Diodes-Incorporated-DMTH8008LFGQ-7

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Diodes-Incorporated-DMTH8008LFGQ-7
DMTH8008LFGQ  
80V +175°C N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features and Benefits  
Rated to +175°C  
Environments  
Low R

DS(ON)

–
Ensures On-State Losses are Minimized  
Excellent Q

gd

× R

DS(ON)

Product (FOM)  
Advanced Technology for DC-DC Converts  
Small Form Factor Thermally Efficient Package Enables Higher  
Density End Products  
–
Ideal for High Ambient Temperature  
I

D

Max  
BV

DSS  

R

DS(ON)

Max  
T

C

= +25°C  
70A  
57A  
6.9m
Ω @ V

GS

= 10V  
10.4m
Ω @ V

GS

= 4.5V  
80V  
Occupies Just 33% of the Board Area Occupied by SO-8 Enabling  
Smaller End Product  
100% Unclamped Inductive Switching (UIS) Test in Production
–  
Ensures More Reliable and Robust End Application  
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
The DMTH8008LFGQ is suitable for automotive applications  
requiring specific change control; this part is AEC-Q101  
qualified, PPAP capable, and manufactured in IATF 16949  
certified facilities.  
Description and Applications  
This MOSFET is designed to meet the stringent requirements of  
automotive applications. It is qualified to AEC-Q101, supported by a  
PPAP and is ideal for use in:  
Mechanical Data  
®
Case: PowerDI
 
3333-8  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminal Connections Indicator: See Diagram  
Terminal Finish
–
Matte Tin Annealed over Copper Leadframe.  
Solderable per MIL-STD-202, Method 208  
Weight: 0.072 grams (Approximate)  
Backlighting  
Power Management Functions  
DC-DC Converters  
PowerDI3333-8  
Pin 1  
S
S
D
S
8
7
6
5
1
2
3
4
G
G
D
D
D
D
S
Top View  
Pin-Out  
Top View  
Bottom View  
Equivalent Circuit  
Ordering Information
(Note 4)  
Part Number  
Case  
Packaging  
DMTH8008LFGQ-7  
DMTH8008LFGQ-13  
2,000/Tape & Reel  
3,000/Tape & Reel  
PowerDI3333-8  
PowerDI3333-8  
Notes:  
1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.  

2. See https://www.diodes.com/quality/lead-free/ for more information

about Diodes Incorporated’s definitions of Halogen
– and Antimony-free, “Green” and  
Lead-free.  
3. Halogen- and Antimony-
free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
HX8 = Product Type Marking Code  
YYWW = Date Code Marking  
YY = Last
 
Two Digits of Year (ex: 20 = 2020)  
WW = Week Code (01 to 53)  
HX8  
PowerDI is a registered trademark of Diodes Incorporated.  
1 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
Maximum Ratings
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
V

DSS  

Value  
80  
Unit  
V
Gate-Source Voltage  
±20  
V
V

GSS  

T

C

= +25°C  
70  
49  
A
A
Continuous Drain Current (Note 7) V

GS

= 10V  
Continuous Drain Current (Note 6) V

GS

= 10V  
I

D  

I

D  

T

C

= +100°C  
T

A

= +25°C  
T

A

= +100°C  
17  
12  
Maximum Continuous Body Diode Forward Current (Note 6)  
Pulsed Drain Current (10
μ
s Pulse, Duty Cycle = 1%)  
Pulsed Body Diode Forward Current (10
μ
s Pulse, Duty Cycle = 1%)  
Avalanche Current, L = 1mH (Note 8)  
45  
280  
280  
18  
A
A
I

S  

I

DM  

I

SM  

I

AS  

E

AS  

A
A
Avalanche Energy, L = 1mH (Note 8)  
162  
mJ  
Thermal Characteristics  
Characteristic  
Total Power Dissipation (Note 5)  
Symbol  
P

D  

Value  
1.2  
Unit  
W
T

A

= +25°C  
Steady State  
T

A

= +25°C  
Steady State  
T

C

= +25°C  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
124  
°C/W  
W
R

JA  

P

D  

2.8  
Thermal Resistance, Junction to Ambient (Note 6)  
Total Power Dissipation (Note 7)  
53  
°C/W  
W
R

JA  

P

D  

50  
3
Thermal Resistance, Junction to Case (Note 7)  
Operating and Storage Temperature Range  
°C/W  
°C  
R

JC  

T

J,

T

STG  

-55 to +175  
Electrical Characteristics
(@T

A

= +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 9)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
80  
—
—
—
—
—
—
1
V
BV

DSS  

I

DSS  

V

GS

= 0V, I

D

= 1mA  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
μ
A  
nA  
V

DS

= 64V, V

GS

= 0V  
V

GS

= ±20V, V

DS

= 0V  
±100  
I

GSS  

ON CHARACTERISTICS (Note 9)  
Gate Threshold Voltage  
1.2  
—
—
—
—
2.5  
6.9  
V
m
Ω  
V
V

GS(TH)  

R

DS(ON)  

V

SD  

V

DS

= V

GS

, I

D

= 1mA  
V

GS

= 10V, I

D

= 20A  
V

GS

= 4.5V, I

D

= 10A  
V

GS

= 0V, I

S

= 20A  
5.3  
7.9  
0.8  
Static Drain-Source On-Resistance  
10.4  
1.2  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 10)  
Input Capacitance  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
2254  
745  
31  
—
—
—
—
—
—
—
—
—
—
—
—
—
—
C

iss  

C

oss  

C

rss  

R

g  

V

DS

= 40V, V

GS

= 0V,  
f = 1MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
1.98  
18.3  
37.7  
5.3  
7.8  
6.9  
12  
Ω
V

DS

= 0V, V

GS

= 0V, f = 1MHz  
Total Gate Charge (V

GS

= 4.5V)  
Total Gate Charge (V

GS

= 10V)  
Gate-Source Charge  
Q

g  

Q

g  

nC  
ns  
V

DS

= 40V, I

D

= 14A  
Q

gs  

Q

gd  

t

D(ON)  

t

R  

Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
V

DD

= 40V, V

GS

= 10V,  
I

D

= 14A, R

G

= 6
Ω  
37  
Turn-Off Delay Time  
t

D(OFF)  

t

F  

21  
Turn-Off Fall Time  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
42  
ns  
t

RR  

I

S

= 14A, di/dt = 10
0A/μs  
53  
nC  
Q

RR  

Notes:  
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.  
7. Thermal resistance from junction to soldering point (on the exposed drain pad).  
8. I

AS

and E

AS

ratings are based on low frequency and duty cycles to keep T

J

= +25°C
 
.  
9. Short duration pulse test used to minimize self-heating effect.  
10. Guaranteed by design. Not subject to product testing.  
2 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
50.0  
45.0  
40.0  
35.0  
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
30  
25  
20  
15  
10  
5
V

GS

= 4.0V  
V

GS

= 4.5V  
V

DS

= 5.0V  
V

GS

= 6.0V  
V

GS

= 3.5V  
V

GS

= 10V  
V

GS

= 3.2V  
V

GS

= 3.0V  
V

GS

= 2.8V  
T

J

= 175
℃
 
T

J

= 150
℃  
T

J

= 125
℃  
T

J

= 85
℃  
T

J

= 25
℃  
T

J

= -55
℃
 
V

GS

= 2.6V  
0.0  
0
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
4.5  
V

GS

, GATE-SOURCE VOLTAGE (V)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
Figure 2. Typical Transfer Characteristic  
0.010  
0.009  
0.008  
0.007  
0.006  
0.005  
0.004  
0.003  
0.002  
0.001  
0.000  
0.1  
0.08  
0.06  
0.04  
0.02  
0
V

GS

= 4.5V  
V

GS

= 10V  
I

D

= 20A  
I

D

= 10A  
0
5
10  
15  
20  
25  
30  
2
4
6
8
10 12 14 16 18 20  
V

GS

, GATE-SOURCE VOLTAGE (V)  
Figure 4. Typical Transfer Characteristic  
I

D

, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
2.4  
2.2  
2
0.016  
0.014  
0.012  
0.01  
V

GS

= 10V  
V

GS

= 10V, I

D

= 20A  
T

J

= 175
℃  
T

J

= 150
℃  
1.8  
1.6  
1.4  
1.2  
1
0.008  
0.006  
0.004  
0.002  
0
T

J

= 125
℃  
T

J

= 85
℃  
V

GS

= 4.5V, I

D

= 10A  
T

J

= 25
℃  
T

J

= -55
℃  
0.8  
0.6  
0.4  
0
5
10  
15  
20  
25  
30  
-50 -25  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 6. On-Resistance Variation with Temperature  
0
25 50 75
 
100 125 150 175  
I

D

, DRAIN CURRENT (A)  
Figure 5. Typical On-Resistance vs. Drain Current  
and Temperature  
3 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
0.02  
0.015  
0.01  
0.005  
0
3
2.8  
2.6  
2.4  
2.2  
2
1.8  
1.6  
1.4  
1.2  
1
I

D

= 1mA  
V

GS

= 4.5V, I

D

= 10A  
I

D

= 250
μ
A  
V

GS

= 10V, I

D

= 20A  
0.8  
0.6  
0.4  
-50 -25  
0
25 50 75
 
100 125 150 175  
-50 -25  
0
25 50 75
 
100 125 150 175  
T

J

, JUNCTION TEMPERATURE (
℃
)  
T

J

, JUNCTION TEMPERATURE (
℃
)  
Figure 8. Gate Threshold Variation vs. Junction  
Temperature  
Figure 7. On-Resistance Variation with Temperature  
V

GS

= 0V  
10000  
30  
25  
20  
15  
10  
5
f = 1MHz  
C

iss  

1000  
100  
10  
C

oss  

C

rss  

T

J

= 175

o

C  
T

J

= 150

o

C  
T

J

= 125

o

C  
T

J

= 85

o

C  
T

J

= 25

o

C  
T

J

= -55

o

C  
1
1000  
100  
10  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
0
0.3  
0.6  
0.9  
1.2  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
V

SD

, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
10  
8
R

DS(ON)  

Limited  
6
P

W

= 1µs  
P

W

= 10µs  
P

W

= 100µs  
4
V

DS

= 40V, I

D

= 14A  
T

J(Max)

= 175
℃
 
T

C

= 25
℃
 
Single Pulse  
DUT on Infinite  
Heatsink  
P

W

= 1ms  
P

W

= 10ms  
P

W

= 100ms  
1
2
DC  
V

GS

= 10V  
0
0.1  
0
5
10  
15  
20  
25  
30  
35  
40  
0.1  
1
10  
100  
Q

g

(nC)  
V

DS

, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
Figure 11. Gate Charge  
4 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
0.01  
D=0.01  
D=0.005  
D=Single Pulse  
R

θ
JA

(t) = r(t) * R

θ
JA  

R

θ
JA

= 47
℃
/W  
Duty Cycle, D = t1 / t2  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
10000  
100000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
Package Outline Dimensions  
PowerDI3333-8  
A3  
A1  
PowerDI3333-8  
Dim Min
 
Max Typ  
A
Seating Plane  
A
0.75 0.85 0.80  
A1
0.00 0.05 0.02  
A3  
b
0.203  
0.27 0.37 0.32  
  
  
D
L(4x)  
E4  
b2
0.15 0.25 0.20  
3.25 3.35 3.30  
D2
2.22 2.32 2.27  
3.25 3.35 3.30  
D2  
D
1
Pin #1 ID  
E
E2
1.56 1.66 1.61  
E3
0.79 0.89 0.84  
E4
1.60 1.70 1.65  
b2(4x)  
E
e
L
L1  
z
0.65  
0.35 0.45 0.40  
  
  
E3  
E2  
0.39  
  
  
  
  
0.515  
L1(3x)  
All Dimensions in mm  
8
z(4x)  
b
e
Suggested Pad Layout  
PowerDI3333-8  
X3  
X2  
8
Y4  
Dimensions Value
 
(in mm)  
C
0.650  
0.420  
0.420  
0.230  
2.370  
0.700  
1.850  
2.250  
3.700  
0.540  
X
X1  
Y1  
X1  
X2  
X3  
Y
Y2  
Y3  
Y1  
Y2  
Y3  
Y4  
Y
1
X
C
6 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

DMTH8008LFGQ  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without  
further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or  
use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights,  
nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use  
and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against  
all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final  
and determinative format released by Diodes Incorporated.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life
 
support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A
 
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2020, Diodes Incorporated  
7 of 7  
April 2020  
© Diodes Incorporated  
DMTH8008LFGQ  
Document number: DS42441
 
Rev. 3 – 2  

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Authorized Distributor  
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