Automotive-Compliant Part is Available Under Separate  
Mechanical Data  
Description and Applications  
Case: U-DFN1212-3  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) and yet maintain superior switching performance,  
making it ideal for high efficiency power management applications.  
Case Material: Molded Plastic. UL Flammability Classification  
Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: NiPdAu over Copper Leadframe. Solderable per MIL-  
DC-DC Converters  
STD-202, Method 208  
Power Management Functions  
e4  
Terminal Connections: See Diagram  
Weight: 0.005 grams (Approximate)  
Battery Operated Systems and Solid-State Relays  
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,  
Memories, Transistors, etc.  
U-DFN1212-3 (Type C)  
D
S
S
G pin  
D
G
G
Gate Protection  
Diode  
ESD PROTECTED  
Bottom View  
Top View  
Pin-Out Top View  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
DMN62D1LFD
-7  
DMN62D1LFD
-13  
Case  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
U-DFN1212-3
(Type C)  
U-DFN1212-3
(Type C)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
1 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
Marking Information  
Site 1:  
K64 = Product Type Marking Code  
K63 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: H = 2020)  
M = Month (ex: 9 = September)  
K64  
YM  
K63  
YM  
Date Code Key  
Year  
2014  
…
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
Code  
B
…
H
I
J
K
L
M
N
O
P
R
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Site 2:  
K64 = Product Type Marking Code  
K63 = Product Type Marking Code  
YWX = Date Code Marking  
Y = Year (ex: 0 = 2020)  
W = Week (ex: a = week 27; z represents week 52 and 53)  
X = Internal Code (ex: U = Monday)  
Date Code Key  
Year  
2014  
…
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
Code  
4
…
0
1
2
3
4
5
6
7
8
9
Week  
Code  
1-26  
A-Z  
27-52  
a-z  
53  
z
Internal Code  
Code  
Sun  
T
Mon  
U
Tue  
V
Wed  
W
Thu  
X
Fri  
Y
Sat  
Z
2 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
Unit  
V
60  
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
T

A

= +70°C  
400  
310  
mA  
A
Continuous Drain Current (Note 5) V

GS

= 4V  
Pulsed Drain Current (Note 6)  
I

D  

1
I

DM  

Thermal Characteristics  
Characteristic  
Power Dissipation (Note 5)  
Symbol  
P

D  

Max  
0.5  
Unit  
W
237  
°C/W  
°C  
Thermal Resistance, Junction to Ambient @T

A

= +25°C (Note 5)  
Operating and Storage Temperature Range  
R

θJA  

-55 to +150  
T

J

,
T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
60  
—
—
—
—
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250μA  
V

DS

= 60V, V

GS

= 0V  
V

GS

= ±5V, V

DS

= 0V  
V

GS

= ±10V, V

DS

= 0V  
V

GS

= ±15V, V

DS

= 0V  
µA  
nA  
nA  
µA  
Zero Gate Voltage Drain Current T

J

= +25°C  
±100  
±500  
±2  
Gate-Source Leakage  
I

GSS  

ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
0.6  
—
—
—
—
—
—
—
0.8  
1
1
2
V
V

GS(TH)  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 4V, I

D

= 100mA  
V

GS

= 2.5V, I

D

= 50mA  
V

GS

= 1.8V, I

D

= 50mA  
V

GS

= 1.5V, I

D

= 10mA  
V

DS

= 10V, I

D

= 200mA  
V

GS

= 0V, I

S

= 115mA  
2.5  
3
Static Drain-Source On-Resistance  
Ω
R

DS(ON)  

1.4  
1.8  
1.8  
0.8  
—
—
1.3  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
S
V
|Y

fs

|  
V

SD  

—
—
—
—
—
—
—
—
—
—
—
36  
4.6  
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 25V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
3.6  
59.8  
0.55  
0.08  
0.12  
2.1  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge  
Q

g  

V

GS

= 4.5V, V

DS

= 10V,  
I

D

= 250mA  
Gate-Source Charge  
Gate-Drain Charge  
nC  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Turn-On Delay Time  
ns  
ns  
ns  
ns  
V

GS

= 10V, V

DS

= 30V,  
R

L

= 150
Ω, R

G

= 25
Ω
,  
I

D

= 200mA  
Turn-On Rise Time  
2.8  
Turn-Off Delay Time  
21  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
13.9  
Notes:  
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided.  
6. Repetitive rating, pulse width limited by junction temperature.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to production testing.  
3 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.5  
0.4  
0.3  
0.2  
0.1  
0
V
= 2.0V  
GS  
V
= 5.0V  
DS  
V
= 2.5V  
GS  
= 3.0V  
V
GS  
V
= 3.5V  
GS  
V
= 4.0V  
GS  
V
= 4.5V  
GS  
V
= 1.5V  
GS  
T
= 150°C  
A

T
= 85°C  
A
T
= 125°C  
A
T
= 25°C  
A
V
= 1.2V  
GS  
T
= -55°C  
A
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
1
1.5  
2
2.5  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1 Typical Output Characteristics  
3
2.5  
2
5
I
= 100mA  
D
4.5  
4
V
= 1.8V  
GS  
3.5  
3
I
= 50mA  
D
2.5  
2
1.5  
1
1.5  
1
V
= 2.5V  
GS  
V
= 4.5V  
GS  
0.5  
0
0.5  
0
2
4
6
8
10 12 14 16 18 20  
0
0.1  
0.2  
0.3  
0.4  
0.5  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Figure 4 Typical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
2.4  
2
1.8  
1.6  
1.4  
1.2  
1
V
= 4.5V  
GS  
T
= 150°C  
A
2
1.6  
1.2  
0.8  
0.4  
V
= 4V  
GS  
= 200mA  
I
D
T =
 
125°C  
A
T
= 85°C  
A
V
= 2.5V  
GS  
= 100mA  
I
D
T
= 25°C  
A
0.8  
0.6  
0.4  
0.2  
0
T
= -55°C  
A
-50 -25  
0
25  
50  
75 100
 
125 150  
0
0.1  
0.2  
0.3  
0.4  
0.5  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
I

D

, DRAIN CURRENT (A)  
Figure 6 On-Resistance Variation with
T
emperature  
Figure 5 Typical On-Resistance vs.  
Drain Current and Temperature  
4 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
2.5  
2
1.2  
1
I

D

= 1mA  
V
= 2.5V  
GS  
= 100mA  
0.8  
0.6  
0.4  
0.2  
0
I
D
1.5  
1
V
= 4V  
GS  
I

D

= 250
μ
A  
I
= 200mA  
D
0.5  
0
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8 Gate Threshold Variation vs. Junction  
Temperature  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 7 On-Resistance
V
a
riation with
T
emperature  
100  
0.5  
0.4  
0.3  
0.2  
0.1  
0
f = 1MHz  
C
iss  
10  
C
T
= 150°C  
oss  
A
T
= 85°C  
A
T
= 125°C  
C
A
rss  

T
= 25°C  
A
T
= -55°C  
A
1
0
10  
20  
30  
40  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9 Diode Forward Voltage vs. Current  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10 Typical Junction Capacitance  
10  
8
10  
R

DS(ON)  

Limited  
P

W

= 100µs  
P

W

= 1ms  
1
0.1  
6
V
I
= 10V  
DS  
= 250mA  
D
P

W

= 10ms  
4
P

W

= 100ms  
P

W

= 1s  
P

W

= 10s  
T

J(Max)

= 150
℃
 
T

C

= 25
℃  
Single Pulse  
DUT on 1*MRP  
Board  
0.01  
0.001  
2
DC  
V

GS

= 4.5V  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
0.1  
1
10  
100  
Q

g

, TOTAL GATE CHARGE (nC)  
Figure 11 Gate Charge  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12 SOA, Safe Operation Area  
5 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
0.01  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
J
A
R

θ
JA

(t) = r(t) * R

θ  

R
= 234
℃
/W  

θ

J
A

Duty Cycle, D = t1 / t2  
D = Single Pulse  
0.001  
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t1, PULSE DURATION TIME (sec)  
Figure 13 Transient Thermal Resistance  
6 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
Package Outline Dimensions  
U-DFN1212-3 (Type C)  
U-DFN1212-3  
Type C  
A3  
A1  
A
Dim Min  
Max Typ  
Seating Plane  
A
A1  
A3  
b
b1  
D
0.47 0.53 0.50  
0
–
0.05 0.02  
0.13  
D
e
–
L
0.27 0.37 0.32  
0.17 0.27 0.22  
1.15 1.25 1.20  
b1  
D2
0.75 0.95 0.85  
e
–
–
0.80  
E
1.15 1.25 1.20  
E
E2  
D2  
E2
0.40 0.60 0.50  
L
L1  
L1  
0.25 0.35 0.30  
0.65 0.75 0.70  
All Dimensions in mm  
b
Suggested Pad Layout  
U-DFN1212-3 (Type C)  
X2  
X1  
Value  
Dimensions  
Y1  
(in mm)  
C
G
X
X1  
X2  
Y
Y1  
Y2  
0.800  
0.200  
0.320  
0.520  
1.050  
0.450  
0.250  
0.850  
Y2  
Y
G
X
C
7 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2  

DMN62D1LFD  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without  
further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or  
use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights,  
nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use  
and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against  
all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final  
and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
8 of 8  
February 2020  
© Diodes Incorporated  
DMN62D1LFD  
Document number: DS36476 Rev. 3 – 2