Diodes-Incorporated-ZXMN10A08DN8TA

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Diodes-Incorporated-ZXMN10A08DN8TA
ZXMN10A08DN8  
100V N-CHANNEL ENHANCEMENT MODE MOSFET  
SUMMARY  
= 100V; R  
V
= 0.25
 
I =
 
2.1A  
D
(BR)D
S
S  
D
S
(
ON)  
DE
S
C
RIPTION  
T
h
i
s
n
ew generat
i
o
n of
T
RENCH MOSFETs from Zetex utilizes a unique structure  
that com
 
b
i
n
es the bene
f
its
o
f
l
o
w on
–
resistance with fast switching speed. This  
m
a
k
e
s
 
them
i
d
eal
 
f
o
r h
i
g
h e
f
fici
e
ncy, low voltage, power m
 
anagem ent  
app
l
ic
a
tions.  
SO8  
FEATURES  
•
•
•
•
•
L
o
w on
–
resistance  
F
a
st sw
i
tching speed  
L
o
w thresho
l
d  
L
o
w gate dr
i
ve  
L
o
w pro
f
ile
S
O
I
C
p
ac
k
a
ge  
APP
L
ICATIONS  
•
•
•
•
DC – DC c
o
nverters  
Power m
 
anagem ent
 
f
u
nctions  
Di
s
connect sw
i
tches  
Motor control  
P
I
N
OUT  
ORDERING INFORMATION  
DEVICE  
REEL  
S
I
ZE  
TAPE  
W
I
DTH  
QUANTITY  
PER REEL  
ZXMN10A08DN8TA  
ZXMN10A08DN8TC  
7”  
12m m  
12m m  
500 units  
13”  
2,500 units  
DEVICE MARKING  
T
o
p
V
i
e
w  
•
ZXMN  
10A08D  
I
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A
NUARY 2005  
1
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C O N D U C T O R S  

ZXMN10A08DN8  
AB
S
O
L
U
TE MAXIMUM RATINGS  
PARAMETER  
S Y
M
BOL  
LI
M
I
T  
100  
UN
I
T  
V
Dra in -s o u rce
 
vo lta g e  
Ga te
 
s o u rce
 
vo lta g e  
V
V
DS S  
GS  
20  
V
(b )  
(b )  
(a )  
Co n tin u o u s
 
d ra in
 
cu rre n t  
V
V
V
=10
V
; T
 
=25°C  
I
2.1  
1.7  
1.6  
A
GS  
GS  
GS  
A
D
=10
V
; T
 
=70°C  
A
=10
V
; T
 
=25°C  
A
(c)  
Pu ls e d
 
d ra in
 
cu rre n t  
I
I
I
9
2.6  
9
A
A
A
DM  
(b )  
Co n tin u o u s
 
s o u rce
 
cu rre n t
 
(b o d y
 
d io d e )  
S
(c)  
Pu ls e d
 
s o u rce
 
cu rre n t
 
(b o d y
 
d io d e )  
S M  
(a )  
Po w e r
 
d is s ip a tio n
 
a t
 
T =25°C  
A
Lin e a r
 
d e ra tin g
 
fa cto r  
P
1.25  
10  
W
m W/°C  
D
(b )  
Po w e r
 
d is s ip a tio n
 
a t
 
T =25°C  
A
P
1.8  
W
D
Lin e a r
 
d e ra tin g
 
fa cto r  
14.5  
m W/°C  
Op e ra tin g
 
a n d
 
s to ra g e
 
te m p e ra tu re
 
ra n g e  
T :T  
-55 to +150  
°C  
j
s
t
g  
THERMAL RE
S
I
S
T
ANCE  
PARAMETER  
S Y
M
BOL  
VAL
U
E  
100  
UN
I
T  
°C/W  
°C/W  
J u n
c
tio n
 
to a
 
m b ie n t
 
(a )  
J u n
c
tio n
 
to a
 
m b ie n t
 
(b )  
R
R
θ
J A  
θ
J A  
69  
NOTES  
(
a
)
F
o
r a dev
i
ce surface m
 
ounted on 25m
 
m x 25m
 
m FR4 PCB with high coverage of single sided 1oz copper, in still air conditions  
(
b
)
F
o
r a dev
i
ce surface m
 
ounted on FR4 PCB m
 
easured at t
р
5
s
ecs.  
(c) R
e
pet
i
tive rating 25m
 
m x 25m
 
m FR4 PCB, D = 0.02, pulse width 300
␮
s –
 
p
u
l
s
e w
i
d
th lim
 
ited by m
 
axim um
 
junction tem
 
perature. Refer to  
Transient Therm
 
al
I
m
p
edance
 
graph  
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ZXMN10A08DN8  
TYPICAL CHARACTERI
S
T
ICS  
I
S
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A
NUARY 2005  
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C O N D U C T O R S  

ZXMN10A08DN8  
ELECTRICAL CHARACTERI
S
T
ICS
 
(
a
t
T

A

= 25°C unless otherwise stated).  
PARAMETER  
S Y
M
BOL  
M
I
N
.  
TYP.
M
AX.
 
UNIT CONDITIONS
 
.  
S TATIC  
Dra in -s o u rce
 
b re a kd o w n
 
vo lta g e  
Ze ro
 
g a te
 
vo lta g e
 
d ra in
 
cu rre n t  
Ga te -b o d y
 
le a ka g e  
V
100  
V
␮
A  
nA  
V
I =250
␮
A, V
 
=0V  
D
G
S  
(BR)DS S  
I
I
0.5  
V
=100
V
, V
 
=0V  
GS  
DS S  
DS  
GS  
100  
V
=
Ϯ
2
0
V
, V
 
=0V  
DS  
GS S  
Ga te -s o u rce
 
th re s h o ld
 
vo lta g e  
Static drain-source on-state resistance  
V
R
2.0  
I =250
␮
A, V
 
= V  
DS GS  
D
GS (th )  
(1)  
0.25  
0.30  
V
V
=10
V
, I
 
=3.2A  
D
⍀
⍀
DS (o n )  
GS  
GS  
=6
V
, I
 
=2.6A  
D
(1)(3)  
Fo rw a rd
 
tra n s co n d u cta n ce  
g
5.0  
S
V
=15
V
,I =3.2A  
D
fs  
DS  
(3)  
DYNAMIC  
In p u t
 
c
a p a cita n ce  
C
C
C
405  
28.2  
14.2  
pF  
pF  
pF  
is s  
V
=50
V
, V
 
=0V,  
DS  
GS  
Ou tp u t
 
ca p a cita n ce  
o s s  
rs s  
f=1MHz  
Re ve rs e
 
tra n s fe r
 
ca p a cita n ce  
(2) (3)  
S
W
I
TCHING  
Tu rn -o n
 
d e la y
 
tim e  
Ris e
 
tim e  
t
t
t
t
3.4  
2.2  
8
ns  
ns  
ns  
ns  
nC  
d (o n )  
r
V
R
=30
V
, I
 
=1.2A  
D
DD  
Tu rn -o ff
 
d e la y
 
tim e  
Fa ll
 
tim e  
≅
6
.0
⍀
, V
 
=10V  
d (o ff)  
f
G
GS  
3.2  
4.2  
Ga te
 
ch a rg e  
Q
V
=50
V
,V =5V,  
g
DS GS  
I

D

=1.2A  
To ta l
 
g a te
 
ch a rg e  
Q
Q
Q
7.7  
1.8  
2.1  
nC  
nC  
nC  
g
V
=50
V
,V =10V,  
DS  
GS  
Ga te -s o u rce
 
ch a rg e  
Ga te -d ra in
 
ch a rg e  
S
O
URCE-DRAIN
 
DIODE  
g s  
g d  
I

D

=1.2A  
(1)  
Dio d e
 
fo rw a rd
 
vo lta g e  
V
0.87  
0.95  
V
T =25°C,
 
I =3.2A,  
J S  
S D  
V
=0V  
GS  
(3)  
Re ve rs e
 
re co ve ry
 
tim e  
t
27  
32  
ns  
T =25°C,
 
I =1.2A,  
J F  
d i/d t=
 
100A/
␮
s  
rr  
(3)  
Re ve rs e
 
re co ve ry
 
ch a rg e  
Q
nC  
rr  
NOTES:  
(1) Measured under pu
l
s
ed cond
i
ti
o
ns. W
i
d
th
=
300
µ
s
.
D
u
ty cycle
≤
2% .  
(2) Switching characteristics are independent of operating junction tem
 
perature.  
(3) F
o
r des
i
g
n a
i
d
o
n
l
y, not subject to production testing.  
I
S
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A
NUARY 2005  
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ZXMN10A08DN8  
TYPICAL CHARACTERI
S
T
ICS  
I
S
SUE 4 – J
A
NUARY 2005  
5
S E M
I
C O N D U C T O R S  

ZXMN10A08DN8  
TYPICAL CHARACTERI
S
T
ICS  
I
S
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A
NUARY 2005  
6
S E M
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ZXMN10A08DN8  
PACKAGE OUTLINE  
CONTROLLING DIMEN
S
I
O
NS
I
N
M
I
LLI
M
ETERS APPROX CONVER
S
I
O
NS
I
N
CHES  
PACKAGE DIMEN
S
I
O
NS  
Millim
e
ters  
I
n
ches  
Min  
Millim
e
ters  
Min Max  
1.27 BSC  
I
n
ches  
Min Max  
0.050 BSC  
DIM  
DIM  
Min  
1.35  
0.10  
4.80  
5.80  
3.80  
0.40  
Max  
Max  
0.069  
0.010  
0.197  
0.244  
0.157  
0.050  
A
A1  
D
1.75  
0.25  
5.00  
6.20  
4.00  
1.27  
0.053  
0.004  
0.189  
0.228  
0.150  
0.016  
e
b
c
0.33  
0.19  
0°  
0.51  
0.25  
8°  
0.013  
0.020  
0.010  
8°  
0.008  
0°  
H
⍜
h
–
E
0.25  
–
0.50  
–
0.010  
–
0.020  
–
L
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I
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A
NUARY 2005  
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C O N D U C T O R S