Diodes-Incorporated-DMP2225L-7

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Diodes-Incorporated-DMP2225L-7
DMP2225L  
P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
I

D  

Low On-Resistance  
V

(BR)DSS  

R

DS(ON)  

Package  
T

A

= +25°C  
Low Input Capacitance  
-2.6A  
-2.0A  
110m
Ω
@ V

GS

= -4.5V  
225m
Ω
@ V

GS

= -2.5V  
-20V  
SOT23  
Fast Switching Speed  
Low Input/Output Leakage  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Description  
Qualified to AEC-Q101 Standards for High Reliability  
PPAP Capable (Note 4)  
This new generation MOSFET has been designed to minimize the on-  
state resistance (R

DS(ON)

and yet maintain superior switching  
)
performance, making it ideal for high efficiency power management  
applications.  
Mechanical Data  
Case: SOT23  
Case Material: Molded Plastic, “Green” Molding Compound.
 
UL  
Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish — Matte Tin annealed over Copper leadframe.  
Solderable per MIL-STD-202, Method 208  
Terminal Connections: See Diagram  
Applications  
General Purpose Interfacing Switch  
Power Management Functions  
Weight: 0.008 grams (approximate)  
Drain  
SOT23  
D
Gate  
S
G
Source  
Top View  
Top View  
Equivalent Circuit  
Ordering Information
(Note 4& 5)  
Part Number  
DMP2225L
-7  
DMP2225LQ
-7  
Qualification  
Standard  
Automotive  
Case  
SOT-23  
SOT-23  
Packaging  
3000/Tape & Reel  
3000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. S

more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green”  
and Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the  
same, except where specified. For more information, please refer

5. For packaging details, go to our website at

Marking Information  
2P2 = Product Type Marking Code  
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)  
2P2  
Y
̅
M = Date Code Marking for CAT (Chengdu Assembly/ Test site)  
Y or Y = Year (ex: A = 2013)  
M = Month (ex: 9 = September)  
̅
Shanghai A/T Site  
Chengdu A/T Site  
Date Code Key  
Year  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
V
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2  

DMP2225L  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
V

DSS  

V

GSS  

Value  
-20  
±12  
-2.6  
-2  
Units  
V
V
Stead  
State  
T

A

= +25°C  
T

A

= +70°C  
Continuous Drain Current (Note 6)  
Pulsed Drain Current (Note 7)  
I

D  

A
A
I

DM  

8
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 6)  
Symbol  
P

D  

Value  
1.08  
Units  
W
115  
°C/W  
°C  
Thermal Resistance, Junction to Ambient
 
@T

A

= +25°C (Note 6)  
Operating and Storage Temperature Range  
R

θ
JA  

-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-20  
—
-6  
—
—
—
—
—
—
-800  
—
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= -250µA  
nA  
V

DS

= -20V, V

GS

= 0V  
V

DS

≤
-5V, V

GS

= -4.5V  
V

DS

≤
-5V, V

GS

= -2.5V  
V

GS

= ±12V, V

DS

= 0V  
On-State Drain Current  
A
I

D(ON)  

I

GSS  

-3  
—
Gate-Source Leakage  
—
±80  
nA  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.45  
—
—
-1.25  
V
V

GS(th)  

V

DS

= V

GS

, I

D

= -250µA  
V

GS

= -4.5V, I

D

= -2.6A  
V

GS

= -2.5V, I

D

= -2.0A  
V

DS

= -5V, I

D

= -2.6A  
V

GS

= 0V, I

S

= -2.6A  
80  
165  
110  
225  
Static Drain-Source On-Resistance  
m
Ω  
R

DS (ON)  

Forward Transfer Admittance  
Diode Forward Voltage (Note 7)  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
—
—
4
—
S
V
|Y

fs

|  
V

SD  

—
-1.26  
—
—
—
—
—
—
—
250  
88  
—
—
—
16  
5.3  
—
—
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= -10V, V

GS

= 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
58  
12  
V

GS

= 0V, V

DS

= 0V, f = 1MHz  
V

GS

= -4.5V, V

DS

= -10V,  
Total Gate Charge  
4.3  
0.9  
2.1  
Q

g  

Gate-Source Charge  
nC  
Q

gs  

Q

gd  

I

D

= -2.7A  
Gate-Drain Charge  
Notes:  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
7. Repetitive rating, pulse width limited by junction temperature.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to production testing.  
2 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2  

DMP2225L  
10  
8
6
5
4
V
= -10V  
GS  
V
= -5V  
DS  
V
= -5.0V  
GS  
Pulsed  
V
= -4.0V  
GS  
6
4
3
2
V
= -2.5V  
GS  
2
0
V
= -2.0V  
= -1.5V  
GS  
1
T
= 150°C  
A
T
= 25°C  
A
T
= 85°C  
V
A
GS  
T
= -55°C  
A
0
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
-V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1
 
Typical Output Characteristics  
2
2.5  
3
3.5  
4
4.5  
5
-V

GS

, GATE SOURCE VOLTAGE (V)  
Figure 2
 
Typical Transfer Characteristics  
1
1,000  
100  
10  
f = 1 MHz  
V
= 0V  
GS  
V
= -2.5V  
GS  
C
iss  
V
= -4.5V  
0.1  
GS  
C
oss  
C
V
= -10V  
GS  
rss  
0.01  
0
2
4
6
8
10 12 14 16 18 20  
0.01  
0.1  
1
10  
-I

D

, DRAIN CURRENT (A)  
-V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 4
 
Typical
T
otal Capacitance  
Figure 3
 
O
n-Resistance vs. Drain Current and Gate Voltage  
1.2  
1.5  
V
= -4.5V  
1.4  
1.3  
1.2  
1.1  
GS  
1.1  
I
= -3.0A  
D
-I =
 
250
µ
A  
D
V
I
= -10V  
1
0.9  
0.8  
GS  
= -5.0A  
D
V
= -2.5V  
GS  
I
= -1.0A  
D
1
0.9  
0.7  
0.6  
0.5  
0.8  
0.7  
0.6  
-50 -25  
T

A

, AMBIENT TEMPERATURE (°C)  
Figure 5
 
Gate Threshold Voltage vs. Ambient
T
emperature  
0
25  
50  
75 100
 
125 150  
-55  
25  
85  
125  
150  
T

A

, AMBIENT TEMPERATURE (C)  
Figure 6
 
Normalized Static Drain-Source On-Resistance  
vs. Ambient
T
emperature  
3 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2  

DMP2225L  
5
10  
8
4.5  
4
3.5  
3
V
= -10V  
= -3A  
DS  
I
D
6
2.5  
2
4
2
0
1.5  
1
0.5  
0.5  
0
2
4
6
8
10  
12  
14  
0.6  
0.7  
0.8  
0.9  
1
Q

g

, TOTAL GATE CHARGE (nC)  
-V

SD

, SOURCE DRAIN VOLTAGE (V)  
Figure 8
 
Gate-Charge Characteristics  
Figure 7
 
Reverse Drain Current vs. Source-Drain Voltage  
100  
R
DS(on)  
Limited  
10  
DC  
1
P
= 10s  
W
P
= 1s  
W
P
= 100ms  
W
P
= 10ms  
W
0.1  
P
= 1ms  
W
P
= 100µs  
W
T
T
= 150°C  
J(max)  
= 25°C  
P
= 10µs  
A
W
Single Pulse  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 9
 
Safe Operation Area  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
D = 0.05  
R
(t) = r(t) * R  
JA  
JA  
R
= 163°C/W  
JA  
D = 0.02  
P(pk)  
T
0.01

D = 0.01  

t
1
t
2
– T
 
= P * R
 
(t)  
J
A
JA  
D = 0.005  
Duty Cycle, D = t
 
/t  
1
2
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t

1

, PULSE DUR
A
T
ION TIME (s)  
Figure 10
 
Transient Thermal Response  
4 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2  

DMP2225L  
Package Outline Dimensions  
SOT23  
A
Dim  
A
B
C
D
F
G
H
J
K
Min  
Max  
0.51  
1.40  
2.50  
1.03 0.915  
0.60 0.535  
Typ  
0.40  
1.30  
2.40  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
C
B
2.05  
3.00  
1.83  
2.90  
0.05  
1.00  
0.400  
0.55  
0.11  
–
H
G
0.013 0.10  
0.903 1.10  
M
K
J
K1  
K1  
L
M
–
–
D
0.45  
0.61  
F
L
0.085 0.18  
0° 8°  
  
All Dimensions in mm  
Suggested Pad Layout  
Y
Dimensions Value
 
(in mm)  
Z
X
Y
C
E
2.9  
0.8  
0.9  
2.0  
1.35  
Z
C
E
X
5 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2  

DMP2225L  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others.
 
Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending.
 
Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference.
 
Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated.
 
Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2013, Diodes Incorporated  
6 of 6  
October 2013  
© Diodes Incorporated  
DMP2225L  
Document number: DS31461
 
Rev. 6 – 2