Diodes-Incorporated-DMP2090UFDB-7

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Diodes-Incorporated-DMP2090UFDB-7
DMP2090UFDB  
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
PCB Footprint of 4mm

2  

I

D  

T

A

= +25°C  
-3.2A  
BV

DSS  

R

D1D2 max  

Low On-Resistance  
Low Input Capacitance  
90m
Ω
@ V

GS

= -4.5V  
120m
Ω
@ V

GS

= -2.5V  
-20V  
Low Profile, 0.6mm Maximum Height  
-2.7A  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
Mechanical Data  
Description and Applications  
Case: U-DFN2020-6  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) yet maintain superior switching performance, which makes it  
ideal for high-efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe. Solderable per  
Load Switch  
e4  
MIL-STD-202, Method 208  
Power Management Functions  
Portable Power Adaptors  
Terminals Connections: See Diagram Below  
Weight: 0.0065 grams (Approximate)  
U-DFN2020-6 (Type B)  
S2  
G2  
D2  
D1  
D1  
D2  
ESD protected Gate  
G1  
S1  
Pin1  
Bottom View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
DMP2090UFDB
-7  
DMP2090UFDB
-13  
Case  
Packaging  
3000/Tape & Reel  
10,000/Tape & Reel  
U-DFN2020-6 (Type B)  
U-DFN2020-6 (Type B)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
1 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
Marking Information  
Site 1:  
E4 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: G = 2019)  
E4  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
2028  
2029  
2030  
Code  
G
H
I
J
K
L
M
N
O
P
R
S
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Site 2:  
E4 = Product Type Marking Code  
YWX = Date Code Marking  
Y = Year (ex: 9 = 2019)  
W = Week (ex: a = week 27; z represents week 52 and 53)  
X = Internal Code (ex: U = Monday)  
E4  
YWX  
Date Code Key  
Year  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
2026  
2027  
Code  
9
0
1
2
3
4
5
6
7
Week  
Code  
1-26  
A-Z  
27-52  
a-z  
53  
z
Internal Code  
Code  
Sun  
T
Mon  
U
Tue  
V
Wed  
W
Thu  
X
Fri  
Y
Sat  
Z
2 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Unit  
V
Value  
-20  
Gate-Source Voltage  
V
V

GSS  

±8  
Steady  
T

A

= +25°C  
T

A

= +70°C  
-3.2  
-2.5  
A
Continuous Drain Current (Note 6) V

GS

= -4.5V  
State  
I

D  

Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 7) L = 0.1mH  
-1.9  
-22  
-11  
7
A
A
I

S  

I

DM  

I

AS  

A
Avalanche Energy (Note 7) L = 0.1mH  
mJ  
E

AS  

Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

Value  
0.79  
Unit  
W
T

A

= +25°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
159  
°C/W  
W
R

ϴ
JA  

P

D  

1.39  
T

A

= +25°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 6)  
Operating and Storage Temperature Range  
90  
°C/W  
°C  
R

ϴ
JA  

T

J,

T

STG  

-55 to +150  
Electrical Characteristics
(@ T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
—
—
—
—
—
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= –
250μA  
V

DS

= -20V, V

GS

= 0V  
V

GS

= ±8V, V

DS

= 0V  
-1.0  
±10  
μA  
μ
A  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
—
I

GSS  

ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.3  
—
—
37  
-1.0  
90  
V
m
Ω  
V
V

GS(TH)  

R

D1D2  

V

SD  

V

DS

= V

GS

, I

D

= -250
μA  
V

GS

= -4.5V, I

D

= -4A  
V

GS

= -2.5V, I

D

= -3.5A  
V

GS

= 0V, I

S

= -1.0A  
Static Drain1-Drain2 On-Resistance  
—
50  
120  
-1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
—
-0.7  
—
—
—
—
—
—
—
—
—
—
—
—
—
634  
81  
—
—
—
—
—
—
—
—
—
—
—
—
—
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= -10V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
66  
20  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
6.8  
0.7  
1.6  
4.2  
3.4  
23  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (V

GS

= -4.5V)  
Gate-Source Charge  
Q

g  

V

DS

= -4.5V, I

D

= -4A,  
V

DS

= -10V  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
V

DS

= -10V, V

GS

= -4.5V,  
R

L

= 3.3
Ω, R

g

= 1
Ω  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
9.6  
1.8  
9.4  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
t

RR  

I

S

= -1.0A, dI/dt = 100A/
μ
s  
I

S

= -1.0A, dI/dt = 100A/
μ
s  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PCB, 2oz copper, with 1inch square copper plate.  
7. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
3 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
20.0  
15.0  
10.0  
5.0  
10  
8
V

GS

= -8.0V  
V

GS

= -4.5V  
V

GS

= -3.0V  
V

DS

= -5V  
V

GS

= -2.5V  
V

GS

= -2.0V  
6
4
T

J

= 85
℃
 
2
V

GS

= -1.5V  
V

GS

= -1.2V  
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 25
℃  
T

J

= -55
℃  
0.0  
0
0
0.4  
0.8  
1.2  
1.6  
2
0
0.2 0.4 0.6 0.8
 
1 1.2
 
1.4 1.6 1.8
 
2 2.2
 
2.4  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.2  
0.3  
0.25  
0.2  
V

GS

= -2.5V  
0.15  
0.1  
0.05  
0
0.15  
0.1  
I

D

= -4.0A  
V

GS

= -4.5V  
0.05  
0
0
3
6
9
12  
15  
0
2
4
6
8
V

GS

, GATE-SOURCE VOLTAGE (V)  
I

D1D2

, DRAIN1-DRAIN2 CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
Figure 4. Typical Transfer Characteristic  
0.14  
0.12  
0.1  
1.8  
1.6  
1.4  
1.2  
1
V

GS

= -4.5V  
T

J

= 150
℃  
T

J

= 125
℃  
V

GS

= -4.5V, I

D

= -4.0A  
0.08  
0.06  
0.04  
0.02  
0
T

J

= 85
℃  
T

J

= 25
℃
 
T

J

= -55
℃  
V

GS

= -2.5V, I

D

= -3.5A  
0.8  
0.6  
0
3
6
9
12  
15  
-50 -25  
0
25  
50  
75  
100 125 150  
I

D

, DRAIN CURRENT (A)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
Figure 6. On-Resistance Variation with Junction  
Temperature  
4 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
0.2  
0.18  
0.16  
0.14  
0.12  
0.1  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
V

GS

= -2.5V, I

D

= -3.5A  
I

D

= -1mA  
0.08  
0.06  
0.04  
0.02  
0
I

D

= -250
μ
A  
V

GS

= -4.5V, I

D

= -4.0A  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Junction  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
Temperature  
20  
15  
10  
5
10000  
1000  
100  
f = 1MHz  
V

GS

= 0V  
C

iss  

C

oss  

T

J

= 85

o

C  
T

J

= 25

o

C  
T

J

= 150

o

C  
T

J

= 125

o

C  
0.3  
C

rss  

T

J

= -55

o

C  
0
10  
0
0.6  
0.9  
1.2  
1.5  
0
4
8
12  
16  
20  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
Figure 9. Diode Forward Voltage vs. Current  
8
6
4
2
0
100  
10  
R

DS(ON)  

Limited  
P

W

= 1ms  
P

W

= 100µs  
P

W

= 10ms  
1
P

W

= 100ms  
T

J(Max)

= 150
℃  
T

C

= 25
℃  
Single Pulse  
DUT on  
1*MRP Board  
V

GS

= -4.5V  
0.1  
0.01  
P

W

= 1s  
P

W

= 10s  
V

DS

= -10V, I

D

= -4A  
DC  
10  
0.1  
1
100  
0
2
4
6
8
10  
12  
Q

g

(nC)  
Figure 11. Gate Charge  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
5 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
1
D=0.5  
D=0.3  
D=0.9  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
D=0.01  
D=0.005  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 157
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.001  
0.00000
1
0
.00001 0.0001
 
0.001  
0.01  
0.1  
1
10  
100  
1000 10000
 
100000 1000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
6 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
Package Outline Dimensions  
U-DFN2020-6 (Type B)  
A3  
A1  
A
U-DFN2020-6  
Type B  
Min Max Typ  
0.545 0.605 0.575  
0.00 0.05 0.02  
Seating Plane  
Dim  
A
A1  
A3  
b
D
D2  
e
D
–
–
0.13  
D2  
D2  
0.20 0.30 0.25  
1.95 2.075 2.00  
0.50 0.70 0.60  
–
–
0.65  
R
0
.150  
E
E2  
k
1.95 2.075 2.00  
0.90 1.10 1.00  
z1  
–
–
0.45  
L
z
z1  
0.25 0.35 0.30  
E
E2  
z1  
–
–
–
–
0.225  
0.175  
k
All Dimensions in mm  
L
e
z
b
Suggested Pad Layout  
U-DFN2020-6 (Type B)  
X2  
C
Value  
Dimensions  
(in mm)  
0.650  
0.150  
0.450  
0.350  
0.600  
1.650  
0.500  
1.000  
2.300  
C
G
G1  
X
X1  
X2  
Y
Y1  
Y2  
X1(2x)  
Y1(2x)  
Y2  
G
Y
G1  
X
7 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2  

DMP2090UFDB  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
8 of 8  
December 2019  
© Diodes Incorporated  
DMP2090UFDB  
Document number: DS42300
 
Rev. 2 – 2