Diodes-Incorporated-DMT31M7LPS-13

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Diodes-Incorporated-DMT31M7LPS-13
DMT31M7LPS  
Green  
N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features and Benefits  
Low R

DS(ON)

–
Minimizes On-State Losses  
I

D

Max  
Excellent Q

gd

x R

DS(ON)

Product (FOM)  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
Advanced Technology for DC-DC Converters  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
1.7m
Ω
@ V

GS

= 10V  
2.4m
Ω @ V

GS

= 4.5V  
100A  
80A  
30V  
100% Unclamped Inductive Switching
–
Ensures More Reliability  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Description and Applications  
Mechanical Data  
®
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) and yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case: PowerDI
 
5060-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Backlighting  
Terminal Connections Indicator: See Diagram  
Terminals: Finish
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Power Management Functions  
DC-DC Converters  
Weight: 0.097 grams (Approximate)  
PowerDI5060-8  
S
S
D
D
D
D
Pin1  
S
G
Top View  
Pin Configuration  
Top View  
Internal Schematic  
Bottom View  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMT31M7LPS-13  
2,500/Tape & Reel  
PowerDI5060-8  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definit
ions of Halogen- and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<
1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
D
D
D
D
= Manufacturer’s Marking  
T31M7LS = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Year (ex: 18 = 2018)  
T31M7LS  
YY WW  
WW = Week (01 to 53)  
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
30  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
Continuous Drain Current, V

GS

= 10V (Note 6)  
T

A

= +70°C  
30  
24  
A
A
I

D  

I

D  

T

C

= +25°C  
Continuous Drain Current, V

GS

= 10V (Note 7)  
T

C

= +70°C  
100  
80  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (380µs Pulse, Duty Cycle = 1%)  
Pulsed Body Diode Forward Current (380µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L=0.1mH (Note 8)  
2.8  
400  
400  
65  
A
A
I

S  

I

DM  

I

SM  

I

AS  

E

AS  

A
A
Avalanche Energy, L=0.1mH (Note 8)  
215  
mJ  
Thermal Characteristics  
Characteristic  
Symbol  
P

D  

R

  

Value  
1.3  
94  
Unit  
W
Total Power Dissipation
(Note 5)  
T

A

= +25°C  
Steady State  
T

A

= +25°C  
Steady State  
T

C

= +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation
(Note 6)  
°C/W  
W
JA  
2.4  
P

D  

R

  

Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
52  
°C/W  
W
JA  
113  
P

D  

R

  

Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
1.1  
°C/W  
°C  
JC  
-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
—
—
—
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250μA  
—
1
μ
A  
V

DS

= 24V, V

GS

= 0V  
V

GS

= 20V, V

DS

= 0V  
V

GS

= -16V, V

DS

= 0V  
Gate-Source Leakage  
—
—
±100  
nA  
I

GSS  

ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
1.0  
—
—
—
—
3.0  
1.7  
2.4  
1.0  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 4.5V, I

D

= 20A  
V

GS

= 0V, I

S

= 2A  
1.3  
1.9  
0.7  
Static Drain-Source On-Resistance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

5741  
2119  
424  
1.5  
V

DS

= 15V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1.0MHz  
90  
Total Gate Charge (V

GS

= 10V)  
Total Gate Charge (V

GS

= 4.5V)  
Gate-Source Charge  
Q

g  

45  
Q

g  

nC  
ns  
V

DD

= 15V, I

D

= 20A  
11.6  
21.6  
6.9  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
16.5  
49.6  
34.5  
32.5  
55  
Turn-On Rise Time  
V

DD

= 15V, V

GS

= 10V,  
R

g

= 3
Ω
, I

D

= 20A  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
t

RR  

I

F

= 15A, dI/dt = 500A/
μ
s  
I

F

= 15A, dI/dt = 500A/
μ
s  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
V

DS

= 5V  
V

GS

= 3.0V  
V

GS

= 3.5V  
V

GS

=4.0V  
V

GS

= 4.5V  
V

GS

= 10.0V  
125
℃  
85
℃  
V

GS

= 2.5V  
V

GS

= 2.2V  
25
℃  
150
℃  
-55
℃  
0
0.0  
0.5  
1
1.5  
2
2.5  
3
3.5  
0
1
2
3
4
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1.Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.03  
0.02  
0.01  
0
0.0022  
0.002  
V

GS

= 4.5V  
0.0018  
0.0016  
0.0014  
0.0012  
0.001  
I

D

= 20A  
V

GS

= 10V  
0
4
8
12  
16  
20  
0
5
10  
15  
20  
25  
30  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
0.0024  
0.0022  
0.002  
1.8  
1.6  
1.4  
1.2  
1
V

GS

= 10V  
150
℃  
V

GS

= 10V, I

D

= 20.0A  
125
℃  
85
℃  
0.0018  
0.0016  
0.0014  
0.0012  
0.001  
V

GS

= 4.5V, I

D

= 20.0A  
25
℃  
-55
℃  
25  
0.8  
0.6  
0.0008  
0.0006  
0
5
10  
15  
20  
30  
-50  
-25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance
 
vs. Drain Current and  
Junction Temperature  
Figure 6. On-Resistance Variation with Junction  
Temperature  
3 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
2
1.8  
1.6  
1.4  
1.2  
1
0.0032  
0.003  
0.0028  
0.0026  
0.0024  
0.0022  
0.002  
I

D

= 1mA  
V

GS

= 4.5V, I

D

= 20.0A  
I

D

= 250
μ
A  
0.0018  
0.0016  
0.0014  
0.0012  
0.001  
V

GS

= 10V, I

D

= 20.0A  
0.8  
0.6  
0.4  
0.0008  
0.0006  
0.0004  
-50  
-25  
0
25  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Junction  
Temperature  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
10000  
1000  
100  
30  
25  
20  
15  
10  
5
f=1MHz  
V

GS

= 0V  
C

iss  

C

oss  

T

J

= 85
℃  
T

J

= 125
℃  
T

J

= 25
℃  
C

rss  

T

J

= 150
℃  
T

J

= -55
℃  
0
0
5
10  
15  
20  
25  
30  
0
0.3  
0.6  
0.9  
1.2  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
Figure 9. Diode Forward Voltage vs. Current  
10  
8
1000  
100  
10  
P

W

=100µs  
R

DS(ON)

Limited  
6
P

W

=1ms  
P

W

=10ms  
4
P

W

=100ms  
P

W

=1s  
1
V

DS

= 15V, I

D

= 20A  
T

J(Max)

= 150
℃
T

C

= 25
℃  
Single Pulse  
2
P

W

=10s  
DC  
DUT
on Infinite
 
Heatsink  
V

GS

= 10V  
0
0.1  
0
20  
40  
60  
Qg (nC)  
Figure 11. Gate Charge  
80  
100  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
4 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
0.01  
0.001  
D=0.005  
R

θ
JC

(t) = r(t) * R

θ
JC  

R

θ
JC

= 1.1
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
Package Outline Dimensions  
PowerDI5060-8  
PowerDI5060-8  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
0.330 0.277  
5.15 BSC  
5.10  
4.10  
4.30  
6.15 BSC  
6.00  
3.68  
4.39  
1.27 BSC  
0.71  
  
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12°  
8°  
Typ  
1.00  
D
D1  
Detail A  
c
0( 4X)  
A1  
0.41  
E1 E  
D
e
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
4.90  
3.90  
4.10  
01 (
 
4X)  
1
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b (
 
8X)  
L
e/2  
1
b2 (
 
4X)  
D3  
K
0.51  
0.51
  
0.51  
0.100  
3.235  
1.00  
10°  
0.61  
0.61  
A
D2  
b3 (
 
4X)  
E3  
E2  
M
M1  
M1  
Θ
Θ1  
1.21  
11°  
7°  
Detail A  
G
L1  
6°  
All Dimensions in mm  
Suggested Pad Layout  
PowerDI5060-8  
X4  
Y2  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
X3  
C
G
G1  
X
Y3  
Y1  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
6 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

DMT31M7LPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
7 of 7  
October 2018  
© Diodes Incorporated  
DMT31M7LPS  
Document number: DS39924
 
Rev. 2 – 2  

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Authorized Distributor  
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