Diodes-Incorporated-DMTH3004LFG-13

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Diodes-Incorporated-DMTH3004LFG-13
DMTH3004LFG  
N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8  
Product Summary  
Features and Benefits  
Low R

DS(ON)

—
Ensures On-State Losses are Minimized  
I

D

Max  
T

C

= +25°C  
BV

DSS  

R

DS(ON)

Max  
Excellent Q

gd

x R

DS(ON
)

Product (FOM)  
Small Form Factor Thermally Efficient Package Enables Higher-  
Density End Products  
75A  
50A  
5.5m
Ω @ V

GS

= 10V  
8.5m
Ω @ V

GS

= 4.5V  
30V  
Occupies just 33% of the Board Area Occupied by SO-8 Enabling  
Smaller End Product  
100% UIS (Avalanche) Rated  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
An Automotive-Compliant Part is Available Under Separate  
Description and Applications  
Mechanical Data  
®
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) yet maintain superior switching performance, making it ideal  
for high-efficiency power management applications.  
Case: PowerDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 3 per J-STD-020  
Engine Management Systems  
Body Control Electronics  
DC-DC Converters  
Terminal Connections Indicator: See Diagram  
Terminals: Finish
Matte Tin Annealed over Copper Leadframe.  
e3  
Solderable per MIL-STD-202, Method 208  
Weight: 0.072 grams (Approximate)  
PowerDI3333-8  
Pin 1  
D
S
S
S
8
7
6
5
1
2
3
4
G
G
D
D
D
S
D
Bottom View  
Top View  
Equivalent Circuit  
Top View  
Ordering Information
(Note 4)  
Part Number  
DMTH3004LFG-7  
DMTH3004LFG-13  
Case  
PowerDI3333-8  
PowerDI3333-8  
Packaging  
2,000/Tape & Reel  
3,000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.  
2. See

r more information about Diodes
Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
YS5 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 18 = 2018)  
WW = Week Code (01 to 53)  
YS5  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
30  
Unit  
V
Gate-Source Voltage  
±16  
V
V

GSS  

75  
52  
T

C

= +25°C  
Continuous Drain Current (Notes 6 & 9) V

GS

= 10V  
T

C

= +100°C  
A
A
I

D  

I

D  

15  
10  
T

A

= +25°C  
Continuous Drain Current (Note 5) V

GS

= 10V  
T

A

= +100°C  
Maximum Continuous Body Diode Forward Current (Note 5)  
Pulsed Drain Current (100µs Pulse, Duty Cycle = 1%)  
Pulsed Body Diode Forward Current (100µs Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 0.3mH  
3
A
A
I

S  

250  
250  
27  
I

DM  

I

SM  

I

AS  

E

AS  

A
A
Avalanche Energy, L = 0.3mH  
110  
mJ  
Thermal Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Symbol  
P

D  

R

  

Value  
50  
Unit  
W
Total Power Dissipation (Note 6)  
T

C

= +25°C  
T

A

= +25°C  
Thermal Resistance, Junction to Case (Note 6)  
Total Power Dissipation (Note 5)  
3
2.5  
°C/W  
W
JC  
P

D  

R

  

Thermal Resistance, Junction to Ambient (Note 5)  
Operating and Storage Temperature Range  
60  
°C/W  
°C  
JA  
-55 to +175  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
30  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 250
μA  
μ
A  
nA  
V

DS

= 24V, V

GS

= 0V  
V

GS

= ±16V, V

DS

= 0V  
±100  
I

GSS  

ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
1
—
3
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 4.5V, I

D

= 7A  
V

GS

= 0V, I

S

= 1A  
—
—
—
4.1  
6.2  
0.7  
5.5  
8.5  
1
Static Drain-Source On-Resistance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2370  
1360  
240  
0.6  
20  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 15V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

44  
Q

g  

nC  
ns  
V

DS

= 15V, I

D

= 20A  
7
Q

gs  

Q

gd  

t

D(ON)  

t

R  

8
Gate-Drain Charge  
6.2  
4.3  
21  
Turn-On Delay Time  
Turn-On Rise Time  
V

DD

= 15V, V

GS

= 10V,  
R

L

= 0.75
Ω
, R

g

= 3
Ω
, I

D

= 20A  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

8
Turn-Off Fall Time  
25  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
t

RR  

I

F

= 15A, di/dt = 500A/
μ
s  
37  
nC  
Q

RR  

Notes:  
5. R

JA

is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. R

JC

is guaranteed by design while  
R

JA

is determined by the user’s board design.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. Package limited.  
2 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
50.0  
45.0  
40.0  
35.0  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
V

DS

= 5.0V  
V

GS

= 3.5V  
V

GS

= 4.0V  
V

GS

= 4.5V  
V

GS

= 5.0V  
V

GS

= 10.0V  
V

GS

= 3.2V  
V

GS

= 3.0V  
T

J

= 125
℃  
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= 150
℃  
V

GS

= 2.8V  
V

GS

= 2.7V  
V

GS

= 2.5V  
T

J

= 175
℃  
T

J

= -55
℃  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
3
0
1
2
3
4
5
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
8.00  
7.00  
6.00  
5.00  
4.00  
3.00  
2.00  
1.00  
0.00  
30  
25  
20  
15  
10  
5
V

GS

= 4.5V  
V

GS

= 10V  
I

D

= 20A  
0
0
2
4
6
8
10 12 14 16 18 20  
2
4
6
8
10  
12  
14  
16  
18  
20  
I

D

, DRAIN-SOURCE CURRENT (A)  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4.
 
Typical Transfer Characteristic  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
0.01  
0.008  
0.006  
0.004  
0.002  
0
2
1.8  
1.6  
1.4  
1.2  
1
V

GS

= 10V  
T

J

= 175
℃  
T

J

= 150
℃
T

J

= 125
℃  
V

GS

= 4.5V, I

D

= 7A  
T

J

= 85
℃  
T

J

= 25
℃  
0.8  
0.6  
0.4  
T

J

= -55
℃  
V

GS

= 10V, I

D

= 20A  
0
5
10  
15  
20  
25  
30  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Temperature  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
0.014  
0.012  
0.01  
3
2.5  
2
V

GS

= 4.5V, I

D

= 7A  
I

D

= 1mA  
0.008  
0.006  
0.004  
0.002  
0
1.5  
1
I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 20A  
0.5  
0
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. On-Resistance Variation with Temperature  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
f = 1MHz  
V

GS

= 0V  
C

iss  

C

oss  

T

J

= 85

o

C  
T

J

= 125

o

C  
C

rss  

T

J

= 150

o

C  
T

J

= 175

o

C  
T

J

= 25

o

C  
T

J

= -55

o

C  
10  
0
0
5
10  
15  
20  
25  
30  
0
0.3  
0.6  
0.9  
1.2  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
10  
9
8
7
6
5
4
3
2
1
0
1000  
100  
10  
R

DS(ON)

Limited  
P

W

= 10µs  
P

W

= 100µs  
P

W

= 1ms  
P

W

= 10ms  
1
V

DS

= 15V, I

D

= 20A  
T

J(Max)

= 175
℃
T

C

= 25
℃  
Single Pulse  
DUT on Infinite Heatsink  
V

GS

= 10V  
0.1  
0.01  
P

W

= 100ms  
P

W

= 1s  
0
5
10  
15  
Q

g

(nC)  
Figure 11. Gate Charge  
20  
25  
30  
35  
0.01  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
4 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
0.001  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 131
℃
/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI3333-8  
A3  
A1  
A
PowerDI3333-8  
Dim Min
 
Max Typ  
0.75 0.85 0.80  
A1
0.00 0.05 0.02  
Seating Plane  
A
D
A3  
b
0.203  
0.27 0.37 0.32  
  
  
L( 4x)  
E4  
D2  
b2
0.15 0.25 0.20  
3.25 3.35 3.30  
D2
2.22 2.32 2.27  
3.25 3.35 3.30  
1
D
Pin #1 ID  
E
b2( 4x)  
E2
1.56 1.66 1.61  
E3
0.79 0.89 0.84  
E4
1.60 1.70 1.65  
E
e
L
0.65  
0.35 0.45 0.40  
  
  
E3  
E2  
L1  
z
0.39  
0.515  
  
  
  
  
L1( 3x)  
8
All Dimensions in mm  
z( 4x)  
b
e
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI3333-8  
X3  
X2  
8
Dimensions Value
 
(in mm)  
Y4  
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
X
X1  
Y1  
X1  
X2  
X3  
Y
Y2  
Y3  
Y1  
Y2  
Y3  
Y4  
Y
1
X
C
6 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

DMTH3004LFG  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
7 of 7  
July 2018  
© Diodes Incorporated  
DMTH3004LFG  
Document number: DS40696
 
Rev. 3 – 2  

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