Diodes-Incorporated-DMT12H007LPS-13

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Diodes-Incorporated-DMT12H007LPS-13
DMT12H007LPS  
Green  
120V N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable and Robust End Application  
Thermally Efficient Package
–
Cooler Running Applications  
High Conversion Efficiency  
I

D  

BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
90A  
70A  
7.8m
Ω
@ V

GS

= 10V  
14.1m
Ω
@ V

GS

= 4.5V  
120V  
Low R

DS(ON)

–
Minimizes On-State Losses  
<1.1mm Package Profile
–
Ideal for Thin Applications  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q101, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
Description and Applications  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

), yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Mechanical Data  
®
Case: PowerDI
 
5060-8  
Switching  
DC-DC Converters  
Case Material:
Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish – Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
PowerDI5060-8  
S
S
D
D
D
D
Pin1  
S
G
Top View  
Pin Configuration  
Internal Schematic  
Bottom View  
Top View  
Ordering Information
(Note 4)  
Part Number  
DMT12H007LPS-13  
Case  
PowerDI5060-8  
Packaging  
2,500 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
D
D
D
D
=Manufacturer
’
s Marking  
T12H007LS = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
T12H007LS  
YY WW  
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
120  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

C

= +25°C  
T

C

= +70°C  
90  
72  
A
Continuous Drain Current, V

GS

= 10V (Note 6)  
I

D  

360  
80  
Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
Continuous Body Diode Forward Current (Note 6)  
Pulsed Body Diode Forward Current (Note 6)  
Avalanche Current, L = 3mH  
A
A
I

DM  

I

S  

T

C

= +25°C  
T

C

= +25°C  
360  
15.6  
365  
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy, L = 3mH  
mJ  
Thermal Characteristics  
Value  
Typ  
Characteristic  
Symbol  
Unit  
Total Power Dissipation (Note 5)  
2.9  
W
°C/W  
W
P

D  

R

θ
JA  

Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
42  
96  
P

D  

Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
1.3  
°C/W  
°C  
R

θ
JC  

T

J,

T

STG  

-55 to +150  
Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
120  
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 10mA  
V

DS

= 96V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
µA  
nA  
—
±100  
I

GSS  

ON CHARACTERISTICS
(Note 7)  
Gate Threshold Voltage  
1.3  
—
—
—
—
6
2.5  
7.8  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10V, I

D

= 30A  
V

GS

= 4.5V, I

D

= 15A  
V

GS

= 0V, I

S

= 30A  
Static Drain-Source On-Resistance  
10  
0.8  
14.1  
1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 8)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
3224  
454  
17.8  
1.9  
C

iss  

C

oss  

C

rss  

R

G  

V

DS

= 60V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
V

DS

= 60V, I

D

= 25A  
49  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

11.6  
11.4  
7.9  
nC
 
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
15.4  
30  
Turn-On Rise Time  
V

DD

= 60V, V

GS

= 10V,  
I

D

= 25A, R

G

= 2.7
Ω  
ns  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

19.1  
54  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
t

RR  

I

F

= 25A, di/dt = 10
0A/μs  
100  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
2 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
30  
25  
20  
15  
10  
5
50.0  
40.0  
30.0  
20.0  
10.0  
0.0  
V

DS

= 5.0V  
V

GS

=10V  
V

GS

= 5.0V  
V

GS

= 4.5V  
V

GS

= 4.0V  
T

J

=125
℃  
V

GS

=3.7V  
T

J

=150
℃  
T

J

=85
℃  
T

J

=25
℃  
V

GS

= 3.5V  
V

GS

= 3.1V  
T

J

= -55
℃  
0
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
0.5  
1
1.5  
2
2.5  
3
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
50  
40  
30  
20  
10  
0
15.0  
12.0  
9.0  
V

GS

= 4.5V  
I

D

= 30A  
I

D

= 15A  
6.0  
V

GS

= 10V  
3.0  
0.0  
2
4
6
8
10 12 14 16 18 20  
0
5
10 15 20 25 30 35 40 45 50  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2.4  
2.2  
2
16.0  
14.0  
12.0  
10.0  
8.0  
V

GS

= 10V  
T

J

=150
℃  
1.8  
1.6  
1.4  
1.2  
1
V

GS

= 10V, I

D

= 30A  
T

J

=125
℃  
T

J

=85
℃  
T

J

=25
℃  
6.0  
V

GS

= 4.5V, I

D

= 15A  
T

J

= -55
℃  
4.0  
0.8  
0.6  
0.4  
2.0  
0.0  
-50 -25  
0
25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Temperature  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
30  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
3
2.5  
2
20  
18  
16  
14  
12  
10  
8
I

D

= 1mA  
V

GS

= 4.5V, I

D

= 15A  
I

D

= 250
μ
A  
1.5  
1
6
V

GS

= 10V, I

D

= 30A  
4
0.5  
0
2
0
-50 -25  
0
25  
50  
75  
100 125 150  
-50  
-25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
10000  
30  
25  
20  
15  
10  
5
f=1MHz  
C

iss  

V

GS

= 0V  
1000  
100  
10  
C

oss  

T

J

=85
℃  
C

rss  

T

J

=150
℃  
T

J

=25
℃  
T

J

=125
℃  
T

J

= -55
℃  
1
0
0
10 20 30 40 50 60 70 80 90
 
100 110 120  
0
0.3  
0.6  
0.9  
1.2  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
1000  
100  
10  
10  
R

DS(ON)

Limited  
P

W

=1µs  
9
8
7
6
5
4
3
2
1
0
P

W

=10µs  
V

DS

= 60V, I

D

= 25A  
P

W

=100µs  
P

W

=1ms  
1
T

J(Max)

= 150
℃  
P

W

=10ms  
T

C

= 25
℃  
P

W

=100ms  
Single Pulse  
DUT on Infinite  
Heatsink  
0.1  
0.01  
DC  
V

GS

= 10V  
0
5
10 15 20 25 30 35 40 45 50  
Q

g

(nC)  
0.1  
1
10  
100  
1000  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
1
D=0.5  
D=0.3  
D=0.9  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
D=Single Pulse  
R

θ
JC

(t) = r(t) * R

θ
JC  

R

θ
JC

= 1.3
℃
/W  
Duty Cycle, D = t1 / t2  
0.001  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
Package Outline Dimensions  
PowerDI5060-8  
PowerDI5060-8  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
0.330 0.277  
5.15 BSC  
5.10  
4.10  
4.30  
6.15 BSC  
6.00  
3.68  
4.39  
1.27 BSC  
0.71  
  
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12°  
8°  
Typ  
1.00  
D
D1  
Detail A  
c
0( 4X)  
A1  
0.41  
E1 E  
D
e
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
4.90  
3.90  
4.10  
01 (
 
4X)  
1
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b (
 
8X)  
L
e/2  
1
b2 (
 
4X)  
D3  
K
0.51  
0.51
  
0.51  
0.100  
3.235  
1.00  
10°  
0.61  
0.61  
A
D2  
b3 (
 
4X)  
E3  
E2  
M
M1  
M1  
Θ
Θ1  
1.21  
11°  
7°  
Detail A  
G
L1  
6°  
All Dimensions in mm  
Suggested Pad Layout  
PowerDI5060-8  
X4  
X3  
Y2  
Y1  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
C
G
G1  
X
Y3  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
6 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

DMT12H007LPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
October 2019  
© Diodes Incorporated  
DMT12H007LPS  
Document number: DS41426 Rev. 3 – 2  

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