Diodes-Incorporated-DMTH6010LPS-13

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Diodes-Incorporated-DMTH6010LPS-13
DMTH6010LPS  
Green  
60V 175°C N-CHANNEL ENHANCEMENT MODE MOSFET  
PowerDI5060-8  
Product Summary  
Features  
Rated to +175°C
–
Ideal for High Ambient Temperature  
Environments  
I

D  

BV

DSS  

R

DS(ON)  

T

C

= +25°C  
(Note 9)  
100A  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable and Robust End Application  
High Conversion Efficiency  
8
mΩ @ V

GS

= 10V  
12
mΩ @ V

GS

= 4.5V  
60V  
85A  
Low R

DS(ON)

–
Minimizes On State Losses  
Low Input Capacitance  
Fast Switching Speed  
Description  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
An Automotive-Compliant Part is Available Under Separate  
This new generation N-Channel Enhancement Mode MOSFET is  
designed to minimize R

DS(ON)  

performance.  
, yet maintain superior switching  
Applications  
Mechanical Data  
®
Case: PowerDI
 
5060-8  
Notebook Battery Power Management  
Case Material:
Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Finish – Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.097 grams (Approximate)  
DC-DC Converters  
Load Switch  
PowerDI5060-8  
S
S
D
D
D
D
Pin1  
S
G
Top View  
Pin Configuration  
Top View  
Bottom View  
Internal Schematic  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMTH6010LPS-13  
PowerDI5060-8  
2,500 / Tape & Reel  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  
2. See

r more information about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
D
D
D
D
=Manufacturer
’
s Marking  
H6010LS = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last Two Digits of Year (ex: 19 = 2019)  
WW = Week Code (01 to 53)  
H6010LS  
YY WW  
S
S
S
G
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
60  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

A

= +25°C  
T

A

= +70°C  
T

C

= +25°C  
T

C

= +100°C  
13.5  
10.4  
Continuous Drain Current (Note 5)  
A
A
I

D  

I

D  

100  
75  
Continuous Drain Current (Notes 6 & 9)  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)  
Pulsed Body Diode Forward Current (10
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L=0.1mH  
100  
400  
400  
20  
A
A
I

S  

I

DM  

I

SM  

I

AS  

A
A
Avalanche Energy, L=0.1mH  
20  
mJ  
E

AS  

Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

Value  
2.6  
Unit  
W
T

A

= +25°C  
T

C

= +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
57  
°C/W  
W
R

θ
JA  

136  
1.1  
P

D  

Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
°C/W  
R

θ
JC  

-55 to +175  
°C  
T

J,

T

STG  

Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS
(Note 7)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
V

GS

= 0V, I

D

= 1mA  
—
—
—
60  
—
—
—
1
V
BV

DSS  

I

DSS  

μ
A  
nA  
V

DS

= 48V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
±100  
I

GSS  

ON CHARACTERISTICS
(Note 7)  
Gate Threshold Voltage  
1
—
3
8
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 250
μA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 4.5V, I

D

= 20A  
V

GS

= 0V, I

S

= 20A  
—
—
—
5.4  
8.3  
0.8  
Static Drain-Source On-Resistance  
12  
1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS
 
(Note 8)  
Input Capacitance  
—
—
—
0.2  
—
—
—
—
—
—
—
—
—
—
2,090  
746  
38.5  
0.59  
19.3  
41.3  
6
—
—
—
1.5  
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 30V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge
 
(V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

Q

g  

nC  
ns  
V

DS

= 30V, I

D

= 20A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

8.8  
Gate-Drain Charge  
5.7  
Turn-On Delay Time  
4.3  
Turn-On Rise Time  
V

DD

= 30V, V

GS

= 10V,  
I

D

= 20A, R

G

= 3
Ω  
23.4  
9.7  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
35.4  
38.2  
ns  
t

RR  

I

F

= 20A, di/dt = 10
0A/μs  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
6. Thermal resistance from junction to soldering point (on the exposed drain pad).  
7. Short duration pulse test used to minimize self-heating effect.  
8. Guaranteed by design. Not subject to product testing.  
9. Limited by package.  
2 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
V

GS

=3.5V  
V

DS

= 5V  
V

GS

=3.0V  
V

GS

=4.0V  
V

GS

=4.5V  
V

GS

=10V  
125
℃
 
85
℃  
25
℃  
150
℃  
175
℃  
V

GS

=2.5V  
-55
℃  
V

GS

=2.2V  
4 5  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
5
0
1
2
3
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
0.01  
0.009  
0.008  
0.007  
0.006  
0.005  
0.004  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
V

GS

= 4.5V  
150
℃  
125
℃  
175
℃  
85
℃  
V

GS

=4.5V  
V

GS

=10V  
25
℃  
0.008  
0.006  
0.004  
0.002  
0
-55
℃  
0
2
4
6
8
10 12 14 16 18 20  
0
5
10  
15  
20  
25  
30  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance
 
vs. Drain Current and  
Gate Voltage  
I

D

, DRAIN CURRENT (A)  
Figure 4. Typical On-Resistance
 
vs. Drain Current and  
Temperature  
2
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
1.6  
V

GS

=5V, I

D

=5A  
1.2  
0.8  
0.4  
V

GS

=10V, I

D

=10A  
V

GS

=5V, I

D

=5A  
0.008  
0.006  
0.004  
0.002  
0
V

GS

=10V, I

D

=10A  
-50 -25  
0
25  
50  
75 100
 
125 150 175  
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 5. On-Resistance Variation with Temperature  
Figure 6. On-Resistance Variation with Temperature  
3 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
30  
25  
20  
15  
10  
5
2
1.8  
1.6  
1.4  
1.2  
1
V

GS

=0V, T

J

=125
℃  
V

GS

=0V, T

J

=150
℃  
I

D

=1mA  
V

GS

=0V, T

J

=175
℃  
V

GS

=0V, T

J

=85
℃  
I

D

=250
μ
A  
0.8  
0.6  
0.4  
0.2  
V

GS

=0V, T

J

=25
℃  
V

GS

=0V, T

J

=-55
℃  
0
-50 -25  
0
25  
50  
75 100
 
125 150 175  
0
0.3  
0.6  
0.9  
1.2  
1.5  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 7. Gate Threshold Variation vs. junction  
Temperature  
Figure 8. Diode Forward Voltage vs. Current  
10000  
1000  
100  
10  
10  
9
8
7
6
5
4
3
2
1
0
f=1MHz  
C

iss  

C

oss  

V

DS

=30V, I

D

=20A  
C

rss  

1
0
10  
20  
30  
40  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Q

g

, TOTAL GATE CHARGE
 
(nC)  
Figure 10. Gate Charge  
Figure 9. Typical Junction Capacitance  
1000  
100  
10  
R

DS(ON)

LIMITED  
P

W

=1
μ
s  
P

W

=10
μ
s  
P

W

=100
μ
s  
P

W

=1ms  
P

W

=10ms  
P

W

=100ms  
DC  
1
T

J(MAX)

=175
℃  
T

C

=25
℃  
Single Pulse  
0.1  
0.01  
DUT on infinite  
heatsink  
V

GS

=10V  
0.1  
1
10  
100  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 11. SOA, Safe Operation Area  
4 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
1
D=0.5  
D=0.3  
D=0.9  
D=0.7  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
0.001  
R

θJC

(t)=r(t) * R

θJC  

R

θJC

=1.05
℃
/W  
Duty Cycle, D=t1 /
 
t2  
D=Single Pulse  
1E-06  
1E-05  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 12. Transient Thermal Resistance  
5 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
Package Outline Dimensions  
Please see

r the latest version.  
PowerDI5060-8  
PowerDI5060-8  
D
D1  
Dim  
A
A1  
b
b2  
b3  
c
Min  
0.90  
0.00  
0.33  
0.200  
0.40  
0.230  
Max  
1.10  
0.05  
0.51  
0.350 0.273  
0.80 0.60  
Typ  
1.00  
–
Detail A  
c
0( 4X)  
A1  
0.41  
0.330 0.277  
5.15 BSC  
E1 E  
D
e
D1  
D2  
D3  
E
E1  
E2  
E3  
e
G
K
L
L1  
M
4.70  
3.70  
3.90  
5.10  
4.10  
4.30  
4.90  
3.90  
4.10  
01 (
 
4X)  
1
6.15 BSC  
6.00  
3.68  
5.60  
3.28  
3.99  
5.80  
3.48  
4.19  
b (
 
8X)  
L
e/2  
4.39  
1
b2 (
 
4X)  
1.27 BSC  
0.71  
0.51  
0.51  
0.51  
0.100  
3.235  
1.00  
10º  
0.61  
–
0.61  
D3  
K
–
0.71  
0.200 0.175  
4.035 3.635  
1.40  
12º  
8º  
A
D2  
b3 (
 
4X)  
E3  
E2  
M
M1  
θ
θ
1  
1.21  
11º  
7º  
M1  
Detail A  
6º  
G
L1  
All Dimensions in mm  
Suggested Pad Layout  
Please see

r the latest version.  
PowerDI5060-8  
X4  
X3  
Dimensions  
Value (in mm)  
1.270  
0.660  
0.820  
0.610  
4.100  
0.755  
4.420  
5.610  
1.270  
0.600  
1.020  
0.295  
1.825  
3.810  
0.180  
6.610  
Y2  
Y1  
C
G
G1  
X
Y3  
X1  
X2  
X3  
X4  
Y
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
X2  
Y5  
Y4  
X1  
Y7  
G1  
C
Y6  
Y( 4x)  
X
G
6 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2  

DMTH6010LPS  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Dio
d
e
s Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising o
u
t
o
f, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the  
final and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2019, Diodes Incorporated  
7 of 7  
January 2019  
© Diodes Incorporated  
DMTH6010LPS  
Document number: DS37354 Rev. 7 – 2