Diodes-Incorporated-DMT3006LDV-7

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Diodes-Incorporated-DMT3006LDV-7
DMT3006LDV  
DUAL 30V N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8 (Type UXC)  
Product Summary  
Features  
Low On-Resistance  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
Low Input Capacitance  
Fast Switching Speed  
25A  
20A  
10m
Ω
@ V

GS

= 10V  
14m
Ω
@ V

GS

= 4.5V  
30V  
Low Input/Output Leakage  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
Description  
Mechanical Data  
®
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) yet maintain superior switching performance,  
which makes it ideal for high-efficiency power management  
applications.  
Case: PowerDI
 
3333-8 (Type UXC)  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish
—
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Applications  
Power Management Functions  
Analog Switch  
Weight: 0.072 grams (Approximate)  
PowerDI3333-8 (Type UXC)  
D1  
D
S
D
S
D1  
D2  
D2  
G
G
S1  
G1  
S2  
G2  
PIN1  
Bottom View  
Equivalent Circuit  
Top View  
Ordering Information
(Note 4)  
Part Number  
DMT3006LDV-7  
DMT3006LDV-13  
Case  
Packaging  
2000/Tape & Reel  
3000/Tape & Reel  
PowerDI3333-8 (Type UXC)  
PowerDI3333-8 (Type UXC)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3.Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlori
ne (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
SV6 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 18 for 2018)  
WW = Week Code (01 to 53)  
SV6  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
30  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

Steady  
State  
T

C

= +25°C  
T

C

= +70°C  
25  
20  
A
Continuous Drain Current, V

GS

= 10V (Note 7)  
I

D  

Maximum Body Diode Forward Current (Note 7)  
25  
90  
90  
34  
58  
A
A
I

S  

Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
I

DM  

I

SM  

I

AS  

E

AS  

Pulsed Body Diode Forward Current (10
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current (L = 0.1mH) (Note 8)  
A
A
Avalanche Energy (L = 0.1mH) (Note 8)  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
Unit  
Total Power Dissipation (Note 5)  
0.9  
134  
78  
1.8  
70  
W
P

D  

R

ϴ
JA  

P

D  

Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
t<10s  
Steady State  
t<10s  
Thermal Resistance, Junction to Ambient (Note 6)  
R

ϴ
JA  

41  
°C/W  
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
14  
R

ϴ
JC  

-55 to +150  
°C  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 9)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
—
—
—
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250μA  
V

DS

= 24V, V

GS

= 0V  
V

GS

= +20V, V

DS

= 0V  
V

GS

= -16V, V

DS

= 0V  
—
1
μ
A  
Zero Gate Voltage Drain Current T

J

= +25°C  
Gate-Source Leakage  
—
—
±100  
nA  
I

GSS  

ON CHARACTERISTICS
(Note 9)  
Gate Threshold Voltage  
1.0  
—
—
3.0  
10  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 9.0A  
V

GS

= 4.5V, I

D

= 8.5A  
V

GS

= 0V, I

S

= 1A  
7.6  
Static Drain-Source On-Resistance  
10.0  
0.70  
14  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 10)  
Input Capacitance  
—
1.2  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1,155  
456  
72  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

G  

V

DS

= 15V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
1.6  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1.0MHz  
8.4  
16.7  
2.2  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

G  

Q

G  

nC  
ns  
V

DD

= 15V, I

D

= 9A  
Q

GS  

Q

GD  

t

D(ON)  

t

R  

3.5  
Gate-Drain Charge  
Turn-On Delay Time  
3.5  
5.5  
Turn-On Rise Time  
V

DD

= 15V, V

GS

= 10V,  
R

G

= 3
Ω
, I

D

= 9A  
13.5  
4.6  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
19.3  
8.6  
ns  
t

RR  

I

F

= 1.5A, di/dt = 100A/
μ
s  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
50  
45  
40  
35  
30  
25  
20  
15  
10  
30  
25  
20  
15  
10  
5
V
= 10V  
= 4V  
GS  
V
= 5
.
0
V  
DS  
V
= 3
.
5
V  
GS  
V
GS  
V
= 4
.
5
V  
GS  
V
= 5V  
V
= 3V  
GS  
GS  
T
J
= 150°C  
T
= 25°C  
J
T
= 125°C  
= 85°C  
J
T
= -55°C  
J
V
= 2
.
7
V  
GS  
T
J
V
= 2
.
5
V  
GS  
5
0
V
= 2
.
2
V  
GS  
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
1
2
3
4
5
6
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
Figure 1
T
y
pical Output Characteristic  
V

GS

, GATE-SOURCE VOL
T
AGE
(
V)  
Figure 2
T
y
pical Transfer Characteristics  
0.012  
0.010  
0.008  
0.006  
0.004  
0.002  
0.000  
0.2  
0.18  
0.16  
0.14  
0.12  
0.1  
V
= 4
.
5
V  
= 10V  
GS  
GS  
I
= 20A  
D
V
0.08  
0.06  
0.04  
I
= 10A  
D
0.02  
0
2
4
6
8
10 12 14 16 18 20  
0
5
10  
15  
20  
25  
30  
V

GS

, GATE-SOURCE VOL
T
AGE
(
V)  
Figure 4
T
y
pical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3
T
y
pical On-Resistance vs.  
Drain Current and Gate Voltage  
0.012  
0.01  
0.008  
0.006  
0.004  
0.002  
0
2
V
= 10V  
GS  
T =
 
150°C  
J
T
= 125°C  
J
1.8  
T
= 85°C  
1.6  
1.4  
1.2  
1
J
V
= 4
.
5
V  
= 10A  
GS  
I
D
T
= 25°C  
J
T
= -55°C  
J
V
= 10V  
GS  
= 20A  
I
D
0.8  
0.6  
0.4  
0
5
10  
15  
20  
–
5
0
–
2
5  
0
25  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 6 On-Resistance Variation with
T
e
m
p
e
r
a
ture  
50  
75 100 125 150  
I

D

, DRAIN CURRENT (A)  
Figure 5
T
y
pical On-Resistance vs.  
Drain Current and
T
e
m
p
e
r
a
ture  
3 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
0.02  
0.015  
0.01  
2.5  
2
V
= 4
.
5
V  
= 10A  
GS  
I
D
I
= 1mA  
D
1.5  
1
I
= 250µA  
D
V
= 10V  
= 20A  
GS  
I
D
0.005  
0.5  
0
0
–
5
0
–
2
5  
0
25  
50  
75 100 125 150  
–
5
0
–
2
5  
0
25  
50  
75 100 125 150  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 7 On-Resistance Variation with
T
e
m
p
e
r
a
ture  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 8 Gate Threshold Variation vs. Junction Temperature  
10000  
30  
25  
20  
f = 1MHz  
C

iss  

1000  
100  
10  
C

oss  

T
= 150°C  
J
T
= 25°C  
J
15  
10  
5
T
= 125°C  
= 85°C  
J
C

rss  

T
= -55°C  
J
T
J
1
0
0
0.3  
0.6  
0.9  
1.2  
0
5
10  
15  
20  
25  
30  
V

SD

, SOURCE-DRAIN VOL
T
AGE
(
V)  
Figure 9 Diode Forward Voltage vs. Current  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
10  
100  
R
D
S
(
on)  
Limi
t
e
d  
P
= 100µs  
W
8
6
4
2
0
10  
DC  
P
= 10s  
W
1
P
= 1s  
W
P
= 100ms  
W
V

DS

= 15V, I

D

= 12A  
P
= 10ms  
W
T

J
(max)

= 150°C  
T

C

= 25°C  
P
= 1ms  
W
0.1  
V

GS

= 10V  
Single Pul
s
e  
DUT on 1 * MRP Board  
0.01  
0.01  
0.1  
1
10  
100  
0
5
10  
15  
20  
25  
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
Figure 12 SOA, Safe Operation Area  
Q

g

(nC)  
Figure 11. Gate Charge  
4 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
1
D = 0
.
9  
D = 0
.
7  
D = 0
.
5  
D = 0
.
3  
0.1  
D = 0
.
1  
D = 0
.
0
5  
D = 0
.
0
2  
D = 0
.
0
1  
D = 0
.
0
05  
0.01  
R

JA

(t) = r(t) *
R

JA  

R

JA

= 122°C/W  
Duty Cycle, D = t1/ t2  
D = Single Pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13 Transient Thermal Resistance  
5 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI3333-8 (Type UXC)  
D
D1  
A
A1  
PowerDI3333-8  
(Type UXC)  
Dim Min
 
Max Typ  
0.75 0.85 0.80  
A1
0.00 0.05  
A
E1 E  
—
b
c
D
0.25 0.40 0.32  
0.10 0.25 0.15  
3.20 3.40 3.30  
D1
2.95 3.15 3.05  
D2
0.90 1.30 1.10  
c
E
3.20 3.40 3.30  
E1
2.95 3.15 3.05  
E2
1.60 2.00 1.80  
E3
0.95 1.35 1.15  
E4
0.10 0.30 0.20  
L
E3  
k
E4  
E2  
e
L
k
—
—
0.65  
0.30 0.50 0.40  
0.50 0.90 0.70  
k1
0.13 0.53 0.33  
0° 12°
 
10°  
D2  
k1  
a
All Dimensions in mm  
L
b
e
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI3333-8 (Type UXC)  
X3  
X2  
Dimensions Value
 
(in mm)  
C
G
G1  
X
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
0.650  
0.230  
0.600  
0.420  
1.200  
2.370  
2.630  
0.600  
1.900  
2.400  
3.600  
Y2  
G1  
X1  
Y1  
Y
Y3  
G
X
C
6 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

DMT3006LDV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
7 of 7  
May 2018  
© Diodes Incorporated  
DMT3006LDV  
Document number: DS39726
 
Rev. 5 – 2  

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Authorized Distributor  
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