Diodes-Incorporated-DMT8008LSS-13

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Diodes-Incorporated-DMT8008LSS-13
DMT8008LSS  
80V N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
High Conversion Efficiency  
I

D

Max  
T

A

= +25°C  
13A  
BV

DSS  

R

DS(ON)

Max  
Low R

DS(ON)

–
Minimizes On-State Losses  
Low Input Capacitance  
8m
Ω @ V

GS

= 10V  
9.5m
Ω @ V

GS

= 6V  
12m
Ω @ V

GS

= 4.5V  
Fast Switching Speed  
80V  
12A  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable and Robust End Application  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
For automotive applications requiring specific change control  
(i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and  
manufactured in IATF 16949 certified facilities), please  

contact us

or your local Diodes representative.  
11A  
Mechanical Data  
Description and Applications  
Case: SO-8  
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

), yet maintain superior switching performance, making it  
ideal for high efficiency power management applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 3 per J-STD-020  
Terminal Finish
–
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.074 grams (Approximate)  
High Frequency Switching  
Synchronous Rectification  
DC-DC Converters  
SO-8  
S
S
S
G
D
D
D
Pin 1  
D
Top View  
Top View  
Pin-Out  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMT8008LSS-13  
SO-8  
2,500/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
8
5
= Manufacturer’s Marking  
T8008LS = Product Type Marking Code  
YYWW = Date Code Marking  
YY or YY = Year (ex: 19 = 2019)  
WW = Week (01 to 53)  
T8008LS  
YY WW  
1
4
1 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
80  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
13  
10  
A
A
I

D  

T

A

= +70°C  
Continuous Drain Current (Note 6) V

GS

= 10V  
T

C

= +25°C  
32  
26  
I

D  

I

DM  

I

S  

T

C

= +70°C  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Body Diode Forward Current (10µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.3mH (Note 9)  
110  
10  
A
A
110  
27  
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy, L = 0.3mH (Note 9)  
109  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

Value  
1.3  
Unit  
W
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
94  
°C/W  
W
R

θ
JA  

2.2  
58  
P

D  

Thermal Resistance, Junction to Ambient (Note 6)  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
°C/W  
°C/W  
°C  
R

θ
JA  

10  
R

θ
JC  

T

J,

T

STG  

-55 to +150  
Electrical Characteristics
(T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
80  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 1mA  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
μ
A  
μ
A  
V

DS

= 64V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
±1  
I

GSS  

ON CHARACTERISTICS
(Note 7)  
Gate Threshold Voltage  
1.3  
—
—
—
—
—
6
2.8  
8
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 10A  
V

GS

= 6V, I

D

= 10A  
V

GS

= 4.5V, I

D

= 6A  
V

GS

= 0V, I

S

= 20A  
Static Drain-Source On-Resistance  
7
9.5  
12  
1.2  
8.3  
0.8  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 8)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2840  
797  
42  
1.7  
24  
47  
7
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 40V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

Q

g  

nC  
ns  
V

DD

= 40V, I

D

= 2A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
11  
6
Turn-On Delay Time  
Turn-On Rise Time  
6
V

DD

= 40V, V

GS

= 10V,  
I

D

= 2A, R

g

= 1.6
Ω  
Turn-Off Delay Time  
27  
44  
43  
59  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
ns  
t

RR  

I

F

= 2A, di/dt = 10
0A/μs  
Body Diode Reverse Recovery Charge  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
2 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
V

GS

= 3.5V  
V

GS

= 4.0V  
V

GS

= 4.5V  
V

GS

= 10V  
V

DS

= 5V  
V

GS

= 3.0V  
T

J

= 85
℃
 
T

J

= 25
℃  
V

GS

= 2.8V  
V

GS

= 2.6V  
T

J

= 150
℃  
T

J

= 125
℃  
V

GS

= 2.4V  
3
T

J

= -55
℃  
0
0.0  
1
1.5  
2
2.5  
3
3.5  
4
0
1
2
4
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.1  
0.08  
0.06  
0.04  
0.02  
0
0.01  
0.009  
0.008  
0.007  
0.006  
0.005  
0.004  
V

GS

= 4.5V  
V

GS

= 6.0V  
V

GS

= 10V  
I

D

= 10A  
0
5
10  
15  
20  
25  
30  
0
4
8
12  
16  
20  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
Figure 4. Typical Transfer Characteristic  
2
1.8  
1.6  
1.4  
1.2  
1
0.014  
0.012  
0.01  
V

GS

= 10V, I

D

= 10A  
V

GS

= 6.0V, I

D

= 10A  
V

GS

= 10V  
T

J

= 150
℃  
T

J

= 125
℃  
0.008  
0.006  
0.004  
0.002  
0
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= -55
℃  
V

GS

= 4.5V, I

D

= 6.0A  
0.8  
0.6  
-50 -25  
0
25  
50  
75 100
 
125 150  
0
5
10  
15  
20  
25  
30  
T

J

, JUNCTION TEMPERATURE (
℃
)  
I

D

, DRAIN CURRENT (A)  
Figure 6. On-Resistance Variation with Junction  
Temperature  
Figure 5. Typical On-Resistance vs. Drain Current  
and Junction Temperature  
3 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
2.4  
2.1  
1.8  
1.5  
1.2  
0.9  
0.6  
V

GS

= 4.5V, I

D

= 6.0A  
I

D

= 1mA  
V

GS

= 6.0V, I

D

= 10A  
I

D

= 250
μ
A  
0.008  
0.006  
0.004  
0.002  
0
V

GS

= 10V, I

D

= 10A  
-50 -25  
0
25  
50  
75 100
 
125 150  
-50 -25  
0
25  
50  
75 100
 
125 150  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Junction  
Temperature  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
10000  
1000  
100  
10  
30  
25  
20  
15  
10  
5
V

GS

= 0V  
f = 1MHz  
C

iss  

C

oss  

C

rss  

T

J

= 85

o

C  
T

J

= 150

o

C  
T

J

= 25

o

C  
T

J

= 125

o

C  
T

J

= -55

o

C  
1
0
0
20  
40  
60  
80  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
10  
8
1000  
100  
10  
R

DS(ON)  

Limited  
P

W

= 100µs  
P

W

= 1ms  
6
1
P

W

= 10ms  
P

W

= 100ms  
4
0.1  
T

J(Max)

= 150
℃
 
T

C

= 25
℃  
P

W

= 1s  
P

W

= 10s  
DC  
Single Pulse  
DUT on 1*MRP  
Board  
2
V

DS

= 40V, I

D

= 2.0A  
0.01  
V

GS

= 10V  
0
0.001  
0
5
10 15 20 25 30 35 40 45 50  
Q

g

(nC)  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
1
D=0.7  
D=0.5  
D=0.9  
D=0.3  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 95
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.001  
1E-06 1E-05
 
0.0001 0.001
 
0.01  
0.1  
1
10  
100  
1000 10000
 
10000
0
1
000000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
Package Outline Dimensions  
Please see

r the latest version.  
SO-8  
SO-8  
Max  
Dim  
A
A1  
b
c
D
Min  
1.40  
0.10  
0.30  
0.15  
4.85  
5.90  
3.80  
3.85  
—  
Typ  
1.45  
0.15  
0.40  
0.20  
4.90  
6.00  
3.85  
3.90  
1.27  
0.35  
0.72  
0.65  
1.50  
0.20  
0.50  
0.25  
4.95  
6.10  
3.90  
3.95  
—  
E
1
E
E1  
E0  
e
h
L
b
E1  
h
–
—  
Q
0.62  
0.60  
0.82  
0.70  
sides)  
All  
(
7°  
9°  
Q
 
c
All Dimensions in mm  
4°± 3°  
A
Gauge Plane  
Seating Plane  
L
A1  
e
E0  
D
Suggested Pad Layout  
Please see

r the latest version.  
SO-8  
X1  
Dimensions Value
 
(in mm)  
C
X
X1  
Y
1.27  
0.802  
4.612  
1.505  
6.50  
Y1  
Y1  
Y
C
X
6 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

DMT8008LSS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
December 2019  
© Diodes Incorporated  
DMT8008LSS  
Document number: DS40518
 
Rev. 3 – 2  

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