Diodes-Incorporated-DMT6013LFDF-7

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Diodes-Incorporated-DMT6013LFDF-7
DMT6013LFDF  
60V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
I

D

Max  
T

A

= +25°C  
10.0A  
100% Unclamped Inductive Switch (UIS) Test in Production  
0.6mm Profile
—
Ideal for Low Profile Applications  
PCB Footprint of 4mm

2  

BV

DSS  

R

DS(ON)

Max  
15m
Ω
@ V

GS

= 10V  
60V  
8.4A  
21.5
mΩ @ V

GS

= 4.5V  
Low On-Resistance  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Mechanical Data  
Description  
Case: U-DFN2020-6 (Type F)  
This new generation MOSFET is designed to minimize the on-state  
resistance (R

DS(ON)

) yet maintain superior switching performance,  
which makes it ideal for high-efficiency power management  
applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish
—
NiPdAu over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208
 

e4  

Weight: 0.007 grams (Approximate)  
Applications  
DC/DC Converter  
Adaptor Switch  
Wireless Charging  
D
U-DFN2020-6 (Type F)  
G
Pin1  
S
Pin Out  
Bottom View  
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
DMT6013LFDF-7  
DMT6013LFDF-13  
Package  
U-DFN2020-6 (Type F)  
U-DFN2020-6 (Type F)  
Quantity per Reel  
3000  
10,000  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlori
ne (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
1 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
Marking Information  
Site 1:  
13 = Product Type Marking Code  
YM = Date Code Marking  
Y =
 
Year (ex: F = 2018)  
13  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2017  
2018  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
Code  
E
F
G
H
I
J
K
L
M
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
Site 2:  
13 = Product Type Marking Code  
YWX = Date Code Marking  
Y =
 
Year (ex:
 
8 = 2018)  
W = Week (ex: a = week27; z represents week 52 and 53)  
X = Internal code (ex: U = Monday)  
Date Code Key  
Year  
2017  
2018  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
Code  
7
8
9
0
1
2
3
4
5
Week  
Code  
1-26  
A-Z  
27-52  
a-z  
53  
z
Internal Code  
Code  
Sun  
T
Mon  
U
Tue  
V
Wed  
W
Thu  
X
Fri  
Y
Sat  
Z
2 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
60  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

Steady  
State  
T

A

= +25°C  
T

A

= +70°C  
10.0  
8.0  
A
Continuous Drain Current (Note 6) V

GS

= 10V  
I

D  

Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Maximum Body Diode Continuous Current  
60  
10  
A
A
I

DM  

I

S  

Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current (Note 7) L = 0.1mH  
60  
11.7  
6.8  
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy (Note 7) L = 0.1mH  
mJ  
Thermal Characteristics  
Characteristic  
Symbol  
Value  
0.9  
Unit  
W
T

A

= +25°C  
Total Power Dissipation (Note 5)  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
P

D  

R

ϴ
JA  

P

D  

0.58  
139  
T

A

= +70°C  
°C/W  
W
1.9  
T

A

= +25°C  
T

A

= +70°C  
1.2  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 6)  
67  
°C/W  
W
R

ϴ
JA  

P

D  

10.8  
T

C

= +25°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
11.6  
°C/W  
°C  
R

ϴ
JC  

-55 to +150  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 8)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
60  
  
V
µA  
nA  
  
1
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250µA  
V

DS

= 48V, V

GS

= 0V  
V

GS

=
20V, V

DS

= 0V  
100  
I

GSS  

ON CHARACTERISTICS
(Note 8)  
Gate Threshold Voltage  
1
2.3  
15  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10V, I

D

= 8.5A  
V

GS

= 4.5V, I

D

= 6A  
V

GS

= 0V, I

S

= 1A  
12.2  
16.9  
0.7  
Static Drain-Source On-Resistance  
21.5  
1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 9)  
Input Capacitance  
1081  
253  
22  
  
  
  
  
  
  
  
  
  
  
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 30V, V

GS

= 0V  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
1.22  
15  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 10V)  
Total Gate Charge (V

GS

= 4.5V)  
Gate-Source Charge  
Q

g  

8.5  
Q

g  

nC
  
V

DS

= 30V, I

D

= 10A  
2.2  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
4.4  
Turn-On Delay Time  
4.3  
Turn-On Rise Time  
6.5  
V

GS

= 10V, V

DD

= 30V,  
R

g

= 6
Ω
,I

D

= 10A  
ns  
Turn-Off Delay Time  
15.8  
6.1  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
19.7  
9.5  
ns  
t

RR  

I

S

= 10A, di/dt = 100A/
μ
s  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
3 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
V
= 10V  
GS  
V
V
= 5
.
0
V  
DS  
V
= 3
.
5
V  
GS  
= 6V  
GS  
V
= 4
.
5
V  
GS  
V
= 4V  
GS  
T
= 150°C  
V
= 3V  
J
GS  
T
= 25°C  
T
= 125°C  
J
J
T
= 85°C  
J
T
= -55°C  
J
V
= 2
.
5
V  
V
= 2
.
2
V  
GS  
GS  
0
0
0
1
2
3
4
5
1
1.5  
2
2.5  
3
3.5  
4
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
V

GS

, GATE-SOURCE VOL
T
AGE
(
V)  
Figure 1
T
y
pical Output Characteristic  
Figure 2
T
y
pical Transfer Characteristics  
0.02  
0.1  
0.08  
0.06  
0.04  
0.02  
0
0.018  
I

D

=8.5A  
I
V
= 4
.
5
V  
GS  
0.016  
0.014  
0.012  
0.01  
I
= 6A  
D
V
= 10V  
GS  
0.008  
0.006  
0
4
8
12  
16  
20  
0
5
10  
15  
20  
25  
30  
V

G
S

, GATE-SOURCE VOL
T
AGE
(
V)  
Figure 4
T
y
pical Drain-Source On-Resistance  
vs. Gate-Source Voltage  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3
T
y
pical On-Resistance vs.  
Dr
a
in Current and Gate Voltage  
0.022  
0.02  
1.8  
1.6  
1.4  
1.2  
V
= 10V  
GS  
V

GS

=10V,  
T
= 150°C  
= 125°C  
J
I =8.5A  

D

T
0.018  
0.016  
0.014  
0.012  
0.01  
J
V
= 4
.
5
V  
GS  
T
= 85°C  
= 25°C  
= -55°C  
J
I
= 6A  
D
T
J
1
T
J
0.008  
0.006  
0.004  
0.8  
0.6  
0
5
10  
15  
20  
25  
30  
–
5
0
–
2
5  
0
25  
50  
75 100 125 150  
I

D

, DRAIN CURRENT (A)  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 6 On-Resistance Variation with
T
e
m
p
e
r
a
ture  
Figure 5
T
y
pical On-Resistance vs.  
Drain Current and
T
e
m
p
e
r
a
ture  
4 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
2.2  
2
0.03  
0.025  
0.02  
0.015  
0.01  
0.005  
0
V
= 4
.
5
V  
= 6A  
GS  
I
D
1.8  
1.6  
1.4  
1.2  
1
I
= 1mA  
D
I
= 250µA  
D
V

GS

=10V,  
I

D

=8.5A  
0.8  
-50 -25  
0
25  
50  
75 100 125 150  
–
5
0
–
2
5  
0
25  
50  
75 100 125
 
150  
T

J

, JUNCTION TEMPERATURE
C)  
Figure 8 Gate Threshold Variation vs. Junction Temperature  
T

J

, JUNCTION TEMPERATURE (
C)  
Figure 7 On-Resistance Variation with
T
e
m
p
e
r
a
ture  
30  
25  
20  
15  
10  
5
10000  
f=
1
MHz  
C
iss  
1000  
C
o
s
s  
T
J
= 150°C  
J
100  
T
= 25°C  
J
T
= 125°C  
= 85°C  
T
= -55°C  
T
J
J
C
r
s
s  
10  
1
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
10  
20  
30  
40  
50  
60  
V

SD

, SOURCE-DRAIN VOL
T
AGE
(
V)  
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
Figure 9 Diode Forward Voltage vs. Current  
Figure 10
T
y
pical Junction Capacitance  
10  
8
100  
10  
1
R
D
S
(
on)  
Limi
t
e
d  
P
= 100µs  
W
6
4
2
DC  
P
= 10s  
W
V
I
= 30V  
DS  
P
= 1s  
W
= 10A  
D
P
= 100ms  
W
T

J
(max)

= 150°C  
T

C

= 25°C  
P
= 10ms  
0.1  
W
P
= 1ms  
W
V

GS

= 10V  
Single Pul
s
e  
DUT on 1 * MRP Board  
0.01  
0
0
0.01  
0.1  
1
10  
100  
3
6
9
12  
15  
V

DS

, DRAIN-SOURCE VOL
T
AGE
(
V)  
Figure 12 SOA, Safe Operation Area  
Q

g

, TO
T
AL GATE CHARGE (nC)  
Figure 11 Gate Charge  
5 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
1
D = 0
.
9  
D = 0
.
7  
D = 0
.
5  
D = 0
.
3  
0.1  
D = 0
.
1  
D = 0
.
0
5  
D = 0
.
0
2  
D = 0
.
0
1  
D = 0
.
0
05  
0.01  
0.001  
R

JA

(t) = r(t) *
R

JA  

R

JA

= 137°C/W  
Duty Cycle, D = t1/ t2  
D = Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13 Transient Thermal Resistance  
6 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
Package Outline Dimensions  
Please see

r the latest version.  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
A3  
A1  
Dim  
A
A1  
A3  
b
Min Max  
0.57 0.63  
0.00 0.05  
Typ  
0.60  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
A
Seating Plane  
–
–
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a
0.33 0.43  
E
E2  
E2a  
e
1.95 2.05  
1.05 1.25  
0.65 0.75  
0.65 BSC  
D2a  
E2a  
z2  
e2  
e3  
e4  
k
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
D2  
E
E2  
k1  
k2  
L
0.15 BSC  
0.36 BSC  
0.225 0.325
 
0.275  
0.20 BSC  
k1  
e2  
L
k
z1  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
All Dimensions in mm  
z(4x)  
Suggested Pad Layout  
Please see

r the latest version.  
U-DFN2020-6 (Type F)  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
C
X
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
7 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

DMT6013LFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
8 of 8  
June 2018  
© Diodes Incorporated  
DMT6013LFDF  
D
atasheet number: DS39625 Rev. 4
–
2  

Mouser Electronics  
Authorized Distributor  
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