Diodes-Incorporated-ZXMN6A08KTC
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A Product Line of
Diodes Incorporated
ZXMN6A08K
Product Summary
Features and Benefits
•
•
•
Low on-resistance
I
D
V
(BR)DSS
R
DS(on)
Fast switching speed
T
A
= 25
°
C
“Green” component and RoHS compliant (Note 1)
7.90A
5.75A
80m
Ω
@ V
GS
= 10V
150m
Ω
@ V
GS
= 4.5V
60V
Mechanical Data
•
•
Case: TO-252
Case Material: Molded Plastic, “Green” Molding Compound.
UL
Flammability Classification Rating 94V-0
(Note 1)
Description and Applications
This new generation MOSFET has been designed to minimize the on-
state resistance (R
DS(on)
) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
•
•
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals Connections: See Diagram
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
•
•
Backlighting
•
Weight: 0.33 grams (approximate)
DC-DC Converters
Power management functions
D
D
D
G
S
G
S
Equivalent Circuit
TOP VIEW
PIN OUT -TOP VIEW
Ordering Information
(Note 1)
Product
Marking
See Below
Reel size (inches)
Tape width (mm)
Quantity per reel
ZXMN6A08KTC
13
16
2,500
Note:
1. Diodes, Inc. defines “Green” products as those which are Eu RoHS compliant and contain no halogens or antimony compounds; further information
about Diodes Inc.’s “Green” Policy can be found on our website.
For packaging details, go to our website.
Marking Information
ZXMN
6A08
YYWW
ZXMN = Product Type Marking Code, Line 1
6A08 = Product Type Marking Code, Line 2
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01-52)
1 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Drain-Source voltage
Gate-Source voltage
(Note 3)
Symbol
V
DSS
Value
60
Unit
V
V
V
GS
±
20
7.90
6.30
5.36
24.3
9.0
Continuous Drain current
A
V
GS
= 10V
T
A
=70
°
C (Note 3)
(Note 2)
I
D
Pulsed Drain current
(Note 4)
A
A
A
V
GS
= 10V
I
DM
I
S
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 3)
(Note 4)
24.3
I
SM
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
4.13
33.0
8.94
71.5
2.12
16.9
30.3
14.0
59.1
Unit
(Note 2)
(Note 3)
(Note 5)
W
mW/
°
C
Power dissipation
Linear derating factor
P
D
(Note 2)
(Note 3)
(Note 5)
(Note 6)
Thermal Resistance, Junction to Ambient
R
θ
JA
°
C/W
°
C
Thermal Resistance, Junction to Lead
Operating and storage temperature range
2.77
R
θ
JL
-55 to 150
T
J
, T
STG
Notes:
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t
≤
10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs.
The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
2 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Thermal Characteristics
R
DS(on)
Limit
R
DS(on)
10
10
1
Limit
1
DC
1s
DC
1s
100ms
10ms
100ms
100m
10m
100m
10m
10ms
T
amb
=25°C
T
amb
=25°C
1ms
10
1ms
100µs
10
25mm x 25mm
1oz FR4
50mm x 50mm
2oz FR4
100µs
1
1
V
DS
Drain-Source Voltage (V)
V
DS
Drain-Source Voltage (V)
Safe Operating Area
Safe Operating Area
60
50
40
30
20
10
0
35
30
25
20
15
10
5
T
amb
=25°C
T
amb
=25°C
25mm x 25mm
1oz FR4
50mm x 50mm
2oz FR4
D=0.5
D=0.5
D=0.1
D=0.05
Single Pulse
10 100
D=0.1
D=0.05
D=0.2
D=0.2
Single Pulse
0
100µ 1m
10m 100m
1
10
100
1k
100µ 1m
10m 100m
1
1k
Pulse Width (s)
Pulse Width (s)
Transient Thermal Impedance
Transient Thermal Impedance
4.5
Single Pulse
T
amb
=25°C
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
50mm x 50mm
2oz FR4
100
50mm x 50mm
2oz FR4
25mm x 25mm
1oz FR4
10
25mm x 25mm
1oz FR4
1
100µ 1m
10m 100m
1
10
100
1k
0
20 40 60 80
100 120 140 160
Pulse Width (s)
Temperature (°C)
Pulse Power Dissipation
Derating Curve
3 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
60
⎯
⎯
V
BV
DSS
I
DSS
⎯
⎯
⎯
⎯
0.5
I
D
= 250
μ
A, V
GS
= 0V
V
DS
= 60V, V
GS
= 0V
GS
=
±
20V, V
DS
= 0V
μ
A
nA
I
GSS
±
100
V
ON CHARACTERISTICS
Gate Threshold Voltage
1.0
3.0
0.080
0.150
⎯
V
V
GS(th)
⎯
⎯
I
D
= 250
μ
A, V
DS
= V
GS
GS
= 10V, I
D
= 4.8A
V
Static Drain-Source On-Resistance (Note 7)
Ω
R
DS (ON)
⎯
V
GS
= 4.5V, I
D
= 4.2A
V
DS
= 15V, I
D
= 4.8A
I
S
= 4.0A, V
GS
= 0V
Forward Transconductance (Notes 7 & 8)
Diode Forward Voltage (Note 7)
Reverse recovery time (Note 8)
Reverse recovery charge (Note 8)
DYNAMIC CHARACTERISTICS (
Note 8
)
Input Capacitance
6.6
S
V
g
fs
V
SD
t
rr
⎯
⎯
0.88
19.2
30.3
0.95
⎯
ns
nC
I
S
= 1.4A, di/dt= 100A/
μ
s
Q
rr
⎯
⎯
459
44.2
24.1
3.8
pF
pF
pF
nC
nC
nC
nC
ns
C
iss
C
oss
C
rss
Q
g
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
V
DS
= 40V, V
GS
= 0V
Output Capacitance
f= 1MHz
Reverse Transfer Capacitance
Total Gate Charge
V
GS
= 4.5V
Total Gate Charge
5.8
Q
g
V
DS
= 30V
I
D
= 1.4A
Gate-Source Charge
1.4
Q
gs
Q
gd
t
D(on)
t
r
V
GS
= 10V
Gate-Drain Charge
1.9
Turn-On Delay Time (Note 9)
Turn-On Rise Time (Note 9)
Turn-Off Delay Time (Note 9)
Turn-Off Fall Time (Note 9)
2.6
2.1
ns
V
DD
= 30V, V
GS
= 10V
I
D
= 1.5A, R
G
≅
6.0
Ω
12.3
4.6
ns
t
D(off)
t
f
ns
Notes:
7. Measured
under pulsed conditions. Pulse width
≤
300
μ
s; duty cycle
≤
2%
8. For
design aid only, not subject to production testing.
9. Switching
characteristics are independent of operating junction temperatures.
4 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Typical Characteristics
10V
10V
5V
T = 25°C
T = 150°C
5V
10
1
10
1
4.5V
4V
4V
3.5V
3V
3.5V
2.5V
V
G
S
0.1
0.01
3V
2V
V
G
S
0.1
0.1
1
10
0.1
1
10
V
DS
Drain-Source Voltage (V)
V
DS
Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
10
1
V
G
S
= 10V
I
D
= 4.8A
T = 150°C
R
DS(on)
T = 25°C
V
G
S(th)
0.1
0.01
V
G
S
= V
DS
I
D
= 250uA
V
DS
= 10V
3
4
-50
0
50
100
150
V
GS
Gate-Source Voltage (V
5
)
2
Tj Junction
Temperature (°C)
Typical Transfer Characteristics
Normalised Curves v Temperature
4V
3V
4.5V
3.5V
10
T = 150°C
1
V
G
S
1
T = 25°C
0.1
5V
7V
T = 25°C
0.1
10V
0.01
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1
10
I
D
Drain Current (A)
On-Resistance v Drain Current
V
SD
Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
5 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Typical Characteristics – continued
10
8
I
D
= 1.4A
600
V
G
S
= 0V
400
6
V
DS
= 15V
f = 1MHz
C
ISS
4
C
O
SS
C
R
SS
200
2
0
0
1
10
0
1
2
3
4
5
6
Q – Charge (nC)
V
DS
– Drain – Source Voltage (V)
Gate-Source Voltage v Gate Charge
Capacitance v Drain-Source Voltage
Test Circuits
Current
regulator
Q
G
50k
Same as
D.U.T
12V
Q
GS
Q
GD
V
G
V
DS
I
G
D.U.T
I
D
V
GS
Charge
Basic gate charge waveform
Gate charge test circuit
V
DS
90%
R
D
V
GS
V
DS
R
G
V
DD
10%
V
GS
t
d(on)
t
r
t
d(off)
t
r
t
(on)
t
(on)
Switching time waveforms
Switching time test circuit
6 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Package Outline Dimensions
DIM
Inches
Millimeters
Min
DIM
Inches
Millimeters
Min Max
Min
0.086
–
Max
0.094
0.005
0.035
0.045
0.215
0.024
0.023
0.245
–
Max
2.39
0.127
0.89
1.14
5.46
0.61
0.584
6.22
–
Min
Max
A
A1
b
2.18
–
e
H
0.090 BSC
2.29 BSC
0.370
0.055
0.410
0.070
9.40
1.40
10.41
1.78
0.020
0.030
0.205
0.018
0.018
0.213
0.205
0.250
0.170
0.508
0.762
5.21
0.457
0.457
5.41
5.21
6.35
4.32
L
b2
b3
c
L1
L2
L3
L4
L5
θ
1°
θ
°
–
0.108 REF
0.020 BSC
0.035
2.74 REF
0.508 BSC
0.89
0.065
0.040
0.060
10°
1.65
1.016
1.52
10°
c2
D
0.025
0.045
0°
0.635
1.14
0°
D1
E
0.265
–
6.73
–
0°
15°
0°
15°
E1
–
–
–
–
7 of 8
July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
A Product Line of
Diodes Incorporated
ZXMN6A08K
Suggested Pad Layout
6.2
3.0
0.244
0.118
5.8
0.228
1.6
6.17
0.063 0.243
mm
inches
2.58
0.101
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others.
Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending.
Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life
support devices or systems are devices or systems which:
1. are
intended to implant into the body, or
2. support
or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A
critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated.
Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
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July 2009
© Diodes Incorporated
ZXMN6A08K
Document Revision: 2
