Diodes-Incorporated-DMP2040UND-7

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Diodes-Incorporated-DMP2040UND-7
DMP2040UND  
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Dual P-Channel MOSFET  
Low On-Resistance  
Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change  
control (i.e. parts qualified to AEC-Q100/101/200, PPAP  
capable, and manufactured in IATF 16949 certified  
facilities), please

or your local Diodes  
representative.  
I

D  

BV

DSS  

R

DS(ON)

Max  
T

A

= +25°C  
-5.3A  
-3.9A  
36m
@ V

GS

= -4.5V  
60m
@ V

GS

= -2.5V  
-20V  
Description  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) yet maintain superior switching performance,  
making it ideal for high efficiency power management applications.  
Applications  
Mechanical Data  
Backlighting  
Power Management Functions  
DC-DC Converters  
®
Case: POWERDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity:
 
Level 1 per J-STD-020  
Terminals Connections Indicator: See Diagram  
Terminals: Finish – Matte Tin Annealed over Copper Lead  
e3  
Frame. Solderable
 
per MIL-STD-202, Method 208  
Weight: 0.072 grams (Approximate)  
POWERDI3333-8 (Type UXB)  
D1  
D2  
Pin 1  
S1  
G1  
S2  
G2  
G1  
G2  
D1  
S1  
D1  
D2  
S2  
D2  
P-Channel MOSFET  
P-Channel MOSFET  
Top View  
Bottom View  
Ordering Information
(Note 4)  
Part Number  
DMP2040UND-7  
DMP2040UND-13  
Case  
Packaging  
2000/Tape & Reel  
3000/Tape & Reel  
POWERDI3333-8 (Type UXB)  
POWERDI3333-8 (Type UXB)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
C6C = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 20 for 2020)  
WW = Week Code (01 to 53)  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
-20  
Unit  
V
±12  
Gate-Source Voltage  
V
V

GSS  

Steady  
State  
T

A

= +25°C  
-5.3  
-4.2  
A
A
Continuous Drain Current (Note 6) V

GS

= -4.5V  
Continuous Drain Current (Note 7) V

GS

= -4.5V  
I

D  

T

A

= +70°C  
T

C

= +25°C  
T

C

= +70°C  
Steady  
State  
-13.6  
-10.9  
I

D  

Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
Continuous Source-Drain Diode Current (Note 6)  
Avalanche Current (Note 8) L = 0.1mH  
-25  
-1.9  
-19  
18  
A
A
I

DM  

I

S  

I

AS  

A
Avalanche Energy (Note 8) L = 0.1mH  
mJ  
E

AS  

Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
0.9  
Unit  
W
Total Power Dissipation (Note 5)  
T

A

= +25°C  
Steady State  
P

D  

R

θ
JA  

P

D  

Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
148  
1.4  
°C/W  
W
T

A

= +25°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
88  
°C/W  
°C/W  
°C  
R

θ
JA  

R

θ
JC  

T

J,

T

STG  

Steady State  
13.2  
-55 to +150  
Electrical Characteristics
(T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
  
V
BV

DSS  

I

DSS  

  
-1  
V

GS

= 0V, I

D

= -250µA  
V

DS

= -16V, V

GS

= 0V  
V

GS

= ±12V, V

DS

= 0V  
µA  
nA  
I

GSS  

100  
ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-0.6  
-1.5  
36  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

28  
V

DS

= V

GS

, I

D

= -250µA  
V

GS

= -4.5V, I

D

= -8.9A  
V

GS

= -2.5V, I

D

= -6.9A  
V

GS

= 0V, I

S

= -2.9A  
Static Drain-Source On-Resistance  
60  
38  
Diode Forward Voltage  
-1.2  
-0.7  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
834  
133  
105  
4.9  
C

iss  

C

oss  

C

rss  

R

g  

  
  
  
  
  
  
V

DS

= -10V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1.0MHz  
9.6  
Total Gate Charge (V

GS

= -4.5V)  
Total Gate Charge (V

GS

= -10V)  
Gate-Source Charge  
Q

g  

20  
Q

g  

nC
  
V

DS

= -6V, I

D

= -8.9A  
1.1  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
2.6  
Turn-On Delay Time  
14.6  
5.5  
Turn-On Rise Time  
V

DD

= -6V, R

L

= 6
Ω  
ns  
Turn-Off Delay Time  
38.7  
18.3  
9.8  
V

GS

= -4.5V, R

g

= 6
Ω
, I

D

= -1A  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
t

RR  

I

F

= -8.9A, di/dt = -10
0A/μs  
I

F

= -8.9A, di/dt = -10
0A/μs  
2.7  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

GS

= -2.5V  
V

DS

= -5V  
V

GS

= -4.5V  
V

GS

= -4.0V  
V

GS

= -3.0V  
V

GS

= -2.0V  
V

GS

= -1.8V  
T

J

= 150
℃
 
T

J

= 125
℃  
T

J

= 85
℃  
T

J

= 25
℃
 
T

J

=-55
℃  
V

GS

= -1.3V  
V

GS

= -1.5V  
2.5  
0
0.0  
0
1
2
3
0
0.5  
1
1.5  
2
3
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1.Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
I

D

= -8.9A  
I

D

= -6.9A  
0.054  
0.044  
0.034  
0.024  
0.014  
0.004  
V

GS

= -2.5V  
V

GS

= -4.5V  
0
2
4
6
8
10 12 14 16 18 20  
0
5
10  
15  
20  
25  
30  
V

GS

, GATE-SOURCE VOLTAGE (V)  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
1.6  
1.4  
1.2  
1
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
V

GS

= -4.5V  
V

GS

= -4.5V, I

D

= -8.9A  
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 85
℃  
T

J

= 25
℃  
V

GS

= -2.5V, I

D

= -6.9A  
T

J

= -55
℃  
0.8  
0.6  
-50 -25  
0
25  
50  
75 100
 
125 150  
0
5
10  
15  
20  
25  
30  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
1.5  
1.2  
0.9  
0.6  
0.3  
0
V

GS

= -2.5V, I

D

= -6.9A  
I

D

= -1mA  
I

D

= -250
μ
A  
V

GS

= -4.5V, I

D

= -8.9A  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs.  
JunctionTemperature  
10000  
1000  
100  
30  
25  
20  
15  
10  
5
V

GS

= 0V  
f=1MHz  
C

iss  

C

oss  

T

J

= 85
℃  
T

J

= 150
℃  
C

rss  

T

J

= 125
℃  
T

J

= 25
℃  
T

J

= -55
℃  
0.9 1.2  
10  
0
0
5
10  
15  
20  
0
0.3  
0.6  
1.5  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
Figure 9. Diode Forward Voltage vs. Current  
100  
10  
10  
8
R

DS(ON)

LIMITED  
P

W

=10ms  
P

W

=1ms  
P

W

=100
μ
s  
6
1
P

W

=100ms  
4
T

J(MAX)

=150
℃  
V

DS

= -6V, I

D

= -8.9A  
T

C

=25
℃  
P

W

=1s  
0.1  
0.01  
Single Pulse  
2
P

W

=10s  
DUT on  
DC  
10  
1*MRP board  
V

GS

= -4.5V  
0
0.1  
1
100  
0
2
4
6
8
10 12 14 16 18 20 22  
Qg (nC)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
1
D=0.9  
D=0.5  
D=0.3  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
D=Single Pulse  
0.01  
0.001  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 153
℃
/W  
Duty Cycle, D = t1 / t2  
0.00001 0.0001
 
0.001  
0.01  
0.1  
1
10  
100  
1000 10000
 
10000
0
1
000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
Package Outline Dimensions  
POWERDI3333-8  
(Type UXB)  
A
D
D1  
A1  
POWERDI3333-8  
(Type UXB)  
Dim Min
 
Max Typ  
E1 E  
A
0.75 0.85 0.80  
A1
0.00 0.05  
—  
b
c
D
0.25 0.40 0.32  
0.10 0.25 0.15  
3.20 3.40 3.30  
D1
2.95 3.15 3.05  
D2
0.10 0.35 0.23  
c
E
3.20 3.40 3.30  
L
E1
2.95 3.15 3.05  
E2
0.10 0.30 0.20  
e
L
a
D2  
0.65  
0.35 0.55 0.45  
0
°
12
°
10
°  
  
  
E2  
All Dimensions in mm  
L
b
e
Suggested Pad Layout  
POWERDI3333-8  
(Type UXB)  
X1  
Y
Y
Y1  
Dimensions Value
 
(in mm)  
C
X
0.650  
0.420  
2.370  
0.730  
3.500  
X1  
Y
Y1  
X
C
6 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2  

DMP2040UND  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
September 2020  
© Diodes Incorporated  
DMP2040UND  
Document number: DS42189
 
Rev. 3 – 2