Diodes-Incorporated-DMTH10H017LPD-13

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Diodes-Incorporated-DMTH10H017LPD-13
DMTH10H017LPD  
Green  
100V 175°C DUAL N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features and Benefits  
Rated to +175°C  
Environments  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable and Robust End Application  
High Conversion Efficiency  
Low R

DS(ON)

–
Minimizes On State Losses  
Low Input Capacitance  
Fast Switching Speed  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note
3)  
Qualified to AEC-Q101 Standards for High Reliability  
An Automotive-Compliant Part is Available Under Separate  
–
Ideal for High Ambient Temperature  
I

D

max  
BV

DSS  

R

DS(ON)

max  
T

C

= +25°C  
59A  
45A  
17.4
mΩ @ V

GS

= 10V  
30.3
mΩ @ V

GS

= 4.5V  
100V  
Description and Applications  
This new generation MOSFET features low on-resistance and fast  
switching, making it ideal for high efficiency power management  
applications.  
Synchronous Rectifier  
DC-DC Converters  
Primary Side Switching  
Mechanical Data  
®
Case: PowerDI
 
5060-8  
Case Material:
Molded Plastic, “Green” Molding Compound. UL  
Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish
–
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208
 
e3  
Weight: 0.097 grams (Approximate)  
D1  
S1  
D2  
S1  
D1  
D1  
D2  
D2  
G1  
S2  
G1  
G2  
G2  
S2  
Pin1  
Top View  
Pin Configuration  
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
DMTH10H017LPD-13  
Case  
Packaging  
2500 / Tape & Reel  
PowerDI5060-8 (Type E)  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  

2. See https://www.diodes.com/quality/lead-

free/ for more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <
900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
D1 D1 D2 D2  
= Manufacturer’s Marking  
H10H017LD = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Year (ex: 19 = 2019)  
H10H017LD  
YY WW  
WW = Week (01 to 53)  
S1 G1 S2 G2  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
100  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

C

= +25°C  
59  
42  
A
Continuous Drain Current, V

GS

= 10V (Note 6)  
I

D  

T

C

= +100°C  
Maximum Body Diode Forward Current (Note 6)  
60  
236  
236  
10  
A
A
I

S  

Pulsed Drain Current (10
μ
s Pulse, T

C

=
+25°C, Package Limited
)  
I

DM  

I

SM  

I

AS  

A
Pulsed Body Diode Forward Current (10
μ
s Pulse, T

C

=
+25°C, Package Limited
)  
Avalanche Current, L = 3mH (Note 9)  
A
Avalanche Energy, L = 3mH (Note 9)  
Avalanche Current, L = 1mH (Note 9)  
Avalanche Energy, L = 1mH (Note 9)  
150  
10  
mJ  
A
E

AS  

I

AS  

50  
mJ  
E

AS  

Thermal Characteristics  
Characteristic  
Symbol  
P

D  

Value  
Unit  
W
Total Power Dissipation  
2.6  
T

A

= +25°C  
T

C

= +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation  
56  
93  
°C/W  
W
R

θ
JA  

P

D  

Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
1.6  
°C/W  
°C  
R

θ
JC  

-55 to +175  
T

J,

T

STG  

Electrical Characteristics
(@T

C

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
100  
  
V
BV

DSS  

I

DSS  

  
1
V

GS

= 0V, I

D

= 1mA  
V

DS

= 80V, V

GS

= 0V  
V

GS

= ±16V, V

DS

= 0V  
µA  
nA  
±100  
I

GSS  

ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1
3
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

13.7  
23.8  
V

DS

= V

GS

, I

D

= 250µA  
V

GS

= 10V, I

D

= 17A  
V

GS

= 4.5V, I

D

= 10A  
V

GS

= 0V, I

S

= 17A  
17.4  
30.3  
1.3  
Static Drain-Source On-Resistance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
1986  
333  
20  
C

iss  

C

oss  

C

rss  

R

G  

  
  
—
  
—
  
  
  
—
  
—
  
V

DS

= 50V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
1.17  
14.4  
28.6  
5.2  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

Q

g  

nC
  
V

DS

= 50V, I

D

= 20A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
8.2  
Turn-On Delay Time  
9.8  
Turn-On Rise Time  
16.3  
32.6  
21.6  
40.6  
58.1  
V

DD

= 50V, V

GS

= 10V,  
ns  
Turn-Off Delay Time  
R

G

= 11
Ω
, I

D

= 20A  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
t

RR  

I

F

= 17A, di/dt = 10
0A/μs  
I

F

= 17A, di/dt = 10
0A/μs  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
6. Thermal resistance from junction to solder point (on the exposed drain pin).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
2 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
20  
15  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

GS

= 4.5V  
V

GS

= 5.0V  
V

GS

= 6.0V  
V

GS

= 10V  
V

DS

= 5V  
10  
V

GS

= 4.0V  
5
T

J

= 175
℃
 
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= 150
℃  
T

J

= 125
℃  
V

GS

= 3.5V  
4
T

J

= -55
℃  
0.0  
0
0
1
2
3
5
2
2.5  
3
3.5  
4
4.5  
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.2  
0.15  
0.1  
0.05  
0
0.03  
0.025  
0.02  
V

GS

= 4.5V  
I

D

= 10A  
I

D

= 17A  
V

GS

= 6.0V  
V

GS

= 10V  
0.015  
0.01  
0
5
10  
15  
20  
25  
30  
0
4
8
12  
16  
20  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current  
and Gate Voltage  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
0.032  
0.03  
2.2  
2
V

GS

= 10V  
V

GS

= 10V, I

D

= 17A  
T

J

= 175
℃  
0.028  
0.026  
0.024  
0.022  
0.02  
1.8  
1.6  
1.4  
1.2  
1
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 85
℃  
0.018  
0.016  
0.014  
0.012  
0.01  
V

GS

= 6.0V, I

D

= 10A  
V

GS

= 4.5V, I

D

= 10A  
T

J

= 25
℃  
T

J

= -55
℃  
0.8  
0.6  
0.4  
0.008  
0.006  
0.004  
0
5
10  
15  
20  
25  
30  
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Temperature  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current  
and Temperature  
3 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
0.044  
0.04  
3
2.8  
2.6  
2.4  
2.2  
2
V

GS

= 4.5V, I

D

= 10A  
0.036  
0.032  
0.028  
0.024  
0.02  
V

GS

= 6.0V, I

D

= 10A  
I

D

= 1mA  
I

D

= 250
μ
A  
1.8  
1.6  
1.4  
1.2  
1
0.016  
0.012  
0.008  
0.004  
V

GS

= 10V, I

D

= 17A  
-50 -25  
0
25 50 75
 
100 125 150 175  
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
Figure 8. Gate Threshold Variation vs.  
JunctionTemperature  
30  
25  
20  
15  
10  
5
10000  
V

GS

= 0V  
f = 1MHz  
C

iss  

1000  
100  
10  
C

oss  

T

A

= 175

o

C  
T

A

= 150

o

C  
T

A

= 125

o

C  
T

A

= 85

o

C  
C

rss  

T

A

= 25

o

C  
T

A

= -55

o

C  
1
0
0
10 20 30 40 50 60 70 80 90
 
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
0
0.3  
0.6  
0.9  
1.2  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
Figure 10. Typical Junction Capacitance  
1000  
100  
10  
10  
8
R

DS(ON)  

Limited  
6
P

W

= 1µs  
1
P

W

= 10µs  
4
P

W

= 100µs  
0.1  
T

J(Max)

= 175
℃  
T

C

= 25
℃  
Single Pulse  
P

W

= 1ms  
V

DS

= 50V, I

D

= 20A  
P

W

= 10ms  
2
0.01  
0.001  
DUT on Infinite  
Heatsink  
V

GS

= 10V  
P

W

= 100ms  
0
0
5
10  
15  
20  
25  
30  
0.1  
1
10  
100  
1000  
Q

g

(nC)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
1
D=0.7  
D=0.5  
D=0.9  
D=0.3  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
R

θ
JC

(t) = r(t) * R

θ
JC  

R

θ
JC

= 1.6
℃
/W  
Duty Cycle, D = t1/t2  
D=Single Pulse  
0.001  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
Package Outline Dimensions  
PowerDI5060-8 (Type E)  
D
PowerDI5060-8  
(Type E)  
D1  
Dim  
Min  
Max  
Typ  
0( 4x)  
A
A1  
b
0.90  
0
0.33  
1.10 1.00  
0.05 0.02  
0.51 0.41  
x
b1  
b2  
c
0.300 0.366 0.333  
A1  
E1  
E
0.20  
0.23  
0.35 0.25  
0.33 0.277  
y
Seating Plane  
D
5.15 BSC  
e
c
D1  
D2  
D3  
E
E1  
E2  
e
k
k1  
L
La  
L1  
L4  
M
x
y
4.85  
1.40  
–
4.95 4.90  
1.60 1.50  
1
–
3.98  
Ø 1.000
 
Depth 0.07±
 
0.030  
b1( 8x)  
01( 4x)  
6.15 BSC  
5.75  
3.56  
5.85 5.80  
3.76 3.66  
DETAIL A  
b( 8x)  
1
e/2  
1.27BSC  
–
–
–
1.27  
–
0.56  
0.51  
0.51  
0.05  
–
D3  
L
0.71 0.61  
0.71 0.61  
0.20 0.175  
k
b2( 2x)  
A
k1  
–
0.125  
L4  
D2  
3.50  
–
–
10°  
6°  
3.71 3.605  
E2  
D2  
M
DETAIL A  
–
–
1.400  
1.900  
11°  
θ
θ1  
12°  
8°  
7°  
All Dimensions in mm  
La  
L1  
Suggested Pad Layout  
PowerDI5060-8 (Type E)  
X4  
Value  
Dimensions  
8
(in mm)  
C
G
G1  
X
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
1.270  
0.660  
0.820  
0.610  
3.910  
1.650  
1.650  
4.420  
1.270  
1.020  
3.810  
6.610  
Y1  
G1  
X3  
X2  
Y2  
Y3  
X1  
Y( 4x)  
1
G
X
C
6 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

DMTH10H017LPD  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
April 2019  
© Diodes Incorporated  
DMTH10H017LPD  
Document number: DS40752
 
Rev. 4 – 2  

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