Diodes-Incorporated-FCX458TA
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FCX458
400V NPN HIGH VOLTAGE TRANSISTOR IN SOT89
Features
Mechanical Data
BV
CEO
> 400V
Case: SOT89
I
C
= 225mA Continuous Collector Current
Case Material: M
olded Plastic. “Green”
Molding Compound.
UL Flammability Rating 94V-0
I
CM
= 500mA Peak Pulse Current
Excellent h
FE
Characteristics up to 100mA
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads,
Solderable per MIL-STD-202, Method 208
Weight: 0.055 grams (Approximate)
Low saturation voltage V
CE(sat)
< 200mV
@ 20mA
Complementary PNP Type: FCX558
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT89
C
E
C
B
C
B
E
Top View
Pin-Out
Top View
Equivalent Circuit
Ordering Information
(Note 4)
Product
FCX458TA
Compliance
AEC-Q101
Marking
N58
Reel size (inches)
Tape width (mm)
Quantity per reel
7
12mm
1,000
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
http://www.diodes.com/quality/lead_free.html
fo
r more information about Diodes Incorporated’s definition
s of Halogen and Antimony free, “Green”
and Lead-Free.
3.
Halogen and Antimony free “Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm tot
al Br + Cl) and
<1000ppm antimony compounds.
Marking Information
N58
N58 = Product Type Marking Code
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Document number: DS33053 Rev. 7 – 2
FCX458
Absolute Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
V
CBO
V
CEO
V
EBO
I
C
Value
400
400
7
Unit
V
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
V
V
Continuous Collector Current
Peak Pulse Current
Base Current
225
500
200
mA
mA
mA
I
CM
I
B
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
(Note 5)
0.7
1
(Note 6)
Power Dissipation
(Note 7)
W
P
D
1.5
2
(Note 8)
(Note 5)
178
125
83
60
22
(Note 6)
Thermal Resistance, Junction to Ambient Air
(Note 7)
R
JA
°C/W
°C
(Note 8)
Thermal Resistance, Junction to Lead
(Note 9)
R
JL
Operating and Storage Temperature Range
-65 to +150
T
J,
T
STG
ESD Ratings
(Note 10)
Characteristic
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Machine Model
Symbol
Value
Unit
V
JEDEC Class
ESD HBM
ESD MM
4,000
400
3A
C
V
Notes:
5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided
1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.
6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper.
7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper.
8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper.
9. Thermal resistance from junction to solder-point (on the exposed collector pad).
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
Thermal Characteristics and Derating Information
140.0
3
2
1
0
T
A
=25°C
2oz copper
1oz copper
120.0
100.0
80.0
1oz copper
60.0
40.0
2oz copper
1500
0
500
1000
2000
2500
0
500
1000
1500
2000
2500
Copper Area (sqmm)
Copper Area (sqmm)
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Thermal Characteristics and Derating Information
(cont.)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.8
0.6
0.4
0.2
0.0
15mm x 15mm 1oz FR4 PCB
MRP 1oz FR4 PCB
0
20
40
60
80 100
120 140 160
0
20
40
60
80 100
120 140 160
Temperature (°C)
Temperature (°C)
Derating Curve
Derating Curve
130
120
110
100
90
80
70
60
50
40
30
20
10
100
10
1
15mm x 15mm 1oz FR4 PCB
15mm x 15mm 1oz FR4 PCB
Single Pulse
T
A
=25°C
D=0.5
D=0.2
Single Pulse
D=0.05
D=0.1
0
100µ 1m
10m 100m
1
10
100
1k
100µ 1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Pulse Power Dissipation
180
160
140
120
100
80
100
10
1
MRP 1oz FR4 PCB
MRP 1oz FR4 PCB
Single Pulse
T
A
=25°C
D=0.5
60
Single Pulse
D=0.05
D=0.2
40
20
D=0.1
1
0
100µ 1m
10m 100m
10
100
1k
100µ 1m
10m 100m
1
10
100
1k
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Pulse Power Dissipation
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Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 11)
Emitter-Base Breakdown Voltage
Collector-Base Cutoff Current
Collector Cutoff Current
Symbol
BV
CBO
BV
CES
BV
CEO
BV
EBO
I
CBO
Min
400
400
400
7
Typ
550
550
450
8.1
<1
Max
Unit
V
Test Condition
—
I
C
= 100µA
V
I
C
= 100µA
I
C
= 1mA
—
—
V
V
I
E
= 100µA
V
CB
= 320V
V
CES
= 320V
V
EB
= 6V
—
100
100
20
nA
nA
nA
—
<1
I
CES
Emitter Cutoff Current
—
<1
I
EBO
I
C
= 20mA, I
B
= 2mA
I
C
= 50mA, I
B
= 6mA
200
500
—
—
—
—
Collector-Emitter Saturation Voltage (Note 11)
mV
V
CE(sat)
Base-Emitter Saturation Voltage (Note 11)
Base-Emitter Turn-On Voltage (Note 11)
—
—
—
—
900
900
mV
mV
V
BE(sat)
V
BE(on)
I
C
= 50mA, I
B
= 5mA
I
C
= 50mA, V
CE
= 10V
I
C
= 1mA, V
CE
= 10V
I
C
= 50mA, V
CE
= 10V
I
C
= 100mA, V
CE
= 10V
100
100
15
—
DC Current Gain (Note 11)
300
—
h
FE
I
C
= 10mA, V
CE
= 20V,
f = 20MHz
Transitional Frequency
50
—
—
MHz
f
T
Output Capacitance
Turn-On Time
—
—
—
—
5
pF
ns
ns
C
obo
t
on
V
CB
= 20V. f = 1MHz
135
—
—
I
C
=50mA, V
CE
=100V,
I
B1
= 5mA, I
B2
= -10mA
Turn-Off Time
2260
t
off
Note:
11. Measured under pulsed conditions.
Pulse width ≤ 300µs. Duty cycle ≤ 2%
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Typical Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
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Package Outline Dimensions
D1
c
SOT89
Dim Min
Max
Typ
1.50
0.56
0.48
0.38
4.50
H
A
B
B1
c
1.40
0.50
0.42
0.35
4.40
1.62
1.61
2.40
2.05
–
1.60
0.62
0.54
0.43
4.60
E
D
B1
L
D1
D2
E
E2
e
1.83 1.733
B
1.81
2.60
2.35
–
1.71
2.50
2.20
1.50
4.10
2.78
1.05
e
D2
H
H1
L
3.95
2.63
0.90
4.25
2.93
1.20
8
°
(
4
X
)
L1
0.327 0.527 0.427
0.20 0.40 0.30
H1
E2
z
All Dimensions in mm
A
L1
D
z
Suggested Pad Layout
X2
Value
Dimensions
(in mm)
C
G
X
X1
X2
Y
Y1
Y2
Y3
Y4
1.500
0.244
0.580
0.760
1.933
1.730
3.030
1.500
0.770
4.530
Y3
Y1
Y4
X
G
Y
Y2
C
X1
Note:
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device terminals and PCB tracking.
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others.
Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated.
Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
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