Diodes-Incorporated-DMP2170U-7
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DMP2170U
20V P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
Low On-Resistance
I
D
max
BV
DSS
R
DS(ON)
max
Low Input Capacitance
T
A
= +25°C
Fast Switching Speed
90
mΩ
@ V
GS
= -4.5V
250
mΩ
@ V
GS
= -2.5V
-3.1A
-1.8A
Low Input/Output Leakage
-20V
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note
3)
Qualified to AEC-Q101 Standards for High Reliability
Description and Applications
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(R
DS(ON)
) and yet maintain superior switching performance, making it
ideal for high-efficiency power management applications.
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish
Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Terminals Connections: See Diagram Below
Weight: 0.009 grams (Approximate)
Battery Charging
Power Management Functions
DC-DC Converters
Portable Power Adaptors
D
S
SOT23
D
G
S
G
Top View
Top View
Internal Schematic
Ordering Information
(Note 4)
Part Number
DMP2170U-7
DMP2170U-13
Case
SOT23
SOT23
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html
for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green”
and Lead-free.
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlor
ine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
SOT23
7U = Product Type Marking Code
YM = Date Code Marking
Y or Y= Year (ex: D = 2016)
M = Month (ex: 9 = September)
7U
Date Code Key
Year
2016
2017
2018
2019
2020
2021
2022
2023
Code
D
E
F
G
H
I
J
K
Month
Code
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
V
DSS
Value
-20
Units
V
V
Gate-Source Voltage
±12
V
GSS
Steady
State
T
A
= +25°C
T
A
= +70°C
-3.1
-2.5
A
Continuous Drain Current (Note 6) V
GS
= -4.5V
I
D
Maximum Continuous Body Diode Forward Current (Note 6)
-1.25
-13
A
A
I
S
Pulsed Drain Current (10
s pulse, duty cycle = 1%)
I
DM
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Symbol
P
D
Value
0.78
163
1.28
99
Unit
W
°C/W
W
Steady State
Steady State
R
JA
P
D
°C/W
R
JA
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
-20
–
–
–
–
V
BV
DSS
I
DSS
V
GS
= 0V, I
D
= –
250μA
–
–
-1.0
±100
μ
A
nA
Zero Gate Voltage Drain Current T
J
= +25°C
Gate-Source Leakage
V
DS
= -20V, V
GS
= 0V
V
GS
= ±12V, V
DS
= 0V
I
GSS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
-0.4
-1.01
-1.25
V
m
Ω
V
V
GS(TH)
R
DS(ON)
V
SD
V
DS
= V
GS
, I
D
= -250
μA
V
GS
= -4.5V, I
D
= -3.5A
V
GS
= -2.7V, I
D
= -3.0A
V
GS
= -2.5V, I
D
= -2.6A
V
GS
= 0V, I
S
= -1A
62
92
101
90
180
250
Static Drain-Source On-Resistance
–
–
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
-0.8
-1.1
–
–
–
–
–
–
–
–
–
–
–
–
–
–
303
46
–
–
–
–
–
–
–
–
–
–
–
–
–
–
pF
pF
pF
Ω
C
iss
C
oss
C
rss
R
g
V
DS
= -10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
37
Reverse Transfer Capacitance
Gate Resistance
16
V
DS
= 0V, V
GS
= 0V, f = 1MHz
3.6
7.8
0.6
1.1
5.4
18.3
16.2
13.6
5.5
1.23
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
Total Gate Charge (V
GS
= -4.5V)
Total Gate Charge (V
GS
= -10V)
Gate-Source Charge
Q
g
Q
g
V
DS
= -10V, I
D
= -1.5A
Q
gs
Q
gd
t
D(ON)
t
R
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
V
DD
= -10V, V
GS
= -4.5V,
I
D
= -3.5A, R
G
= 6
Ω
Turn-Off Delay Time
t
D(OFF)
t
F
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
t
RR
I
S
= -2.0A, dI/dt = -100A/
μ
s
I
S
= -2.0A, dI/dt = -100A/
μ
s
Q
RR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
10.0
8.0
6.0
4.0
2.0
0.0
10
8
V
DS
= -5V
V
GS
= -3.0V
V
GS
= -2.5V
6
V
GS
= -4.5V
V
GS
= -8.0V
4
V
GS
= -2.0V
V
GS
= -1.5V
T
J
= 150
o
C
T
J
= 125
o
C
T
J
= 85
o
C
2
T
J
= 25
o
C
T
J
= -55
o
C
0
0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
0
0.5
1
1.5
2
2.5
3
V
GS
, GATE-SOURCE VOLTAGE (V)
V
DS
, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
Figure 2. Typical Transfer Characteristic
0.16
0.14
0.12
0.1
0.5
0.45
0.4
V
GS
= -2.5V
0.35
0.3
0.08
0.06
0.04
0.02
0
0.25
0.2
0.15
0.1
V
GS
= -4.5V
I
D
= -3.5A
0.05
0
0
2
4
6
8
10
0
2
4
6
8
10
12
I
D
, DRAIN-SOURCE CURRENT (A)
V
GS
, GATE-SOURCE VOLTAGE (V)
Figure 3. Typical On-Resistance vs Drain Current
and Gate Voltage
Figure 4. Typical Transfer Characteristic
0.11
0.09
0.07
0.05
0.03
1.8
1.6
1.4
1.2
1
V
GS
= -4.5V
T
J
= 150
o
C
V
GS
= -4.5V, I
D
= -3.5A
T
J
= 125
o
C
T
J
= 85
o
C
T
J
= 25
o
C
T
J
= -55
o
C
V
GS
= -2.5V, I
D
= -2.6A
0.8
0.6
-50
-25
0
25
50
75
100 125 150
0
2
4
6
8
10
I
D
, DRAIN CURRENT (A)
T
J
, JUNCTION TEMPERATURE (
℃
)
Figure 5. Typical On-Resistance vs Drain Current
and Junction Temperature
Figure 6. On-Resistance Variation with Junction
Temperature
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
0.16
0.14
0.12
0.1
1.4
1.2
1
V
GS
= -2.5V, I
D
= -2.6A
I
D
= -1mA
0.08
0.06
0.04
0.02
0.8
0.6
0.4
I
D
= -250µA
V
GS
= -4.5V, I
D
= -3.5A
-50 -25
0
25
50
75 100
125 150
-50 -25
0
25
50
75 100
125 150
T
J
, JUNCTION TEMPERATURE (
℃
)
T
J
, JUNCTION TEMPERATURE (
℃
)
Figure 7. On-Resistance Variation with Junction
Temperature
Figure 8. Gate Threshold Variation vs Junction
Temperature
1000
10
8
f = 1MHz
V
GS
= 0V
C
iss
6
100
C
oss
4
T
J
= 150
o
C
T
J
= 85
o
C
C
rss
2
T
J
= 25
o
C
T
J
= -55
o
C
T
J
= 125
o
C
10
0
0
5
10
15
20
0
0.3
0.6
0.9
1.2
1.5
V
SD
, SOURCE-DRAIN VOLTAGE (V)
V
DS
, DRAIN-SOURCE VOLTAGE (V)
Figure 10. Typical Junction Capacitance
Figure 9. Diode Forward Voltage vs. Current
10
8
100
10
P
W
= 10ms
P
W
= 1ms
R
DS(ON)
Limited
P
W
= 100ms
P
W
=100µs
6
1
DC
4
P
W
= 10s
T
J(Max)
= 150
℃
T
C
= 25
℃
Single Pulse
DUT on 1*MRP Board
V
GS
= -4.5V
V
DS
= -10V, I
D
= -1.5A
0.1
0.01
P
W
= 1s
2
0
0.1
1
10
100
0
2
4
6
8
V
DS
, DRAIN-SOURCE VOLTAGE (V)
Figure 12. SOA, Safe Operation Area
Q
g
(nC)
Figure 11. Gate Charge
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
1
D=0.9
D=0.7
D=0.5
D=0.3
0.1
D=0.1
D=0.05
D=0.02
D=0.01
0.01
D=0.005
R
θ
JA
(t) = r(t) * R
θ
JA
R
θ
JA
= 163
℃
/W
Duty Cycle, D = t1/t2
D=Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13. Transient Thermal Resistance
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
Package Outline Dimensions
SOT23
All 7°
H
SOT23
GAUGE PLANE
Dim
A
B
C
D
F
G
H
Min
Max
0.51
1.40
2.50
1.03 0.915
0.60 0.535
Typ
0.40
1.30
2.40
0.25
J
0.37
1.20
2.30
0.89
0.45
1.78
2.80
K
K1
a
M
A
L
L1
2.05
3.00
1.83
2.90
0.05
J
0.013 0.10
K
K1
L
L1
M
a
0.890 1.00 0.975
0.903 1.10 1.025
C
B
0.45
0.25
0.61
0.55
0.55
0.40
0.085 0.150 0.110
0° 8°
—
D
All Dimensions in mm
G
F
Suggested Pad Layout
SOT23
Y
Dimensions Value
(in mm)
C
X
2.0
0.8
X1
Y
1.35
0.9
Y1
C
Y1
2.9
X
X1
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
DMP2170U
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others.
Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending.
Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference.
Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated.
Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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June 2016
© Diodes Incorporated
DMP2170U
Document number: DS38558
Rev. 1 – 2
