Diodes-Incorporated-HBDM60V600W-7

Part #Diodes-Incorporated-HBDM60V600W-7
Download 
Diodes-Incorporated-HBDM60V600W-7
HBDM60V600W  
COMPLEX TRANSISTOR ARRAY FOR BIPOLAR  
Features  
Mechanical Data  
•
•
•
Epitaxial Planar Die Construction  
Lead Free By Design/RoHS Compliant (Note 1)  
“Green” Device (Note 2)  
•
•
Case: SOT-363  
Case Material: Molded Plastic, “Green” Molding Compound.
 
UL  
Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminal Connections: See Schematic & Pin Configuration  
Terminals: Finish – Matte Tin annealed over Alloy 42 leadframe.  
Solderable per MIL-STD-202, Method 208  
Marking Information: See Page 6  
Ordering Information: See Page 6  
Weight: 0.016 grams (approximate)  
•
•
•
Sub-Component P/N  
MMBT2907A_DIE  
MMBTA06_DIE  
Reference  
Device Type  
PNP Transistor  
NPN Transistor  
Q1  
Q2  
•
•
•
CQ1  
EQ1  
EQ2  
Q1  
Q2  
MMBT2907A  
MMBTA06  
BQ1  
BQ2  
CQ2  
Top View  
Device Schematic  
Maximum Ratings: Total Device
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
Symbol  
Value  
Unit  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
V

EBO  

Thermal Characteristics: Total Device  
Characteristic  
Power Dissipation (Note 3)  
Symbol  
Value  
200  
Unit  
mW  
P

D  

Thermal Resistance, Junction to Ambient Air (Note 3)  
625  
°C/W  
R

θ  

JA  
Maximum Ratings: Sub-Component Devices
 
@T

A

= 25°C unless otherwise specified  
Q1-PNP Transistor  
(MMBT2907A)  
Q2-NPN Transistor  
Characteristic  
Symbol  
Unit  
(MMBTA06)  
-60  
-60  
80  
65  
6
V
V
V

CBO  

V

CEO  

V

EBO  

I

C  

Collector-Base Voltage  
Collector-Emitter Voltage  
-5.5  
-600  
V
Emitter-Base Voltage  
Collector Current – Continuous (Note 3)  
500  
mA  
Notes:  
1. No
 
purposefully added lead.  
2. Diodes
 
Inc.’s “Green” policy can be found on our w

3. Device
 
mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on page 7 or on Diodes Inc. suggested pad layout document  
1 of 7  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
Electrical Characteristics: PNP (MMBT2907A) Transistor (Q1)
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 4)  
Symbol  
Min  
Max  
Unit  
Test Condition  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector Cutoff Current  
Collector Cutoff Current  
Base Cutoff Current  
-60  
-60  
-5.5  
⎯
⎯
⎯
V
V
V
nA  
nA  
nA  
V

(BR)CBO  

V

(BR)CEO  

V

(BR)EBO  

I

CBO  

I

CEX  

I

BL  

⎯
⎯
⎯
-10  
-50  
-50  
I

C

= -10
μ
A, I

E

= 0  
I

C

= -10mA, I

B

= 0  
I

E

= -10
μ
A, I

C

= 0  
V

CB

= -50V, I

E

= 0  
V

CE

= -30V, V

EB(OFF)

= -0.5V  
V

CE

= -30V, V

EB(OFF)

= -0.5V  
ON CHARACTERISTICS (Note 4)  
I

C

= -100
μ
A, V

CE

= -10V  
I

C

= -1.0mA,
 
V

CE

= -10V  
I

C

= -10mA,
 
V

CE

= -10V  
I

C

= -150mA, V

CE

= -10V  
I

C

= -500mA, V

CE

= -10V  
I

C

= -150mA, I

B

= -15mA  
I

C

= -500mA, I

B

= -50mA  
I

C

= -150mA, I

B

= -15mA  
I

C

= -500mA, I

B

= -50mA  
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
300  
⎯
100  
100  
100  
100  
50  
DC Current Gain  
h

FE  

-0.3  
-0.5  
Collector-Emitter Saturation Voltage  
V
V
V

CE(SAT)  

V

BE(SAT)  

⎯
⎯
-0.95  
-1.3  
Base-Emitter Saturation Voltage  
SMALL SIGNAL CHARACTERISTICS  
Current Gain-Bandwidth Product  
V

CE

= -2.0V, I

C

= -10mA,  
f = 100MHz  
100  
MHz  
f

T  

⎯
SWITCHING CHARACTERISTICS  
Turn-On Time  
Delay Time  
Rise Time  
Turn-Off Time  
Storage Time  
45  
10  
40  
100  
80  
30  
ns  
ns  
ns  
ns  
ns  
ns  
t

on  

t

d  

t

r  

t

off  

t

s  

t

r  

⎯
⎯
⎯
⎯
⎯
⎯
V

CE

= -30V, I

C

= -150mA,  
I

B1

= -15mA  
V

CC

= -6.0V, I

C

= -150mA,  
I

B1

= I

B2

= -15mA  
Fall Time  
Electrical Characteristics: NPN (MMBTA06) Transistor (Q2)
 
@T

A

= 25°C unless otherwise specified  
Characteristic  
OFF CHARACTERISTICS (Note 4)  
Collector-Base Breakdown Voltage  
Collector-Emitter Breakdown Voltage  
Emitter-Base Breakdown Voltage  
Collector-Base Cutoff Current  
Collector Cutoff Current  
Emitter-Base Cutoff Current  
ON CHARACTERISTICS (Note 4)  
DC Current Gain  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
80  
65  
6
V
V
V
nA  
nA  
nA  
V

(BR)CBO  

V

(BR)CEO  

V

(BR)EBO  

I

CBO  

I

CES  

I

EBO  

⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
100  
100  
100  
I

C

= 100
μ
A, I

E

= 0  
I

C

= 1mA, I

B

= 0  
I

E

= 100
μ
A, I

C

= 0  
V

CB

= 80V, I

E

= 0  
V

CE

= 90V, V

BE

= 0  
V

EB

= 5V, I

C

= 0  
⎯
⎯
⎯
250  
100  
⎯
⎯
⎯
0.2  
0.75  
⎯
⎯
⎯
0.4  
0.8  
0.95  
⎯
⎯
V
V
V
V

CE

= 1V, I

C

= 10mA  
h

FE  

V

CE

= 1V, I

C

= 100mA  
I

C

= 100mA, I

B

= 10mA  
V

CE

= 1V, I

C

= 100mA  
I

C

= 100mA, I

B

= 5mA  
Collector-Emitter Saturation Voltage  
Base-Emitter Turn-on Voltage  
Base-Emitter Saturation Voltage  
SMALL SIGNAL CHARACTERISTICS  
V

CE(SAT)  

V

BE(ON)  

V

BE(SAT)  

0.7  
⎯
V

CE

= 20V, I

C

= 10mA,  
f = 100MHz  
Current Gain-Bandwidth Product  
100  
MHz  
f

T  

⎯
⎯
Notes: 4.
 
Short duration pulse test used to minimize self-heating effect.  
2 of 7  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
Typical Characteristics
 
@T

A

= 25°C unless otherwise specified  
200  
150  
100  
50  
0
200  
0
175  
25  
50  
150  
75 100
 
125  
T

A

, AMBIENT TEMPERATURE (°C)  
Fig. 1
 
Power Derating Curve  
PNP (MMBT2907A) Transistor (Q1) Plots:  
30  
1.6  
1.4  
I
= 300mA  
C
I
= 10mA  
C
20  
I
= 100mA  
C
I
= 1mA  
1.2  
10  
C
I
= 30mA  
Cibo  
C
1.0  
0.8  
5.0  
0.6  
0.4  
Cobo  
0.2  
0
1.0  
0.1  
1
0.001  
0.01  
0.1  
10  
100  
1.0  
30  
10  
-I

B

, BASE CURRENT (mA)  
Fig. 3 Typical Collector Saturation Region  
REVERSE VOLTAGE (V)  
Fig. 2 Typical Capacitance  
0.6  
1,000  
V
= 5V  
CE  
I
I
C
B
= 10  
0.5  
0.4  
T
= 150°C  
A
100  
T
= 25°C  
A
0.3  
T
= -50°C  
T
= 150°C  
A
A
T
= 25°C  
0.2  
0.1  
0
A
10  
1
T
= -50°C  
A
1
10  
1,000  
1,000  
100  
1
10  
-I

C

, COLLECTOR CURRENT (mA)  
Fig. 5
 
Typical DC Current Gain vs. Collector Current  
July 2008  
100  
-I

C

, COLLECTOR CURRENT (mA)  
Fig. 4
 
Collector Emitter Saturation Voltage vs. Collector Current  
3 of 7  
HBDM60V600W  
© Diodes Incorporated  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
1.0  
0.9  
1,000  
V
= 5V  
CE  
T
= -50°C  
A
0.8  
0.7  
100  
0.6  
T
= 25°C  
A
0.5  
0.4  
10  
1
T
= 150°C  
A
0.3  
0.2  
0.1  
1
10  
100  
1
10  
-I

C

, COLLECTOR CURRENT (mA)  
100  
-I

C

, COLLECTOR CURRENT (mA)  
Fig. 6
 
Typical Base Emitter Voltage vs. Collector Current  
Fig. 7 Typical Gain Bandwidth Product vs. Collector Current  
NPN (MMBTA06) Transistor (Q2) Plots  
10  
2.0  
1.8  
1.6  
1.4  
1
I
= 30mA  
C
1.2  
I
= 10mA  
C
1.0  
0.8  
0.1  
0.6  
0.4  
0.2  
0
I
= 100mA  
C
I
= 1mA  
C
0.01  
25  
50  
75  
100  
125  
1
0.001  
0.01  
0.1  
I

B,

BASE CURRENT (mA)  
10  
100  
T

A

, AMBIENT TEMPERATURE (ºC)  
Fig. 9 Typical Collector Saturation Region  
Fig. 8
 
Typical Collector-Cutoff Current vs. Ambient
T
emperature  
0.500  
10,000  
1,000  
100  
I
C
0.450  
= 10  
I
B
0.400  
0.350  
0.300  
0.250  
0.200  
0.150  
T
= 25°C  
A
T
= 150°C  
A
10  
1
0.100  
0.050  
0
T
= -50°C  
A
10  
1,000  
1
100  
1,000  
1
10  
I

C

, COLLECTOR CURRENT (mA)  
Fig. 10
 
Typical Collector Emitter Saturation Voltage vs. Collector Current  
100  
I

C

, COLLECTOR CURRENT (mA)  
Fig. 11 Typical DC Current Gain vs. Collector Current  
4 of 7  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
1.0  
0.9  
1,000  
100  
0.8  
0.7  
0.6  
0.5  
10  
0.4  
0.3  
0.2  
0.1  
1
1
1
10  
100  
0.1  
10  
I

C

, COLLECTOR CURRENT (mA)  
I

C

, COLLECTOR CURRENT (mA)  
Fig. 12 Typical Base Emitter Voltage vs. Collector Current  
Fig. 13 Typical Gain Bandwidth Product vs. Collector Current  
Current Schematic along with Application Example:  
9 V – 1 2 V  
3 6  
R 1  
H B D M 6 0 V 6 0 0 W  
M M B T 2 9 0 7 A  
H B D M 6 0 V 6 0 0 W  
E Q 1  
M M B T 2 9 0 7 A  
Q 1  
C 1  
Q 1  
D 1  
D 2  
R 3  
R 4  
Q 4  
B Q 1  
B Q 1  
0
C Q 1  
C Q 1  
Q 3  
H a l f
 
H – B r i d g e  
C Q 2  
H a l f
 
H – B r i d g e  
M o t o r  
C Q 2  
Q 2  
R 5  
1 k  
R 8  
1 k  
M M B T A 0 6  
M M B T A 0 6  
B Q 2  
C 2  
Q 2  
D 4  
D 3  
B Q 2  
E Q 2  
R e v e r s e  
F o r w a r d  
0
Note:  
D1, D2, D3, D4:
 
Switching Diodes (MMBD4448)  
Q3, Q4:
 
NPN Transistors (MMBTA06)  
5 of 7  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
Application Example Schematic: (with Package Pinouts)  
9 V – 1 2 V  
R 1  
3 6  
C 1  
R 2  
U 1  
C 1  
A 1  
3 3 k  
1
2
3
6
5
4
N C  
N C  
R 3  
C 2  
A 2  
U 2  
4 7 0  
M M B D 4 4 4 8 D W  
U 3  
C Q 1  
E Q 1  
E Q 2  
B Q 1  
B Q 2  
C Q 2  
1
6
5
4
E Q 1  
B Q 2  
C Q 2  
C Q 1  
B Q 1  
E Q 2  
1
2
3
6
5
4
U 4  
2
3
B Q 1  
B Q 2  
C Q 2  
C Q 1  
E Q 1  
M o t o r  
C 2  
1
6
I N V 5 V 0 W  
R 4  
H B D M 6 0 V 6 0 0 W  
2
5
4
E Q 2  
4 7 0  
3
R 5  
1 k  
U 5  
H B D M 6 0 V 6 0 0 W  
C 1  
C 2  
A 1  
A 2  
1
2
3
6
5
4
Q 1  
R 6  
1 k  
A 3  
C 3  
M M B D 4 4 4 8 H T W  
R e v e r s e  
F o r w a r d  
C o n t r o l
 
I n p u t
 
5 V / 0 V  
Ordering Information
 
(Note 5)  
Part Number  
HBDM60V600W-7  
Case  
SOT-363  
Packaging  
3000/Tape & Reel  
Notes:  
Marking Information  
HB01 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: T = 2006)  
HB01  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
T
U
V
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
6 of 7  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2  

HBDM60V600W  
Package Outline Dimensions  
A
SOT-363  
Min  
0.10  
1.15  
2.00  
Dim  
A
B
C
D
F
H
J
K
L
Max  
0.30  
1.35  
2.20  
B C  
0.65 Typ  
0.40  
1.80  
0
0.90  
0.25  
0.10  
0°  
0.45  
2.20  
0.10  
1.00  
0.40  
0.22  
8°  
H
K
M
J
M
α
L
D
F
All Dimensions in mm  
Suggested Pad Layout  
E
E
Dimensions Value
 
(in mm)  
Z
G
X
Y
C
E
2.5  
1.3  
0.42  
0.6  
1.9  
0.65  
C
G
Z
Y
X
IMPORTANT NOTICE  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product  
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall  
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,  
harmless against all damages.  
LIFE SUPPORT  
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written  
approval of the President of Diodes Incorporated.  
7 of 7  

www.diodes

.com  
July 2008  
© Diodes Incorporated  
HBDM60V600W  
Document number: DS30701 Rev. 5 – 2