Diodes-Incorporated-DMPH4029LFGQ-13

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Diodes-Incorporated-DMPH4029LFGQ-13
DMPH4029LFGQ  
Green  
40V 175°C
 
P-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8  
Product Summary  
Features and Benefits  
•
Rated to +175°C—Ideal for High Ambient Temperature  
Environments  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

A

= +25°C  
-8.0A  
•
100% Unclamped Inductive Switching Test in Production—  
Ensures More Reliable and Robust End Application  
Low R

DS(ON)

—Ensures On State Losses Are Minimized  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
29m
Ω
@ V

GS

= -10V  
45m
Ω
@ V

GS

= -4.5V  
-40V  
-6.0A  
•
•
•
Occupies Just 33% of the Board Area Occupied by SO-8 Enabling  
Smaller End Product  
•
•
•
•
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
PPAP Capable (Note 4)  
Description and Applications  
Mechanical Data  
®
•
•
Case: PowerDI
 
3333-8  
This MOSFET is designed to meet the stringent requirements of  
Automotive applications. It is qualified to AEC-Q101, supported by a  
PPAP and is ideal for use in:  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish—Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.072 grams (Approximate)  
•
•
•
•
•
•
Backlighting  
Power Management Functions  
DC-DC Converters  
•
D
PowerDI3333-8  
Pin 1  
S
S
S
G
G
D
D
D
D
S
Bottom View  
Top View  
Equivalent Circuit  
Ordering Information
(Note 5)  
Part Number  
Case  
Packaging  
DMPH4029LFGQ-7  
DMPH4029LFGQ-13  
2000/Tape & Reel  
3000/Tape & Reel  
PowerDI3333-8  
PowerDI3333-8  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  
2. Se

r more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds..  
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Refer to

5. For
 
packaging details, go to our website at

Marking Information  
H29= Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
H29  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
-40  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

Steady  
State  
T

A

= +25°C  
-8.0  
-6.7  
A
A
I

D  

T

A

= +70°C  
T

C

= +25°C  
T

C

= +70°C  
Continuous Drain Current (Note 7) V

GS

= -10V  
Steady  
State  
-22  
-18  
I

D  

I

DM  

I

S  

-88  
-2.0  
-88  
-25  
32  
A
A
Pulsed Drain Current (380
µ
s Pulse, Duty Cycle = 1%)  
Maximum Continuous Body Diode Forward Current (Note 7)  
Pulsed Source Current (380
µ
s Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 8) L = 0.1mH  
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy (Note 8) L = 0.1mH  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
Unit  
Total Power Dissipation (Note 6)  
1.2  
125  
85  
2.8  
W
P

D  

R

ϴ
JA  

P

D  

Steady State  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
°C/W  
W
t<10s  
Steady State  
t<10s  
54  
36  
6
Thermal Resistance, Junction to Ambient (Note 7)  
R

ϴ
JA  

°C/W  
°C  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
R

ϴ
JC  

-55 to +175  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-40  
—
—
—
—
—
-1  
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= –
250μA  
V

DS

= -40V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
µA  
nA  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
—
±100  
I

GSS  

ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
-1.0  
—
—
18  
-3.0  
29  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= -250
μA  
V

GS

= -10V, I

D

= -3A  
V

GS

= -4.5V, I

D

= -3A  
V

GS

= 0V, I

S

= -1A  
Static Drain-Source On-Resistance  
—
23  
45  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
—
-0.7  
-1.2  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1626  
135  
107  
11  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= -20V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
17  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (V

GS

= -4.5V)  
Total Gate Charge (V

GS

= -10V)  
Gate-Source Charge  
Q

g  

34  
Q

g  

V

DS

= -20V, I

D

= -3A  
3.7  
6.0  
3.9  
2.8  
83  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
V

GS

= -10V, V

DS

= -20V,  
R

G

= 3
Ω
, I

D

= -3A  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

30  
Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
17.3  
7.2  
I

F

= -3A, di/dt = 10
0A/μs  
I

F

= -3A, di/dt = 10
0A/μs  
t

RR  

Body Diode Reverse Recovery Charge  
Q

RR  

Notes:  
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
7. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10.Guaranteed by design. Not subject to product testing.  
2 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
V

GS

=-3.5V  
V

DS

=-5.0V  
V

GS

=-3.0V  
V

GS

=-4.0V  
V

GS

=-4.5V  
V

GS

=-5.0V  
V

GS

=-10V  
V

GS

=-2.5V  
V

GS

=-2.0V  
85
℃
 
125
℃  
150
℃  
25
℃  
-55
℃  
0.0  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.04  
0.1  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.03  
0.02  
0.01  
0
V

GS

=-4.5V  
V

GS

=-10V  
I

D

=-3.0A  
0
2
4
6
8
10 12 14 16 18 20  
2
4
6
8
10 12 14 16 18 20  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
Figure 4. Typical Transfer Characteristic  
2.5  
2
0.050  
V

GS

=-4.5V  
125
℃  
150
℃  
0.040  
0.030  
0.020  
0.010  
0.000  
V

GS

=-10V, I

D

=-10A  
V

GS

=-4.5V, I

D

=-5A  
85
℃  
25
℃  
1.5  
1
-55
℃  
0.5  
0
-50 -25  
0
25  
50  
75 100
 
125 150  
0
5
10  
15  
20  
25  
30  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
1.8  
1.6  
1.4  
1.2  
1
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
I

D

=-1mA  
V

GS

=-4.5V, I

D

=-5A  
I

D

=-250
μ
A  
V

GS

=-10V, I

D

=-10A  
0.8  
0.6  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
10000  
30  
125
℃  
150
℃  
1000  
100  
10  
25  
20  
15  
10  
5
85
℃  
25
℃  
V

GS

=0V, T

A

=125
℃  
V

GS

=0V, T

A

=150
℃  
V

GS

=0V,  
T

A

=85
℃  
1
V

GS

=0V,  
T

A

=25
℃  
0.1  
0.01  
V

GS

=0V, T

A

=-55
℃  
0
0
5
10  
15  
20  
25  
30  
35  
40  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 10. Typical Drain-Source Leakage Current vs.  
Voltage  
Figure 9. Diode Forward Voltage vs. Current  
10000  
1000  
100  
10  
8
f=1MHz  
C

iss  

6
C

oss  

4
V

DS

=-20V, I

D

=-3A  
C

rss  

2
10  
0
0
5
10  
15  
20  
25  
30  
35  
40  
0
5
10  
15  
Q

g

(nC)  
Figure 12. Gate Charge  
20  
25  
30  
35  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 11. Typical Junction Capacitance  
4 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
100  
10  
1
R

DS(ON)

Limited  
P

W

=1
μ
s  
P

W

=10
μ
s  
P

W

=100
μ
s  
P

W

=1ms  
P

W

=10ms  
P

W

=100ms  
DC  
T

J(MAX)

=175
℃
 
T

C

=25
℃  
Single Pulse  
DUT on infinite  
heatsink  
V

GS

= -10V  
0.1  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 13. SOA, Safe Operation Area  
1
D=0.5  
D=0.3  
D=0.9  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
R

θ
JA

(t)=r(t) * R

θ
JA  

R

θ
JA

=125
℃
/W  
Duty Cycle, D=t1 /
 
t2  
D=Single Pulse  
0.001  
0.001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 14. Transient Thermal Resistance  
5 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
Package Outline Dimensions  
Please see

the latest version.  
PowerDI3333-8  
A3  
A1  
A
PowerDI3333-8  
Dim Min
 
Max Typ  
0.75 0.85 0.80  
A1
0.00 0.05 0.02  
Seating Plane  
A
D
A3  
b
0.203  
0.27 0.37 0.32  
−
−
L( 4x)  
E4  
D2  
b2
0.15 0.25 0.20  
3.25 3.35 3.30  
D2
2.22 2.32 2.27  
3.25 3.35 3.30  
1
D
Pin #1 ID  
E
b2( 4x)  
E2
1.56 1.66 1.61  
E3
0.79 0.89 0.84  
E4
1.60 1.70 1.65  
E
E3  
E2  
e
L
0.65  
0.35 0.45 0.40  
−
−
L1  
z
0.39  
0.515  
−
−
−
−
L1( 3x)  
8
All Dimensions in mm  
z( 4x)  
b
e
Suggested Pad Layout  
Please see

the latest version.  
PowerDI3333-8  
X3  
X2  
8
Y4  
Dimensions Value
 
(in mm)  
C
X
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
X1  
Y1  
Y2  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y
1
X
C
6 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

DMPH4029LFGQ  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
March 2019  
© Diodes Incorporated  
DMPH4029LFGQ  
Document number: DS41599 Rev. 2 – 2  

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Authorized Distributor  
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