Diodes-Incorporated-DMT4015LDV-7

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Diodes-Incorporated-DMT4015LDV-7
DMT4015LDV  
40V N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8  
Product Summary  
Features and Benefits  
100% Unclamped Inductive Switching (UIS) Test in Production
—  
Ensures More Reliable and Robust End Application  
Low R

DS(ON)

—
Ensures On-State Losses Are Minimized  
Low On-Resistance  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
20m
Ω
@ V

GS

= 10V  
25m
Ω
@ V

GS

= 4.5V  
21.2A  
19.1A  
40V  
Low Input Capacitance  
Fast Switching Speed  
Low Input/Output Leakage  
ESD Protected Gate  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
Description and Applications  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) yet maintain superior switching performance, making it ideal  
for high efficiency power management applications.  
Mechanical Data  
Wireless Charging  
DC-DC Converters  
Power Management  
®
Case: PowerDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminals: Finish
—
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.072 grams (Approximate)  
PowerDI3333-8 (Type UXC)  
D1  
D1  
D2  
D2  
S1  
G1  
ESD PROTECTED  
S2  
G2  
Gate Protection  
Diode  
Gate Protection  
Diode  
Pin 1  
Top View  
Bottom View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
DMT4015LDV-7  
DMT4015LDV-13  
Case  
Packaging  
2,000/Tape & Reel  
3,000/Tape & Reel  
PowerDI3333-8 (Type UXC)  
PowerDI3333-8 (Type UXC)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-free/

for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <90
0ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
T4D = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 20 = 2020)  
WW = Week Code (01 to 53)  
T4D  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
40  
Unit  
V
Gate-Source Voltage  
±16  
V
V

GSS  

T

C

= +25°C  
T

C

= +70°C  
T

A

= +25°C  
T

A

= +70°C  
21.2  
17.0  
A
A
Continuous Drain Current (Note 6) V

GS

= 10V  
I

D  

7.8  
6.3  
Steady State  
Continuous Drain Current (Note 6) V

GS

= 10V  
I

D  

I

DM  

I

S  

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
50  
2
A
A
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.1mH  
50  
A
I

SM  

I

AS  

E

AS  

20.7  
21.4  
A
Avalanche Energy, L = 0.1mH  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
P

D  

Value  
1.1  
Unit  
W
Total Power Dissipation (Note 5)  
T

A

= +25°C  
Steady State  
T

A

= +25°C  
Steady State  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
110.6  
2.0  
°C/W  
W
R

JA  

P

D  

Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
61.2  
8.3  
°C/W  
°C/W  
R

JA  

R

JC  

T

J,

T

STG  

-55 to +150  
°C  
Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
V

GS

= 0V, I

D

= 1mA  
40  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

Zero Gate Voltage Drain Current  
Gate-Source Leakage  
µA  
µA  
V

DS

= 40V, V

GS

= 0V  
V

GS

= ±16V, V

DS

= 0V  
±10  
I

GSS  

ON CHARACTERISTICS
(Note 7)  
Gate Threshold Voltage  
0.75  
—
—
2.5  
20  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 8A  
V

GS

= 4.5V, I

D

= 4A  
V

GS

= 0V, I

S

= 1A  
15.3  
20.1  
0.7  
Static Drain-Source On-Resistance  
—
25  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 8)  
Input Capacitance  
—
1.2  
—
—
—
—
—
—
—
—
—
—
—
—
—
 
—
  
808  
279  
30  
—
—
—
—
—
—
—
—
—
—
—
—
—
  
—
  
pF  
pF  
pF  
Ω
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 30V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
1.4  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
8.6  
nC  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
ns  
nC  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

15.7  
2.9  
Q

g  

V

DS

= 30V, I

D

= 10A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
3.4  
Turn-On Delay Time  
7.5  
Turn-On Rise Time  
2.7  
V

GS

= 10V, V

DS

= 30V,  
R

g

= 6
Ω
, I

D

= 10A  
Turn-Off Delay Time  
17.4  
8.9  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
t

RR  

26.7  
16.2  
I

F

= 10A, di/dt = 100A/µs  
Body Diode Reverse Recovery Charge  
Q

RR  

Notes:  
5. Device mounted on FR-4 PCB, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
2 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
30  
25  
20  
15  
10  
5
40.0  
35.0  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

GS

= 4.0V  
V

DS

= 5V  
V

GS

= 4.5V  
V

GS

= 6.0V  
V

GS

= 10.0V  
V

GS

= 3.5V  
V

GS

= 3.0V  
V

GS

= 2.5V  
T

J

= 85
℃
 
T

J

= 25
℃  
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= -55
℃  
0
0.0  
1
2
3
4
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
0.1  
0.09  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
0.03  
0.028  
0.026  
0.024  
0.022  
0.02  
V

GS

= 4.5V  
I

D

= 4A  
I

D

= 8A  
0.018  
0.016  
0.014  
0.012  
0.01  
V

GS

= 10V  
0.008  
0.006  
0.004  
0
2
4
6
8
10  
12  
14  
16  
0
5
10  
15  
20  
25  
30  
V

GS

, GATE-SOURCE VOLTAGE (V)  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 4. Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
1.8  
1.6  
1.4  
1.2  
1
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
V

GS

= 10V  
V

GS

= 10V, I

D

= 8A  
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 85
℃
 
T

J

= 25
℃  
V

GS

= 4.5V, I

D

= 4A  
T

J

= -55
℃  
0.8  
0.6  
-50 -25  
0
25  
50  
75 100
 
125 150  
0
5
10  
15  
20  
25  
30  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
3
2.5  
2
0.035  
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
V

GS

= 4.5V, I

D

= 4A  
I

D

= 1mA  
1.5  
1
I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 8A  
0.5  
0
-50 -25  
0
25  
50  
75  
100 125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
-50 -25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
0
25  
50  
75  
100 125 150  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
10  
f = 1MHz  
V

GS

= 0V  
C

iss  

C

oss  

T

J

= 85

o

C  
T

J

= 150

o

C  
T

J

= 125

o

C  
C

rss  

T

J

= 25

o

C  
T

J

= -55

o

C  
1
0
0
5
10 15 20 25 30 35 40 45 50 55 60 65  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
100  
10  
10  
8
R

DS(ON)  

Limited  
P

W

= 100µs  
6
P

W

= 1ms  
V

DS

= 30V, I

D

= 10A  
1
P

W

= 10ms  
P

W

= 100ms  
4
T

J(Max)

= 150
℃
 
0.1  
0.01  
T

C

= 25
℃  
Single Pulse  
DUT on 1*MRP  
board  
P

W

= 1s  
P

W

= 10s  
2
DC  
V

GS

= 10V  
0
0.1  
1
10  
100  
0
2
4
6
8
10  
12  
14  
16  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Q

g

(nC)  
Figure 11. Gate Charge  
4 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
1
D=0.7  
D=0.5  
D=0.9  
D=0.3  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
0.001  
D=0.01  
D=0.005  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 110.6
℃
/W  
Duty Cycle, D = t1/t2  
D=Single Pulse  
0.00001 0.0001
 
0.001  
0.01  
0.1  
1
10  
100  
1000  
10000 100000
 
1000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
Package Outline Dimensions  
PowerDI3333-8 (Type UXC)  
D
D1  
A
A1  
PowerDI3333-8  
(Type UXC)  
Dim Min
 
Max Typ  
A
0.75 0.85 0.80  
A1
0.00 0.05  
—  
b
c
D
0.25 0.40 0.32  
0.10 0.25 0.15  
3.20 3.40 3.30  
E1 E  
D1
2.95 3.15 3.05  
D2
0.90 1.30 1.10  
E
3.20 3.40 3.30  
E1
2.95 3.15 3.05  
E2
1.60 2.00 1.80  
E3
0.95 1.35 1.15  
E4
0.10 0.30 0.20  
c
L
e
L
k
0.65  
  
  
0.30 0.50 0.40  
0.50 0.90 0.70  
E3  
k
E4  
k1
0.13 0.53 0.33  
E2  
a
0
°
12
°
10
°  
All Dimensions in mm  
D2  
k1  
L
b
e
Suggested Pad Layout  
PowerDI3333-8 (Type UXC)  
X3  
X2  
Dimensions Value
 
(in mm)  
C
G
G1  
X
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
0.650  
0.230  
0.600  
0.420  
1.200  
2.370  
2.630  
0.600  
1.900  
2.400  
3.600  
Y2  
G1  
X1  
Y1  
Y
Y3  
G
X
C
6 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2  

DMT4015LDV  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
July 2020  
© Diodes Incorporated  
DMT4015LDV  
Document number: DS42627
 
Rev. 2 – 2