Diodes-Incorporated-DMT6010LFG-13

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Diodes-Incorporated-DMT6010LFG-13
DMT6010LFG  
60V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Low R

DS(ON)

–
Ensures On-State Losses Are Minimized  
Excellent Q

GD X

R

DS(ON)

Product (FOM)  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
Advanced Technology for DC-DC Converters  
7.5m
Ω @ V

GS

= 10V  
11.5m
Ω @ V

GS

= 4.5V  
30A  
25A  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
60V  
Occupies Just 33% of The Board Area Occupied by SO-8,  
Enabling Smaller End Product  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable And Robust End Application  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
Description  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) yet maintain superior switching performance, making it ideal  
for high efficiency power management applications.  
Mechanical Data  
Applications  
Case: PowerDI

®

3333-8  
Synchronous Rectifier  
Backlighting  
Power Management Functions  
DC-DC Converters  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminal Finish
–
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.008 grams (Approximate)  
PowerDI3333-8  
Pin 1  
S
D
S
S
G
G
D
D
D
D
S
Top View  
Equivalent Circuit  
Bottom View  
Ordering Information
(Note 4)  
Part Number  
DMT6010LFG-7  
DMT6010LFG-13  
Case  
Packaging  
2,000/Tape & Reel  
3,000/Tape & Reel  
PowerDI3333-8  
PowerDI3333-8  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s
definitions of Halogen- and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
SG6 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 20 = 2020)  
WW = Week Code (01 to 53)  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
60  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
13  
11  
A
A
I

D  

I

D  

T

A

= +70°C  
Continuous Drain Current (Note 5) V

GS

= 10V  
T

C

= +25°C  
T

C

= +70°C  
Maximum Continuous Body Diode Forward Current (Note 5)  
Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L=0.1mH  
30  
24  
3
A
A
I

S  

80  
20  
20  
I

DM  

I

AS  

E

AS  

A
Avalanche Energy, L=0.1mH  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
Value  
Unit  
2.2  
T

A

= +25°C  
Total Power Dissipation (Note 5)  
T

C

= +25°C  
W
P

D  

41  
Steady State  
55  
35  
3
Thermal Resistance, Junction to Ambient (Note 5)  
t<10s  
Thermal Resistance, Junction to Case (Note 5)  
Operating and Storage Temperature Range  
R

θ
JA  

°C/W  
°C  
R

θ
JC  

-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 6)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
60  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250μA  
μ
A  
nA  
V

DS

= 48V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
±100  
I

GSS  

ON CHARACTERISTICS
(Note 6)  
Gate Threshold Voltage  
0.8  
—
—
—
—
6
2
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 4.5V, I

D

= 20A  
V

GS

= 0V, I

S

= 20A  
7.5  
11.5  
1.2  
Static Drain-Source On-Resistance  
7.8  
0.9  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 7)  
Input Capacitance  
—
—
—
2,090  
746  
—
—
—
C

iss  

C

oss  

C

rss  

V

DS

= 30V, V

GS

= 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
38.5  
V

DS

= 0V, V

GS

= 0V,  
f = 1.0MHz  
Gate Resistance  
—
0.59  
—
Ω
R

G  

—
—
—
—
—
—
—
—
19.3  
41.3  
6.0  
—
—
—
—
—
—
—
—
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Gate-Drain Charge  
Q

G  

Q

G  

nC  
ns  
V

DS

= 30V, I

D

= 20A  
Q

GS  

Q

GD  

t

D(ON)  

t

R  

8.8  
Turn-On Delay Time  
5.7  
Turn-On Rise Time  
4.3  
V

DD

= 30V, V

GS

= 10V,  
I

D

= 20A, R

G

= 3
Ω  
Turn-Off Delay Time  
23.4  
9.7  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Notes:  
5. R  
is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate. R  
is guaranteed by design  
θ
JC  
θ
JA  
while R  
is determined by the user’s board design.  
θ
JA  
6. Short duration pulse test used to minimize self-heating effect.  
7. Guaranteed by design. Not subject to product testing.  
2 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V
= 5.0V  
DS  
V
= 10V  
GS  
V
= 3.0V  
GS  
V
= 4.5V  
GS  
V
V
= 4.0V  
= 3.5V  
GS  
GS  
T
= 150°C  
A
T
= 125°C  
A
T
= 85°C  
A
T
= 25°C  
A
V
= 2.5V  
T
= -55°C  
GS  
A
V
= 2.2V  
GS  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
1
2
3
4
5
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 2 Typical Transfer Characteristics  
Figure 1 Typical Output Characteristic  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
0.01  
0.009  
0.008  
0.007  
0.006  
0.005  
0.004  
V
= 4.5V  
GS  
T =
 
150°C  
A
V
V
= 4.5V  
GS  
T
= 125°C  
A
T =
 
85°C  
A
0.008  
0.006  
0.004  
0.002  
0
T
T
= 25°C  
= 10V  
A
GS  
= -55°C  
A
0
5
10  
15  
20  
25  
30  
0
2
4
6
8
10 12 14 16 18 20  
I

D

, DRAIN-SOURCE CURRENT (A)  
I

D

, DRAIN CURRENT (A)  
Figure 4 Typical On-Resistance vs.  
Drain Current and Temperature  
Figure 3 Typical On-Resistance vs.  
Drain Current and Gate Voltage  
2
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
1.6  
1.2  
0.8  
0.4  
V
= 10V  
GS  
= 10A  
I
V
= 5V  
D
GS  
= 5A  
I
D
V
= 5V  
GS  
= 5A  
I
D
0.008  
0.006  
0.004  
0.002  
0
V
= 10V  
GS  
= 10A  
I
D
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
Figure 6 On-Resistance Variation with
T
emperature  
Figure 5 On-Resistance Variation with
T
e
mperature  
3 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
30  
25  
20  
15  
10  
5
2
1.8  
1.6  
1.4  
1.2  
1
T
= 150°C  
A
I
= 1mA  
D
T
= 125°C  
A
T
= 85°C  
A
I

D

=
250μA  
T
A
= 25°C  
A
0.8  
0.6  
0.4  
T
= -55°C  
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPER
A
T
URE (
C)  
V

S
D

, SOURCE-DRAIN VOLTAGE (V)  
Figure 8 Diode Forward Voltage vs. Current  
Fi
g
ure 7 Gat
e
Threshol
d
Variation vs. Junction Temperature  
10000  
10  
9
8
7
6
5
4
3
2
1
0
V
I
= 30V  
DS  
= 20A  
D
C
C
iss  
1000  
100  
10  
oss  
C
rss  
f = 1MHz  
1
0
5
10 15 20 25 30 35 40 45  
Q

g

, TOTAL GATE CHARGE (nC)  
Figure 10 Gate Charge  
0
10  
20  
30  
40  
V

DS

, DRAIN-SOURCE VOL
T
A
GE (V)  
Figure 9 Typical Junction Capacitance  
100  
10  
P

W

= 100µs  
R

DS(ON)  

Limited  
P

W

= 1ms  
P

W

= 10ms  
1
P

W

= 100ms  
P

W

= 1s  
P

W

= 10s  
0.1  
T

J(Max)

= 150
℃
 
T

C

= 25
℃  
Single Pulse  
DUT on 1*MRP  
board  
0.01  
0.001  
DC  
V

GS

= 10V  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 11 SOA, Safe Operation Area  
4 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
1
D = 0.9  
D = 0.7  
D = 0.5  
D = 0.3  
0.1  
D = 0.1  
D = 0.05  
D = 0.02  
D = 0.01  
D = 0.005  
0.01  
R

JA

(t) = r(t) * R

JA  

122°C/W  
R

JA

=
D = Single Pulse  
Duty Cycle, D = t1/ t2  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100 1000  
t1, PULSE DURATION TIME (sec)  
F
r
T
r
R
is
Figure 12 Transient Thermal Resistance  
5 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
Package Outline Dimensions  
PowerDI3333-8  
PowerDI3333-8  
Dim Min
 
Max Typ  
0.75 0.85 0.80  
A1
0.00 0.05 0.02  
A3  
A1  
A
A
Seating Plane  
A3  
b
0.203  
0.27 0.37 0.32  
  
  
b2
0.15 0.25 0.20  
3.25 3.35 3.30  
D2
2.22 2.32 2.27  
3.25 3.35 3.30  
E2
1.56 1.66 1.61  
E3
0.79 0.89 0.84  
E4
1.60 1.70 1.65  
D
D
L(4x)  
E4  
D2  
1
E
Pin #1 ID  
b2(4x)  
e
L
0.65  
0.35 0.45 0.40  
  
  
E
L1  
z
0.39  
0.515  
  
  
  
  
E3  
E2  
All Dimensions in mm  
L1(3x)  
8
z(4x)  
b
e
Suggested Pad Layout  
PowerDI3333-8  
Dimensions Value
 
(in mm)  
X3  
X2  
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
8
X
Y4  
X1  
X2  
X3  
Y
X1  
Y1  
Y2  
Y1  
Y2  
Y3  
Y4  
Y3  
Y
1
X
C
6 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2  

DMT6010LFG  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
June 2020  
© Diodes Incorporated  
DMT6010LFG  
Document number: DS36620 Rev. 5 – 2