Diodes-Incorporated-DMTH43M8LFG-13

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Diodes-Incorporated-DMTH43M8LFG-13
DMTH43M8LFG  
Green  
40V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI3333-8  
Product Summary  
Features and Benefits  
Rated to +175°C  
Environments  
—
Ideal for High Ambient Temperature  
I

D

Max (Note 9)  
T

C

= +25°C  
BV

DSS  

R

DS(ON)

Max  
100% Unclamped Inductive Switching, Test in Production
—  
Ensures More Reliable and Robust End Application  
Low R

DS(ON)

—
Ensures On-State Losses are Minimized  
Excellent Q

GD

× R

DS(ON)

Product (FOM)  
3.0m
Ω @ V

GS

= 10V  
5.0m
Ω @ V

GS

= 5V  
100A  
93A  
40V  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
An Automotive-Compliant Part is Available Under Separate  
Description and Applications  
Mechanical Data  
®
This MOSFET is designed to minimize the on-state resistance  
(R

DS(ON)

) yet maintain superior switching performance, making it ideal  
for high-efficiency power management applications.  
Case: PowerDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish
—
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.008 grams (Approximate)  
DC-DC Converters  
Power Management  
PowerDI3333-8  
Pin 1  
S
D
S
8
7
6
5
1
2
3
4
S
G
G
D
D
D
D
S
Top View  
Bottom View  
Equivalent Circuit  
Top View  
Ordering Information
(Note 4)  
Part Number  
DMTH43M8LFG-7  
DMTH43M8LFG-13  
Case  
Packaging  
2000/Tape & Reel  
3000/Tape & Reel  
PowerDI3333-8  
PowerDI3333-8  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at

Marking Information  
HK8 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
HK8  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
Maximum Ratings
(@T

C

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
40  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

C

= +25°C  
100  
85  
A
A
Continuous Drain Current (Notes 6 & 9) V

GS

= 10V  
Continuous Drain Current (Note 5) V

GS

= 10V  
I

D  

T

C

= +100°C  
T

A

= +25°C  
T

A

= +100°C  
24.0  
16.9  
I

D  

I

DM  

I

S  

Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Body Diode Forward Current (10
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 1mH  
400  
3.05  
400  
18.2  
165  
A
A
A
I

SM  

I

AS  

E

AS  

A
Avalanche Energy, L = 1mH  
mJ  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
Value  
2.62  
Unit  
W
T

A

= +25°C  
T

C

= +25°C  
P

D  

Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
57.8  
°C/W  
W
R

  

JA  
65.2  
P

D  

Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
2.3  
°C/W  
°C  
R

  

JC  
-55 to +175  
T

J,

T

STG  

Electrical Characteristics
(@T

J

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 7)  
Drain-Source Breakdown Voltage  
Symbol Min  
Typ  
Max  
Unit  
Test Condition  
40  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 1mA  
V

DS

= 32V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
μ
A  
nA  
±100  
I

GSS  

ON CHARACTERISTICS
(Note 7)  
Gate Threshold Voltage  
1
1.5  
2.3  
3.4  
—
2.5  
3.0  
5.0  
6.0  
9.0  
1.0  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 5V, I

D

= 15A  
V

GS

= 10V, I

D

= 20A  
V

GS

= 5V, I

D

= 15A  
V

GS

= 0V, I

S

= 20A  
—
—
—
—
—
Static Drain-Source On-Resistance  
Static Drain-Source On-Resistance (T

J

= +175°C) (Note 8)  
R

DS(ON)  

V

SD  

—
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
(Note 8)  
Input Capacitance  
0.8  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2798  
904  
88  
C

iss  

C

oss  

C

rss  

R

G  

V

DS

= 20V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Ω
Reverse Transfer Capacitance  
Gate Resistance  
2.44  
40.1  
5.2  
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
V

DS

= 20V, I

D

= 20A, V

GS

= 10V  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

G  

nC  
Q

GS  

Q

GD  

t

D(ON)  

t

R  

Gate-Drain Charge  
8.8  
Turn-On Delay Time  
5.16  
10.7  
24.6  
12.4  
32.6  
26.6  
Turn-On Rise Time  
V

DD

= 20V, V

GS

= 10V,  
R

G

= 1.6
Ω
, I

D

= 20A  
ns  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
ns  
t

RR  

I

F

= 15A, di/dt = 100A/
μ
s  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PCB, 2oz copper, with thermal bias to bottom layer 1-inch square copper plate.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. Package limit.  
2 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

GS

= 10.0V  
V

GS

= 5.0V  
V

GS

= 4.5V  
V

GS

= 4.0V  
V

DS

= 5.0V  
V

GS

= 3.2V  
V

GS

= 3.0V  
V

GS

= 2.8V  
V

GS

= 3.5V  
T

J

= 175
℃
 
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 25
℃  
T

J

= -55
℃  
T

J

= 85
℃  
V

GS

= 2.5V  
2.5  
0
0.0  
1
1.5  
2
2.5  
3
3.5  
4
0
0.5  
1
1.5  
2
3
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1.Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
4.0  
3.8  
3.6  
3.4  
3.2  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
20  
18  
16  
14  
12  
10  
8
V

GS

= 5.0V  
V

GS

= 10V  
I

D

= 20A  
6
4
2
0
0
5
10  
15  
20  
25  
30  
2
4
6
8
10 12 14 16 18 20  
V

GS

, GATE-SOURCE VOLTAGE (V)  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4. Typical Transfer Characteristic  
5
2
1.8  
1.6  
1.4  
1.2  
1
V

GS

= 10V  
4.5  
4
V

GS

= 10V, I

D

= 20A  
T

J

= 175
℃  
T

J

= 150
℃  
T

J

= 125
℃  
3.5  
3
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= -55
℃  
2.5  
2
V

GS

= 5V, I

D

= 15A  
0.8  
0.6  
0.4  
1.5  
1
0.5  
-50 -25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Temperature  
0
25 50 75
 
100 125 150 175  
0
5
10  
15  
20  
25  
30  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current  
and Temperature  
3 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
2.5  
2
6
5.5  
5
4.5  
4
V

GS

= 5V, I

D

= 15A  
I

D

= 1mA  
1.5  
1
3.5  
3
I

D

= 250
μ
A  
2.5  
2
V

GS

= 10V, I

D

= 20A  
0.5  
0
1.5  
1
0.5  
-50 -25  
0
25 50 75
 
100 125 150 175  
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs.  
JunctionTemperature  
Figure 7. On-Resistance Variation with Temperature  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
10  
C

iss  

V

GS

= 0V  
C

oss  

C

rss  

T

J

= 175
℃  
T

J

= 150
℃  
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= -55
℃  
T

J

= 125
℃  
f = 1MHz  
0
1
0
0.3  
0.6  
0.9  
1.2  
0
5
10  
15  
20  
25  
30  
35  
40  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
10  
8
1000  
100  
10  
R

DS(ON)  

Limited  
P

W

= 1
μ
s  
P

W

= 10
μ
s  
P

W

= 100
μ
s  
P

W

= 1ms  
P

W

= 10ms  
P

W

= 100ms  
DC  
6
4
1
T

J(MAX)

= 175
℃  
V

DS

= 20V, I

D

= 20A  
T

C

= 25
℃  
Single Pulse  
DUT on Infinite  
Heatsink  
2
0.1  
0.01  
V

GS

= 10V  
0
0
10  
20  
Q

g

(nC)  
Figure 11. Gate Charge  
30  
40  
50  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
4 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
1
D=0.9  
D=0.5  
D=0.3  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
0.001  
D=Single Pulse  
R

θ
JC

(t) = r(t) * R

θ
JC  

R

θ
JC

= 2.3
℃
/W  
Duty Cycle, D = t1 / t2  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI3333-8  
A3  
A1  
PowerDI3333-8  
Dim Min
 
Max Typ  
0.75 0.85 0.80  
A1
0.00 0.05 0.02  
A
Seating Plane  
A
A3  
b
0.203  
0.27 0.37 0.32  
  
  
D
L( 4x)  
E4  
b2
0.15 0.25 0.20  
3.25 3.35 3.30  
D2
2.22 2.32 2.27  
3.25 3.35 3.30  
D2  
D
1
E
Pin #1 ID  
E2
1.56 1.66 1.61  
E3
0.79 0.89 0.84  
E4
1.60 1.70 1.65  
b2( 4x)  
E
e
L
L1  
z
0.65  
0.35 0.45 0.40  
  
  
E3  
E2  
0.39  
  
  
  
  
0.515  
L1( 3x)  
All Dimensions in mm  
8
z( 4x)  
b
e
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI3333-8  
X3  
X2  
8
Y4  
Dimensions Value
 
(in mm)  
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
X
X1  
Y1  
X1  
X2  
X3  
Y
Y2  
Y3  
Y1  
Y2  
Y3  
Y4  
Y
1
X
C
6 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

DMTH43M8LFG  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
January 2019  
© Diodes Incorporated  
DMTH43M8LFG  
Document number: DS40743
 
Rev. 3
 
– 2  

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