Diodes-Incorporated-DMT10H072LFV-13

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Diodes-Incorporated-DMT10H072LFV-13
DMT10H072LFV  
100V N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8  
Product Summary  
Features and Benefits  
Low R

DS(ON)

–
Ensures On State Losses are Minimized  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
Occupies just 33% of the Board Area Occupied by SO-8  
Enabling Smaller End Product  
Low On-Resistance  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
62m
Ω
@ V

GS

= 10V  
77
mΩ @ V

GS

= 6V  
20A  
16A  
100V  
Description  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) and yet maintain superior switching performance,  
making it ideal for high-efficiency power management applications.  
Mechanical Data  
®
Case: PowerDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Applications  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish
Matte Tin Annealed over Copper  
Leadframe. Solderable per MIL-STD-202, Method 208  
Power Management Functions  
Battery Operated Systems and Solid-State Relays  
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,  
Memories, Transistors, etc.  
Weight: 0.072 grams (Approximate)  
Pin1  
PowerDI3333-8 (Type UX)  
S
D
S
S
G
G
D
D
D
D
S
Equivalent Circuit  
Bottom View  
Top View  
Ordering Information
(Note 4)  
Part Number  
Case  
Quantity per Reel  
DMT10H072LFV-7  
DMT10H072LFV-13  
PowerDI3333-8 (Type UX)  
PowerDI3333-8 (Type UX)  
2,000/Tape & Reel  
3,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds  
Marking Information  
T72= Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
T72  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
Maximum Ratings
(@T

A

= +25°C unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
100  
±20  
Unit  
V
Gate-Source Voltage  
V
V

GSS  

T

A

= +25°C  
T

A

= +70°C  
T

C

= +25°C  
T

C

= +70°C  
4.7  
3.7  
A
A
Continuous Drain Current,
 
V

GS

= 10V (Note 5)  
Continuous Drain Current
 
V

GS

= 10V (Note 6)  
I

D  

I

D  

20  
16  
80  
80  
2
A
A
Pulsed Drain Current (10µs Pulse,
T

C

=+25°C, Package Limited
)  
Pulsed Body Diode Current (10
μ
s Pulse, T

C

=+25°C, Package Limited
)  
Maximum Body Diode Continuous Current  
I

DM  

I

SM  

I

S  

A
6
Avalanche Current (Note 9), L=0.1mH  
A
I

AS  

E

AS  

1.8  
Avalanche Energy (Note 9), L=0.1mH  
mJ  
Thermal Characteristics
(@T

A

= +25°C unless otherwise specified.)  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

R

  

Value  
2
61  
Unit  
W
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
JA  
37.8  
3.3  
P

D  

R

  

Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
°C/W  
°C  
JC  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
100  
–
–
–
–
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μA  
V

DS

= 80V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
–
–
µA  
nA  
±100  
I

GSS  

ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1.5  
–
2.8  
62  
77  
109  
1
V
V

GS(TH)  

R

DS(ON)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 4.5A  
V

GS

= 6V, I

D

= 4A  
–
–
–
–
50.6  
61.2  
82.5  
0.76  
m
Ω  
Static Drain-Source On-Resistance  
m
Ω  
V

GS

= 4.5V, I

D

= 2.7A  
V

GS

= 0V, I

S

= 1A  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
 
(Note 8)  
Input Capacitance  
V
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
228  
89.3  
2.5  
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 50V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
8.2  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
2.5  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge
 
(V

GS

= 4.5V)  
Total Gate Charge
 
(V

GS

= 10V)  
Gate-Source Charge  
Q

g  

4.5  
Q

g  

V

DS

= 50V, I

D

= 4.5A  
0.6  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
1.3  
Turn-On Delay Time  
3.0  
Turn-On Rise Time  
3.1  
V

DS

= 50V, R

L

= 11
Ω  
V

GS

= 10V, R

GEN

= 3
Ω  
Turn-Off Delay Time  
12.3  
4.3  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
22.9  
45.2  
t

RR  

I

F

= 4.5A, di/dt = 30
0A/μs  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
2 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
10  
8
20.0  
16.0  
12.0  
8.0  
V

GS

= 5.0V  
V

GS

= 4.5V  
V

DS

= 5V  
6
V

GS

= 6.0V  
V

GS

= 8.0V  
V

GS

= 10.0V  
4
T

J

=125
℃  
V

GS

= 3.8V  
V

GS

= 3.5V  
T

J

=85
℃  
T

J

=25
℃  
4.0  
2
T

J

=150
℃  
T

J

=-55
℃  
0.0  
0
0
0.5  
1
1.5  
2
2.5  
3
1
2
3
4
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
0.1  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.1  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
V

GS

= 4.5V  
I

D

= 4.5A  
I

D

= 2.7A  
V

GS

= 6.0V  
I

D

= 4.0A  
V

GS

= 10V  
0
2
4
6
8
10 12 14 16 18 20  
0
4
8
12  
16  
20  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
0.13  
0.12  
0.11  
0.1  
2
1.8  
1.6  
1.4  
1.2  
1
V

GS

= 10V  
T

J

=150
℃  
V

GS

= 10V, I

D

= 4.5A  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
T

J

=125
℃  
T

J

=85
℃  
V

GS

= 6.0V, I

D

= 4A  
T

J

=25
℃  
T

J

=-55
℃  
0.8  
0.6  
V

GS

= 4.5V, I

D

= 2.7A  
0
4
8
12  
16  
20  
-50  
-25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Junction  
Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Junction Temperature  
3 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
2.6  
2.4  
2.2  
2
0.14  
0.12  
0.1  
I

D

= 1mA  
V

GS

= 4.5V, I

D

= 2.7A  
0.08  
0.06  
0.04  
0.02  
1.8  
1.6  
1.4  
1.2  
1
I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 4.5A  
V

GS

= 6.0V, I

D

= 4A  
-50  
-25  
0
25  
50  
75  
100 125 150  
-50 -25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Junction  
Temperature  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
20  
16  
12  
8
10000  
1000  
100  
10  
f=1MHz  
V

GS

= 0V  
C

iss  

C

oss  

T

J

= 85
℃  
T

J

= 125
℃  
T

J

= 25
℃  
C

rss  

1
4
T

J

= 150
℃  
T

J

= -55
℃  
0
0
0
10 20 30 40 50 60 70 80 90
 
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
Figure 9.
 
Diode Forward Voltage vs. Current  
100  
10  
1
10  
8
R

DS(ON)

Limited  
P

W

=1µs  
6
P

W

=10
m
s  
P

W

=100
m
s  
4
V

DS

= 50V, I

D

= 4.5A  
P

W

=1ms  
T

J(Max)

= 150
℃  
P

W

=10ms  
T

C

= 25
℃  
Single Pulse  
DUT on Infinite  
Heatsink  
2
P

W

=100ms  
DC  
V

GS

= 10V  
0
0.1  
0
1
2
3
4
5
0.1  
1
10  
100  
1000  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Qg (nC)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 136
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.0001  
0.001  
1E-05  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, Pulse Duration Time (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI3333-8 (Type UX)  
D
D1  
A
A1  
PowerDI3333-8  
(Type UX)  
Dim  
Min  
Max  
0.85 0.80  
0.05 —  
Typ  
E1 E  
A
A1  
b
c
D
D1  
D2  
E
E1  
E2  
E2a  
E2b  
e
0.75  
0.00  
0.25  
0.10  
3.20  
2.95  
2.30  
3.20  
2.95  
1.60  
0.95  
0.10  
0.40 0.32  
0.25 0.15  
3.40 3.30  
3.15 3.05  
2.70 2.50  
3.40 3.30  
3.15 3.05  
2.00 1.80  
1.35 1.15  
0.30 0.20  
0
c
L
E2a  
E2b  
E2  
0.65 BSC  
k
L
θ
0.50  
0.30  
0°  
0.90 0.70  
0.50 0.40  
D2  
k
12°  
10°  
L
All Dimensions in mm  
b
e
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI3333-8 (Type UX)  
X3  
X2  
8
Y4  
Dimensions Value
 
(in mm)  
C
X
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
X1  
Y1  
Y2  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y
1
X
C
6 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

DMT10H072LFV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
January 2019  
© Diodes Incorporated  
DMT10H072LFV  
D
atasheet number: DS40030 Rev. 5 – 2  

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Authorized Distributor  
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