Diodes-Incorporated-DMP3015LSS-13
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NOT RECOMMENDED FOR NEW DESIGN
DMP3015LSS
SINGLE P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
•
•
•
•
•
•
•
•
Low On-Resistance
I
D
max
V
(BR)DSS
R
DS(ON)
max
Low Gate Threshold Voltage
T
A
= +25°C
Low Input Capacitance
11m
Ω @ V
GS
= -10V
17m
Ω @ V
GS
= -4.5V
-13A
Fast Switching Speed
-30V
Low Input/Output Leakage
-9.9A
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Description
Mechanical Data
This MOSFET is designed to minimize the on-state resistance
(R
DS(on)
) yet maintain superior switching performance, making it
ideal for high-efficiency power management applications.
•
•
Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals Connections: See Diagram
•
•
•
Applications
Terminals: Finish—Matte Tin Annealed over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.074g (Approximate)
•
•
•
Backlighting
Power Management Functions
DC-DC Converters
•
D
SO-8
S
S
S
G
D
D
D
D
G
Top View
S
Top View
Internal Schematic
Equivalent Circuit
Ordering Information
(Note 4)
Part Number
Case
Packaging
DMP3015LSS-13
SO-8
2500/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See
https://www.diodes.com/quality/lead-free/ fo
r more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and
Lead-free.
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
8
5
8
5
= Manufacturer’s Marking
P3015LS = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Year (ex: 13 = 2013)
WW = Week (01 – 53)
YY = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
P3015LS
YY WW
P3015LS
YY
WW
1
4
1
4
Chengdu A/T Site
Shanghai A/T Site
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
DMP3015LSS
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
V
DSS
Value
-30
Units
V
V
Gate-Source Voltage
V
GSS
±
20
Drain Current (Note 5)
Steady
State
T
A
= +25°C
T
A
= +70°C
-13
-9.75
A
A
I
D
Pulsed Drain Current (Note 6)
-45
I
DM
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Symbol
P
D
Value
2.5
Unit
W
Thermal Resistance, Junction to Ambient
50
°C/W
R
ϴ
JA
Operating and Storage Temperature Range
-55 to +150
°C
T
J,
T
STG
Notes:
5. Device mounted on 2 oz. copper pads on FR-4 PCB with R
ϴ
JA
= 50°C/W.
6. Pulse width
≤
10
μ
s, duty cycle
≤
1%.
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
-30
—
—
—
—
—
-1
V
BV
DSS
I
DSS
V
GS
= 0V, I
D
= -250
μ
A
µ
A
nA
V
DS
= -30V, V
GS
= 0V
—
I
GSS
±
100
V
GS
=
±
20V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
-1
—
—
9
14
—
-2
V
V
GS(th)
V
DS
= V
GS
, I
D
= -250
μ
A
11
17
V
GS
= -10V, I
D
= -13A
V
GS
= -4.5V, I
D
= -10A
Static Drain-Source On-Resistance
m
Ω
R
DS (ON)
Forward Transconductance
Diode Forward Voltage (Note 7)
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
—
15
—
—
S
V
g
fs
V
DS
= -15V, I
D
= -8A
V
GS
= 0V, I
S
= -2.1A
-0.5
-1.1
V
SD
—
—
—
2748
357
—
—
—
pF
pF
pF
C
iss
C
oss
C
rss
V
DS
= -20V, V
GS
= 0V
f = 1.0MHz
Output Capacitance
Reverse Transfer Capacitance
356
V
DS
= 0V, V
GS
= 0V
f = 1.0MHz
Gate Resistance
—
2.0
—
Ω
R
G
SWITCHING CHARACTERISTICS (Note 8)
Total Gate Charge
—
—
—
—
V
DS
= -10V, V
GS
= -4.5V, I
D
= -13A
V
DS
= -10V, V
GS
= -10V, I
D
= -13A
V
DS
= -10V, V
GS
= -10V, I
D
= -13A
V
DS
= -10V, V
GS
= -10V, I
D
= -13A
30.0
60.4
Q
g
nC
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
—
—
—
—
—
—
7.2
16.4
11.2
12.4
104.9
61.7
—
—
—
—
—
—
Q
gs
Q
gd
t
d(on)
t
r
V
DS
= -15V, V
GS
= -10V,
I
D
= -1A, R
G
= 6.0
Ω
ns
Turn-Off Delay Time
Fall Time
t
d(off)
t
f
Notes:
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
DMP3015LSS
20.0
16.0
12.0
I
(A) @ V
= 10V
GS
D
V
= -5.0V
DS
I
(A) @ V
= 4.5V
GS
D
I
(A) @ V
= 4.0V
GS
D
I
(A) @ V
= 3.5V
GS
D
I
(A) @ V
= 3.0V
GS
D
8.0
T
= 85
°
C
A
T
= 125
°
C
A
4.0
0.0
T
= 25
°
C
A
T
= 150
°
C
A
T
= -55
°
C
I
(A) @ V
= 2.5V
GS
A
D
0
0.5
1
1.5
2
2.5
3
V
DS
, DRAIN-SOURCE VOL
T
A
GE (V)
Fig.1 Typical Output Characteristics
T
= 150
°
C
A
T
= 125
°
C
A
T
= 85
°
C
A
V
= -4.5V
GS
T
= 25
°
C
A
V
= -10V
GS
T
= -55
°
C
A
V
= -4.5V
GS
10,000
1,000
100
f = 1MHz
C
iss
C
oss
V
I
= -4.5V
GS
= -5A
D
C
rss
V
I
= -10V
GS
= -10A
D
0
5
10
15
20
25
30
V
DS
, DRAIN-SOURCE VOLTAGE (V)
Fig. 6 Typical
T
o
tal Capacitance
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
DMP3015LSS
V
= 0V
GS
I
= -250mA
D
I
= -1mA
D
D = 0.7
D = 0.5
D = 0.3
D = 0.9
T
= 85
°
C
A
D = 0.1
D = 0.05
R
θ
JA
(t) = r(t) * R
θ
JA
= 91°C/W
D = 0.02
D = 0.01
R
θ
JA
P(pk)
T
t
1
D = 0.005
t
2
– T
= P * R
(t)
J
A
θ
JA
Duty Cycle, D = t
/t
1
2
D = Single Pulse
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
DMP3015LSS
Package Outline Dimensions
SO-8
SO-8
Dim
A
A1
b
c
D
Min
1.40
0.10
0.30
0.15
4.85
5.90
3.80
3.85
—
Max
1.50
0.20
0.50
0.25
4.95
6.10
3.90
3.95
—
Typ
1.45
0.15
0.40
0.20
4.90
6.00
3.85
3.90
1.27
0.35
0.72
0.65
E
1
E
b
E1
E0
e
h
L
E1
h
)
s
de
i
Q
s
l
l
A
(
–
—
0.82
0.70
7°
9°
c
0.62
0.60
Q
4°±3°
A
All Dimensions in mm
Gauge Plane
Seating Plane
L
A1
e
E0
D
Suggested Pad Layout
SO-8
X1
Dimensions Value
(in mm)
C
X
X1
Y
1.27
0.802
4.612
1.505
6.50
Y1
Y1
Y
C
X
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
DMP3015LSS
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
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December 2018
© Diodes Incorporated
DMP3015LSS
Document number: DS31472 Rev. 7 – 3
