Diodes-Incorporated-DMT10H015LSS-13
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DMT10H015LSS
100V N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
100% Unclamped Inductive Switch (UIS) Test in Production
High Conversion Efficiency
I
D
BV
DSS
R
DS(ON)
Max
T
A
= +25°C
Low R
DS(ON)
–
Minimizes On-State Losses
Low Input Capacitance
8.3A
7.9A
16
mΩ @ V
GS
= 10V
18
mΩ
@ V
GS
= 6V
100V
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note
3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Description and Applications
Case: SO-8
This new generation N-Channel Enhancement Mode MOSFET is
designed to minimize R
DS(ON)
, yet maintain superior switching
performance. This device is ideal for use in notebook battery power
management and loadswitch.
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See Diagram
Terminals: Finish
–
Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.074 grams (Approximate)
Backlighting
Power Management Functions
DC-DC Converters
D
S
S
S
G
D
D
D
D
SO-8
G
S
Top View
Internal Schematic
Equivalent Circuit
Top View
Ordering Information
(Note 4)
Part Number
Case
Packaging
DMT10H015LSS-13
SO-8
2,500/Tape & Reel
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
http://www.diodes.com/quality/lead_free.html
fo
r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green”
and Lead-free.
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
8
5
= Manufacturer’s Marking
T1015LS = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Year (ex: 16 = 2016)
WW = Week (01 – 53)
T1015LS
YY WW
1
4
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
V
DSS
Value
100
Units
V
V
Gate-Source Voltage
±20
V
GSS
Steady
State
T
A
= +25°C
T
A
= +70°C
8.3
6.7
A
Continuous Drain Current (Note 6) V
GS
= 10V
I
D
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current (Note 8) L = 3mH
3
A
A
I
S
54
7.5
85
I
DM
I
AS
E
AS
A
Avalanche Energy (Note 8) L = 3mH
mJ
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 5)
Symbol
Value
1.2
Units
W
P
D
R
θ
JA
P
D
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
100
1.67
75
°C/W
W
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
°C/W
°C/W
R
θ
JA
R
θ
JC
T
J,
T
STG
12
-55 to +150
°C
Electrical Characteristics
(T
A
= +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS
(Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
100
—
—
—
—
—
1
V
BV
DSS
I
DSS
V
GS
= 0V, I
D
= 1mA
µA
nA
V
DS
= 80V, V
GS
= 0V
—
±100
I
GSS
V
GS
=
20V, V
DS
= 0V
ON CHARACTERISTICS
(Note 7)
Gate Threshold Voltage
1.4
—
—
—
—
2.3
12
3
V
m
Ω
V
V
GS(TH)
R
DS(ON)
V
SD
V
DS
= V
GS
, I
D
= 250
µ
A
V
GS
= 10V, I
D
= 20A
V
GS
= 6V, I
D
= 20A
V
GS
= 4.5V, I
D
= 5A
V
GS
= 0V, I
S
= 20A
16
18
25
1.3
Static Drain-Source On-Resistance
14.5
17
Diode Forward Voltage
DYNAMIC CHARACTERISTICS
(Note 8)
Input Capacitance
0.9
—
—
—
—
—
—
—
—
—
—
—
—
—
1,871
261
7
—
—
—
—
—
—
—
—
—
—
—
—
—
C
ISS
C
OSS
C
RSS
R
G
V
DS
= 50V, V
GS
= 0V
f = 1MHz
Output Capacitance
pF
Ω
Reverse Transfer Capacitance
Gate Resistance
0.75
33.3
6.9
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge
Q
G
V
DD
= 50V, I
D
= 10A,
V
GS
= 10V
Gate-Source Charge
Gate-Drain Charge
nC
Q
GS
Q
GD
t
D(ON)
t
R
5.1
6.5
Turn-On Delay Time
Turn-On Rise Time
7
V
DD
= 50V, V
GS
= 10V,
I
D
= 10A, R
G
= 6
Ω
ns
19.7
8.1
Turn-Off Delay Time
Turn-Off Fall Time
t
D(OFF)
t
F
37.9
51.9
Reverse Recovery Time
Reverse Recovery Charge
ns
t
RR
I
F
= 10A, di/dt = 100A/µs
nC
Q
RR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
30
25
20
15
10
5
30
25
20
15
10
V
= 10
.
0
V
GS
V
= 5
.
0
V
DS
V
= 6
.
0
V
GS
V
= 5
.
0
V
GS
V
= 4
.
5
V
GS
V
= 4
.
0
V
GS
T
= 150
C
A
V
= 3
.
5
V
= 3
.
0
V
GS
T
= 125
C
A
T
= 8
5
C
A
T
= 2
5
C
A
5
0
T
= -5
5
C
A
V
GS
0
1.5
2
2.5
3
3.5
4
4.5
0
0.5
1
1.5
2
2.5
3
V
DS
, DRAIN -SOURCE VOL
T
AGE
(
V)
Figure 1
T
y
pical Output Characteristics
V
GS
, GATE-SOURCE VOL
T
AGE
(
V)
Figure 2
T
y
pical Transfer Characteristics
0.025
0.05
I
= 20A
D
0.04
0.03
0.02
0.01
0
0.02
V
V
= 4
.
5
V
GS
0.015
0.01
= 6V
GS
V
= 10V
GS
I
= 5A
D
0.005
0
5
10
15
20
25
30
0
5
10
15
20
I
D
, DRAIN CURRENT (A)
V
GS
, GATE-SOURCE VOL
T
AGE
(
V)
Figure 4
T
y
pical Transfer Characteristic
Figure 3
T
y
pical On-Resistance vs.
Drain Current and Gate Voltage
0.03
0.025
0.02
1.8
V
= 10V
GS
T
= 15
0
C
= 125
C
V
I
= 6V
A
GS
= 20A
1.6
1.4
1.2
1
D
T
A
T
= 8
5
C
A
0.015
T
= 2
5
C
V
= 10V
A
GS
I
= 20A
D
V
= 4
.
5
V
= 5A
GS
0.01
0.005
0
T
= -55
C
A
I
D
0.8
0.6
0
5
10
15
20
25
30
–
5
0
–
2
5
T
J
, JUNCTION TEMPERATURE (
C)
Figure 6 On-Resistance Variation with
T
e
m
p
e
r
a
ture
0
25
50
75 100 125
150
I
D
, DRAIN SOURCE CURRENT (A)
Figure 5
T
y
pical On-Resistance vs.
Drain Current and
T
e
m
p
e
r
a
ture
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© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
0.04
0.03
0.02
0.01
2.6
2.4
2.2
2
V
= 4
.
5
V
= 5A
I
= 1mA
GS
D
I
D
V
I
= 6V
GS
= 20A
D
I
= 250µA
1.8
1.6
1.4
1.2
1
D
V
= 10V
GS
= 20A
I
D
0
–
5
0
–
2
5
0
25
50
75
100 125 150
–
5
0
–
2
5
0
25
50
75 100
125 150
T
J
, JUNCTION TEMPERATURE (
C)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 7 On-Resistance Variation with Junction
T
e
m
p
e
r
a
ture
30
Figure 8 Gate Threshold Variation vs. Ambient
T
e
m
p
e
r
a
ture
10000
25
20
15
10
C
iss
1000
T = 150
C
A
C
o
s
s
T = 25
C
A
T = 125
C
A
100
10
T = 85
C
T = -55
C
A
A
C
r
s
s
5
0
f = 1MHz
1
0
0.3
0.6
0.9
1.2
1.5
0
10
20
30
40
50
V
SD
, SOURCE-DRAIN VOL
T
AGE
(
V)
Figure 9 Diode Forward Voltage vs. Current
V
DS
, DRAIN-SOURCE VOL
T
AGE
(
V)
Figure 10
T
y
pical Junction Capacitance
10
8
100
10
R
D
S
(
on)
Limi
t
e
d
V
I
= 50V
DS
6
= 10A
D
DC
1
P
= 10s
W
4
P
= 1s
W
P
= 100ms
W
P
= 10ms
0.1
W
2
P
= 1ms
W
P
= 100µs
W
0
0.01
1
100
1000
0
5
10
15
20
25
30
0.01
0.1
10
Q
g
, TO
T
AL GATE CHARGE (nC)
Figure 11 Gate Charge
V
DS
, DRAIN-SOURCE VOL
T
AGE
(
V)
Figure 12 SOA, Safe Operation Area
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
1
D = 0
.
9
D = 0
.
7
D = 0
.
5
D = 0
.
3
0.1
D = 0
.
1
D = 0
.
0
5
D = 0
.
0
2
D = 0
.
0
1
D = 0
.
0
05
0.01
R
JA
(t) = r(t) *
R
JA
R
JA
= 92°C/W
Duty Cycle, D = t1/ t2
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
Package Outline Dimensions
SO-8
SO-8
Min
–
0.10
1.30
0.15
0.3
Dim
A
A1
A2
A3
b
Max
1.75
0.20
1.50
0.25
0.5
E1
E
Gauge Plane
Seating Plane
A1
L
Detail ‘A’
D
E
E1
e
4.85
5.90
3.85
4.95
6.10
3.95
7
°~
9
°
h
°
45
1.27 Typ
h
L
–
0.35
0.82
8
Detail ‘A’
A2
A3
A
0.62
0
b
e
All Dimensions in mm
D
Suggested Pad Layout
SO-8
X
Dimensions Value
(in mm)
X
Y
C1
C2
0.60
1.55
5.4
C1
1.27
C2
Y
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
DMT10H015LSS
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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June 2016
© Diodes Incorporated
DMT10H015LSS
Document number: DS38046 Rev. 4 – 2
