ETERNAL-EN2302

Part #ETERNAL-EN2302
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ETERNAL-EN2302
Eternal Semiconductor Inc.  
EN2302  
N-Channel High Density Trench MOSFET (20V, 3.5A)  
PRODUCT SUMMARY  
V

DSS  

I

D  

R

DS(on)

(mΩ) Tpy.  
65 @ VGS = 2.5V, ID=1A  
20V  
3.5A  
Features  
• Super high dense cell trench design for low RDS(on)  
• Advanced Trench Process Technology  
•
SOT-23 package  
•
Lead
(
Pb
)
-free and halogen-free  
Drain  
EN2302 Pin Assignment & Symbol  
3-Lead Plastic SOT-23  
Gate  
Pin 1: Gate
 
Pin 2: Source
 
Pin3: Drain  
Source  
Absolute Maximum Ratings
(T

A

=25°C, unless otherwise noted)  
Parameter  
Ratings  
Symbol  
Units  
V

DS  

V

GS  

I

D  

Drain-Source Voltage  
Gate-Source Voltage  
20  
V
V
±10  
Drain Current (Continuous)  
Drain Current (Pulsed)

a  

3.5  
A
I

DM  

P

D  

I

S  

14  
A
Total Power Dissipation @T

A

=25°C  
Maximum Diode Forward Current  
1
1.2  
W
A
T

j

, T

stg

Operating Junction and Storage Temperature Range  
-55 to +150  
140  
°C  
°C/W  
Thermal Resistance Junction to Ambient (PCB mounted)

b  

R

QJA  

a: Repetitive Rating: Pulse width limited by the maximum junction temperature.  
b: 1-in

2

2oz Cu PCB board  
DS-EN2302-EN-REV1.0  
Page 1 of 5  

Eternal Semiconductor Inc.  
EN2302  
Electrical Characteristics
(T

A

=25°C, unless otherwise noted)  
Characteristic Test
 
Conditions  
Symbol  
Min. Typ. Max. Unit  
•
Off Characteristics  
V

GS

=0V, I

D

=250uA  
BV

DSS

Drain-Source Breakdown Voltage  
20  
–
–
V
V

DS

=20V, V

GS

=0V  
V

GS

=±10V, V

DS

=0V  
I

DSS  

I

GSS  

Zero Gate Voltage Drain Current  
Gate-Body Leakage Current  
–
–
–
–
1
μA  
±100  
nA  
•
On Characteristics  
V

DS

=V

GS

, I

D

=250uA  
V

GS

=4.5V, I

D

=2.8A  
V

GS(th)

Gate Threshold Voltage  
0.4  
–
0.65  
46  
1.0  
55  
V
Drain-Source On-State  
R

DS(on)  

mΩ  
Resistance  
V

GS

=2.5V, I

D

=2A  
–
65  
80  
•
Dynamic Characteristics  
C

iss  

Input Capacitance  
–
–
350  
110  
–
–
C

oss  

Output Capacitance  
V

DS

=6V, V

GS

=0V, f=1MHz  
PF  
C

rss  

Reverse Transfer Capacitance  
–
33  
–
•
Switching Characteristics  
Q

g  

Q

gs  

Q

gd  

t

d(on)  

t

r  

Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-on Delay Time  
Turn-on Rise Time  
Turn-off Delay Time  
Turn-off Fall Time  
–
–
–
–
–
–
–
4.6  
0.7  
1.4  
12  
–
–
–
–
–
–
–
V

DS

=6V, I

D

=5.4A, V

GS

=4.5V  
nC  
nS  
V
V

DD

=-6V, R

L

=6Ω, I

D

=1A,  
VGEN=4.5V, RG=6Ω  
36  
t

d(off)  

t

f  

34  
5.8  
•
Drain-Source Diode Characteristics  
Drain-Source Diode Forward  
V

GS

=0V, I

S

=1.7A  
V

SD  

–
–
1.2  
Note: Pulse Test: Pulse Width
≤
300us, Duty Cycle
≤
2%  
DS-EN2302-EN-REV1.0  
Page 2 of 5  

Eternal Semiconductor Inc.  
EN2302  
Typical Characteristics Curves
(Ta=25°C, unless otherwise note)  
DS-EN2302-EN-REV1.0  
Page 3 of 5  

Eternal Semiconductor Inc.  
EN2302  
DS-EN2302-EN-REV1.0  
Page 4 of 5  

Eternal Semiconductor Inc.  
EN2302  
SOT-23L PACKAGE OUTLINE DIMENSIONS  
DS-EN2302-EN-REV1.0  
Page 5 of 5