Diodes-Incorporated-DMP34M4SPS-13

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Diodes-Incorporated-DMP34M4SPS-13
DMP34M4SPS  
Green  
30V P-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features  
100% Unclamped Inductive Switch (UIS) Test in Production  
Thermally Efficient Package-Cooler Running Applications  
High Conversion Efficiency  
I

D  

BV

DSS  

R

DS(ON)  

T

C

= +25°C  
3.8
mΩ @ V

GS

= -10V  
6.0
mΩ @ V

GS

= -5V  
-87A  
-71A  
Low R

DS(ON)

–
Minimizes On State Losses  
-30V  
<1.1mm Package Profile
–
Ideal for Thin Applications  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen
and Antimony Free. “Green” Device (Note
3)  
Description  
This new generation MOSFET is designed to minimize R

DS(ON)

and  
yet maintain superior switching performance. This device is ideal for  
use in notebook battery power management and load switch.  
Mechanical Data  
®
Case: PowerDI
 
5060-8  
Case Material:
Molded Plastic, “Green” Molding Compound
;  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish – Matte Tin Annealed over Copper Leadframe;  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
Applications  
Switch  
PowerDI5060-8  
D
S
S
D
D
D
D
Pin1  
S
G
G
S
Top View  
Pin Configuration  
Internal Schematic  
Bottom View  
Top View  
Ordering Information
(Note 4)  
Part Number  
DMP34M4SPS-13  
Case  
PowerDI5060-8  
Packaging  
2,500 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those
which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
PowerDI5060-8  
D D  
D
D
= Manufacturer
’
s Marking  
P34M4SS = Product Type Marking Code  
P34M4SS  
YY WW  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
-30  
Unit  
V
Gate-Source Voltage  
±25  
V
V

GSS  

T

C

= +25°C  
-87  
-71  
A
A
I

D  

Continuous Drain Current, V

GS

= -10V (Note
7) (Package Limited)  
T

C

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
-21  
-17  
I

D  

I

DM  

I

S  

Continuous Drain Current, V

GS

= -10V (Note 6)  
Pulsed Drain Current (380
μ
s Pulse, Duty Cycle = 1%)  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Body Diode Forward Current (380
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.1mH (Note 8)  
-350  
-2.9  
-350  
-60  
A
A
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy, L = 0.1mH (Note 8)  
180  
mJ  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

R

  

Value  
1.5  
Unit  
W
Steady State  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
94  
3.0  
°C/W  
W
JA  
P

D  

R

  

Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
47  
°C/W  
W
JA  
100  
P

D  

R

  

Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
1.4  
°C/W  
°C  
JC  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-30  
—
—
—
—
—
-1  
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= -250µA  
V

DS

= -24V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
µA  
nA  
—
±100  
I

GSS  

ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-1.6  
—
—
2.9  
4.9  
-0.7  
-2.6  
3.8  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= -250µA  
V

GS

= -10V, I

D

= -20A  
V

GS

= -5V, I

D

= -20A  
V

GS

= 0V, I

S

= -1A  
Static Drain-Source On-Resistance  
—
6.0  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
—
-1.2  
—
—
—
—
—
—
—
—
—
—
—
—
—
3,775  
932  
500  
21  
—
—
—
—
—
—
—
—
—
—
—
—
—
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= -15V, V

GS

= 0V  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0
V
, f =
1
MHz  
Total Gate Charge  
127  
24.5  
28.5  
6.9  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Q

g  

V

DS

= -15
V
,
V

GS

= -10V,  
I

D

= -20A  
Gate-Source Charge  
Gate-Drain Charge  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Turn-On Delay Time  
4.0  
Turn-On Rise Time  
V

DD

= -15V, V

GEN

= -10
V
,  
R

GEN

= 3
Ω,
I

D

= -20A  
Turn-Off Delay Time  
372  
160  
26.5  
37.3  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
t

RR  

I

F

= -20A, di/dt = 500A/µs  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

DS

= -5V  
V

GS

= -4.5V  
V

GS

= -6.0V  
V

GS

= -10.0V  
V

GS

= -3.8V  
T

J

= 125
℃  
T

J

= 85
℃  
T

J

= 25
℃  
V

GS

= -3.5V  
T

J

= 150
℃  
V

GS

= -3.2V  
4 5  
T

J

= -55
℃  
0
0.0  
1.5  
2
2.5  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
3
3.5  
4
4.5  
5
0
1
2
3
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
0.008  
0.007  
0.006  
0.1  
0.08  
0.06  
0.04  
0.02  
0
V
= -5V  
GS  
T
= 150°C  
= 125°C  
A
T
A
T
= 85°C  
= 25°C  
A
A
0.005  
0.004  
0.003  
0.002  
T
T
= -55°C  
A
I

D

= -20A  
0
2
4
6
8
10 12 14 16 18 20  
0
5
10  
I

D

, DRAIN CURRENT (A)  
Figure 3
T
y
pical On-Resistance vs.  
15  
20  
25  
30  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Drain Current and Junction
T
e
m
p
e
r
a
ture  
0.008  
0.005  
0.0045  
0.004  
V

GS

= -10V  
T

J

= 150
℃  
V
I
= -5V  
GS  
0.006  
0.004  
0.002  
= -20A  
D
T

J

= 125
℃  
T

J

= 85
℃  
0.0035  
0.003  
T

J

= 25
℃  
T

J

= -55
℃  
0.0025  
0.002  
V
= -10V  
= -20A  
GS  
I
D
0.0015  
0.001  
0
–
5
0
–
2
5  
0
25  
50  
75 100
 
125 150  
0
5
10  
15  
20  
25  
30  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 6 On-Resistance Variation with Junction
T
e
m
p
e
r
a
ture  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
3 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
1.6  
1.4  
1.2  
1
3
2.8  
2.6  
2.4  
2.2  
2
I

D

= -1mA  
V
= -10V  
GS  
= -20A  
I
D
I

D

= -250
μ
A  
1.8  
1.6  
1.4  
1.2  
1

GS

= -5V  
= -20A  

D

V
I
0.8  
0.6  
-50  
-25  
0
25  
50  
75  
100 125 150  
–
5
0
–
2
5  
0
25  
50  
75 100 125
 
150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 7 On-Resistance Variation with Junction
T
e
m
p
e
r
a
ture  
30  
25  
20  
15  
10  
5
10000  
f = 1MHz  
V

GS

= 0V  
C

iss  

C

oss  

1000  
T

J

= 85

o

C  
T

J

= 125

o

C  
C

rss  

T

J

= 25

o

C  
T

J

= 150

o

C  
T

J

= -55

o

C  
100  
0
0
5
10  
15  
20  
25  
30  
0
0.3  
0.6  
0.9  
1.2  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
1000  
100  
10  
10  
9
8
7
6
5
4
3
2
1
0
P

W

= 10µs  
P

W

= 1µs  
R

DS(ON)

Limited  
P

W

= 100µs  
P

W

= 1ms  
P

W

= 10ms  
P

W

= 100ms  
V

DS

= -15V, I

D

= -20A  
1
DC  
10  
T

J(Max)

= 150
℃
T

C

= 25
℃  
Single Pulse  
DUT on Infinite Heatsink  
V

GS

= -10V  
0.1  
0
20  
40  
60  
Q

g

(nC)  
Figure 11. Gate Charge  
80  
100  
120  
140  
0.1  
1
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
4 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
0.001  
D=0.01  
D=0.005  
R

θ
JC

(t) = r(t) * R

θ
JC  

R

θ
JC

= 1.4
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI5060-8  
D
D1  
PowerDI5060-8  
Detail A  
c
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
Typ  
1.00  
0( 4X)  
A1  
0.41  
E1 E  
0.330 0.277  
5.15 BSC  
e
D
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
5.10  
4.10  
4.30  
6.15 BSC  
6.00  
3.68  
4.39  
1.27 BSC  
0.71  
  
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12°  
8°  
4.90  
3.90  
4.10  
01 (
 
4X)  
1
b (
 
8X)  
L
e/2  
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
1
b2 (
 
4X)  
D3  
K
0.51  
0.51
  
0.51  
0.100  
3.235  
1.00  
10°  
0.61  
0.61  
A
D2  
b3 (
 
4X)  
E3  
E2  
M
M1  
Detail A  
M1  
Θ
Θ1  
1.21  
11°  
7°  
G
L1  
6°  
All Dimensions in mm  
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI5060-8  
X4  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
Y2  
X3  
C
G
G1  
X
Y3  
Y1  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
6 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

DMP34M4SPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
February 2019  
© Diodes Incorporated  
DMP34M4SPS  
Document number: DS39884
 
Rev. 5 – 2  

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