Diodes-Incorporated-DMP4015SPSQ-13

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Diodes-Incorporated-DMP4015SPSQ-13
NOT RECOMMENDED FOR NEW DESIGN  
Green  
DMP4015SPSQ  
40V P-CHANNEL ENHANCEMENT MODE MOSFET  
POWERDI

®  

Product Summary  
Features and Benefits  
•
•
•
•
•
•
•
100% Unclamped Inductive Switch (UIS) Test in Production  
Low On-Resistance  
I

D  

V

(BR)DSS  

R

DS(ON)

Max  
T

A

= +25°C  
Fast Switching Speed  
-17.0A  
-14.5A  
11m
Ω
@ V

GS

= -10V  
15m
Ω
@ V

GS

= -4.5V  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
PPAP Capable (Note 4)  
-40V  
Description  
Mechanical Data  
•
•
Case: PowerDI

®

5060-8  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) yet maintain superior switching performance,  
making it ideal for high-efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish—100% Matte Tin Annealed over Copper  
Leadframe. Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
•
•
Applications  
•
•
•
•
DC-DC Converters  
Power Management Functions  
Analog Switch  
PowerDI5060-8  
D
S
D
Pin1  
S
S
G
D
G
D
D
S
Internal Schematic  
Top View  
Pin Configuration  
Bottom View  
Top View  
Ordering Information
(Note 5)  
Part Number  
DMP4015SPSQ-13  
Compliance  
Automotive  
Case  
PowerDI5060-8  
Packaging  
2,500/Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  
2. Se

r more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and  
Lead-free  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer t

5. For packaging details, go to our website at

PowerDI is a registered trademark of Diodes Incorporated.  
1 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
Marking Information  
D
D
D
D
= Manufacturer’s Marking  
P4015SP = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Year (ex: 18 = 2018)  
P4015SP  
YY WW  
WW = Week (01 – 53)  
G
S
S
S
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
-40  
Units  
V
V
Gate-Source Voltage  
±25  
V

GSS  

Steady  
State  
T

A

= +25°C  
-8.5  
-6.8  
A
A
A
A
I

D  

I

D  

I

D  

I

D  

T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
Continuous Drain Current (Note 6) V

GS

= -10V  
Continuous Drain Current (Note 7) V

GS

= -10V  
-13.0  
-10.5  
t<10s  
Steady  
State  
-11.0  
-8.7  
-17.0  
-13.5  
t<10s  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Maximum Body Diode Continuous Current (Note 7)  
Avalanche Current (Note 8)  
-100  
-3.5  
-22  
A
A
I

DM  

I

S  

A
I

AS  

E

AS  

Avalanche Energy (Note 8)  
242  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
1.3  
Units  
T

A

= +25°C  
Total Power Dissipation (Note 6)  
W
P

D  

R

ϴ
JA  

P

D  

0.8  
96.4  
40.6  
T

A

= +70°C  
Steady State  
t<10s  
T

A

= +25°C  
T

A

= +70°C  
Steady State  
t<10s  
°C/W  
°C/W  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
2.1  
W
1.4  
55.0  
24.0  
4.15  
°C/W  
°C/W  
°C/W  
°C  
Thermal Resistance, Junction to Ambient (Note 7)  
R

ϴ
JA  

Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
R

ϴ
JC  

-55 to +150  
T

J,

T

STG  

Notes:  
6. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided.  
7. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
8. UIS in production with L = 0.1mH, TJ = +25°C.  
2 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
—
—
—
-40  
—
—
-1  
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= -250
μ
A  
µ
A  
nA  
V

DS

= -40V, V

GS

= 0V  
—
I

GSS  

±
100  
V

GS

=
±
25V, V

DS

= 0V  
ON CHARACTERISTICS
(Note 9)  
Gate Threshold Voltage  
-1.5  
—
-2  
7
-2.5  
11  
15  
—
V
V

GS(th)  

V

DS

= V

GS

, I

D

= -250
μ
A  
V

GS

= -10V, I

D

= -9.8A  
V

GS

= -4.5V, I

D

= -9.8A  
V

DS

= -20V, I

D

= -9.8A  
V

GS

= 0V, I

S

= -1A  
Static Drain-Source On-Resistance  
m
Ω  
R

DS(ON)  

—
9
—
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 10)  
Input Capacitance  
26  
-0.7  
S
V
|Y

fs

|  
V

SD  

—
-1  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4,234  
1,036  
526  
C

iss  

C

oss  

C

rss  

R

G  

V

DS

= -20V, V

GS

= 0V  
f = 1MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
7.77  
47.5  
14.2  
13.5  
13.2  
10  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge  
Q

g  

V

DS

= -20V, V

GS

= -5V  
I

D

= -9.8A  
Gate-Source Charge  
Gate-Drain Charge  
nC  
Q

gs  

Q

gd  

t

D(on)  

t

r  

Turn-On Delay Time  
Turn-On Rise Time  
V

GS

= -10V, V

DD

= -20V, R

G

= 6
Ω
,  
I

D

= -1A, R

L

= 20
Ω  
ns  
Turn-Off Delay Time  
302.7  
137.9  
t

D(off)  

t

f  

Turn-Off Fall Time  
Notes:  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to production testing.  
3 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
30  
25  
30  
25  
20  
15  
10  
5
-V =4.0V  
GS  
-V =3.5V  
GS  
20  
15  
-V =4.5V  
GS  
-V =10V  
GS  
-V =3.0V  
GS  
10  
5
0
0
0
0.5  
1
1.5  
2
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
-V

DS

, DRAIN -SOURCE VOLTAGE(V)  
Fig. 1 Typical Output Characteristics  
-V

GS

, GATE-SOURCE VOL
T
A
GE (V)  
Fig. 2 Typical Transfer Characteristics  
0.02  
0.015  
0.01  
0.005  
0
0.02  
0.015  
0.01  
T
= 150
°
C  
A
-V =
 
4.5V  
GS  
T
= 125
°
C  
A
T
= 85
°
C  
A
T
= 25
°
C  
A
T
= -55
°
C  
A
0.005  
0
0
0
5
10  
15  
20  
25  
30  
5
10  
15  
20  
25  
30  
-I

D

, DRAIN SOURCE CURRENT  
-I

D

, DRAIN SOURCE CURRENT (A)  
Fig. 3
 
Typical On-Resistance vs.  
Drain Current and Gate Voltage  
Fig. 4
 
Typical On-Resistance vs.  
Drain Current and
T
e
mperature  
1.6  
0.02  
0.016  
0.012  
0.008  
0.004  
0
-V =
 
4.5V  
GS  
-I =
 
5.0A  
1.4  
1.2  
D
V
I
= 10V  
GS  
= 10A  
1
0.8  
0.6  
D
-50 -25  
0
25  
50  
75  
100 125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPER
A
T
URE (
°
C)  
Fig. 6
 
On-Resistance Variation with
T
e
mperature  
T

J

, JUNCTION TEMPER
A
T
URE (
°
C)  
Fig. 5
 
On-Resistance Variation with
T
e
mperature  
4 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
2.4  
30  
25  
20  
15  
2
1.6  
1.2  
10  
5
0.8  
0.4  
0
0
0
-50 -25  
0
25  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 7 Gate Threshold Variation vs. Ambient
T
emperature  
50  
75 100
 
125 150  
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
-V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Fig. 8 Diode Forward Voltage vs. Current  
10000  
10000  
f=
1
MHz  
T
=150°C  
A
C
iss  
1000  
100  
T
=125°C  
T
A
=85°C  
A
C
o
s
s  
1000  
C
10  
1
r
s
s  
T
=25°C  
A
100  
10  
0.1  
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
Fig. 9
T
y
pical Junction Capacitance  
-V

DS

, DRAIN-SOURCE VOLTAGE(V)  
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage  
90  
600  
500  
Starting Temperature (T ) = 25°C  
J
80  
70  
8
6
E
AS  
400  
300  
200  
60  
50  
40  
4
2
I
AS  
30  
20  
100  
0
10  
0
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
 
1.0  
INDUCTOR (mH)  
20  
40  
60  
80  
100  
120  
Q

g

, TOTAL GATE CHARGE (nC)  
Fig. 11 Gate-Charge Characteristics  
Fig. 12 Single-Pulse Avalanche
T
e
sted  
5 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
1
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.9  
R
(t) = r(t) * R  
θ
JA  
D = 0.05  
θ
JA  
R
= 97°C/W  
θ
JA  
D = 0.02  
D = 0.01  
D = 0.005  
P(pk)  
t
1
0.01  
t
2
T
– T
 
= P * R
 
(t)  
J
A
θ
JA  
Duty Cycle, D = t
 
/t  
1
2
DUT mounted on FR-4 PCB with  
minimum recommended pad layout  
D = Single Pulse  
0.001  
0.001  
0.01  
0.1  
1
10  
100  
1,000  
t

1

, PULSE DUR
A
T
ION TIME (s)  
Fig. 13 Transient Thermal Response  
6 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
Package Outline Dimensions  
Please see

the latest version.  
PowerDI5060-8  
PowerDI5060-8  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
0.330 0.277  
5.15 BSC  
5.10  
4.10  
4.30  
6.15 BSC  
6.00  
3.68  
4.39  
1.27 BSC  
0.71  
−
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12°  
8°  
Typ  
1.00  
−
D
D1  
Detail A  
c
0( 4X)  
A1  
0.41  
E1 E  
D
e
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
4.90  
3.90  
4.10  
01 (
 
4X)  
1
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b (
 
8X)  
L
e/2  
1
b2 (
 
4X)  
D3  
K
0.51  
0.51  
0.51  
0.100  
3.235  
1.00  
10°  
0.61  
−
0.61  
A
D2  
b3 (
 
4X)  
E3  
E2  
M
M1  
M1  
Θ
Θ1  
1.21  
11°  
7°  
Detail A  
G
L1  
6°  
All Dimensions in mm  
Suggested Pad Layout  
Please see

the latest version.  
PowerDI5060-8  
X4  
X3  
Y2  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
C
G
G1  
X
Y3  
Y1  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
7 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3  

DMP4015SPSQ  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
8 of 8  
December 2018  
© Diodes Incorporated  
DMP4015SPSQ  
Document number: DS36681 Rev. 4 – 3