FETek-FKS3115
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FKS3115
FE
T
ek Technology Corp.
P-Ch 30V Fast Switching MOSFETs
100% EAS Guaranteed
Product Summary
Green Device Available
Super Low Gate Charge
Excellent CdV/dt effect decline
Advanced high cell density Trench
technology
BVDSS
RDSON
ID
-30V
8.7m
Ω
-14A
Description
SOP8 Pin Configuration
The FKS3115 is the high cell density trenched
P-ch MOSFE
T
s
, which provide excellent RDSON
and gate charge for most of the synchronous buck
converter applications.
The FKS3115 meet the RoHS and Green Product
requirement, 100% EAS guaranteed with full
function reliability approved.
Absolute Maximum Ratings
Symbol
Parameter
Rating
-30
Units
V
DS
V
GS
Drain-Source Voltage
Gate-Sou
r
ce Voltage
V
V
±
20
I
D
@T
A
=25
℃
I
D
@T
A
=70
℃
I
DM
Continuous Drain Current, V
GS
@ -10V
1
Continuous Drain Current, V
GS
@ -10V
1
Pulsed Drain Current
2
-14
-11
A
A
-56
A
EAS
Single Pulse Avalanche Energy
3
151
mJ
A
I
AS
Avalanche Current
-55
P
D
@T
A
=25
℃
T
STG
Total Power Dissipation
4
1.5
W
℃
℃
Storage
T
e
mperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
T
J
Thermal Data
Symbol
R
θ
JA
Parameter
Typ.
Max.
40
Unit
℃
/W
℃
/W
℃
/W
Thermal Resistance Junction-Ambient
1
(t
≦
10s)
—
Thermal Resistance Junction-Ambient
1
Thermal Resistance Junction-Case
1
—
—
75
R
θ
JC
24
Data and specifications subject to change without notice.
www.fetek.com.tw
Ver : A
1
FKS3115
FE
T
ek Technology Corp.
P-Ch 30V Fast Switching MOSFETs
Electrical Characteristics (T
J
=25
℃
, unless otherwise noted)
Symbol
BV
DSS
Parameter
Conditions
V
GS
=0V , I
D
=-250uA
Min.
-30
—
Typ.
—
Max.
—
Unit
V
Drain-Source Breakdown Voltage
BV
DSS
Temperature Coefficient
△
BV
DSS
/
△
T
J
Reference to 25
℃
, I
D
=-1mA
V
GS
=-10V , I
D
=-12A
-0.018
—
—
V/
℃
—
8.7
13.5
-2.5
—
R
DS(ON)
Static Drain-Source On-Resistance
2
m
V
GS
=-4.5V , I
D
=-10A
—
—
V
GS(th)
Gate Threshold Voltage
-1.2
—
—
V
V
GS
=V
DS
, I
D
=-250uA
△
V
GS(th)
V
GS(th)
Temperature Coefficient
5.04
—
mV/
℃
V
DS
=-24V , V
GS
=0V , T
J
=25
℃
V
DS
=-24V , V
GS
=0V , T
J
=55
℃
—
-1
I
DSS
Drain-Source Leakage Current
uA
—
—
-5
V
GS
=
±
20V , V
DS
=0V
I
GSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
—
—
±
100
—
nA
S
V
DS
=-5V , I
D
=-12A
—
25
Q
g
—
30
—
V
DS
=-15V , V
GS
=-4.5V , I
D
=-12A
nC
Q
gs
Q
gd
T
d(on)
T
r
—
10
—
—
10.4
9.4
10.2
117
24
—
Turn-On Delay Time
Rise Time
—
—
V
DD
=-15V , V
GS
=-10V , R
G
=3.3
,
—
—
ns
I
D
=-1A
T
d(off)
T
f
Turn-Off Delay Time
Fall Time
—
—
—
—
C
iss
C
oss
C
rss
Input Capacitance
—
3448
508
421
—
V
DS
=-15V , V
GS
=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
—
—
—
—
Diode Characteristics
Symbol
Parameter
Conditions
Min.
—
Typ.
—
Max.
-14
-56
-1.2
—
Unit
A
I
S
I
SM
V
SD
t
rr
Continuous Source Current
1,5
Pulsed Source Current
2,5
Diode Forward Voltage
2
Reverse Recovery Time
Reverse Recovery Charge
V
G
=V
D
=0V , Force Current
—
—
A
V
GS
=0V , I
S
=-1A , T
J
=25
℃
I
F
=-10A , dI/dt=100A/µs ,
T
J
=25
℃
—
—
V
—
19.4
9.1
nS
nC
Q
rr
—
—
Note :
1.The data tested by surface mounted on a 1 inch
2
FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width
≦
300us , duty cycle
≦
2%
3.The EAS data shows Max. rating . The test condition is V
DD
=-25V,V
GS
=-10V,L=0.1mH,I
AS
=-55A
4.The power dissipation is limited by 150
℃
junction temperature
5.The data is theoretically the same as I
D
and I
DM
, in real applications , should be limited by total power dissipation.
Data and specifications subject to change without notice.
www.fetek.com.tw
Ver : A
2
FKS3115
FE
T
ek Technology Corp.
P-Ch 30V Fast Switching MOSFETs
Typical Characteristics
40
35
30
25
20
15
10
5
V
GS
=-10V
V
GS
=-7V
V
GS
=-5V
V
GS
=-4.5V
V
GS
=-3V
0
0
1
2
3
4
-V
DS
, Drain-to-Source Voltage (V)
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance v.s Gate-Source
12
10
8
6
T
J
=150
℃
T
J
=25
℃
4
2
0
0.2
0.4
0.6
0.8
1
-V
SD
, Source-to-Drain Voltage (V)
Fig.4 Gate-Charge Characteristics
Fig.3 Forward Characteristics Of Reverse
2.0
1.5
1.0
0.5
1.5
1
0.5
0
-50
0
50
100
150
-50
0
50
100
150
T
J
,Junction Temperature (
℃
)
T
J
, Junction Temperature (
℃
)
Fig.6 Normalized R
DSON
vs. T
J
Fig.5 Normalized V
GS(th)
vs. T
J
Data and specifications subject to change without notice.
www.fetek.com.tw
Ver : A
3
FKS3115
FE
T
ek Technology Corp.
P-Ch 30V Fast Switching MOSFETs
10000
1000
100
F=1.0MHz
Ciss
Coss
Crss
10
1
1
5
9
13
17
21
25
-V
DS
, Drain to Source Voltage(V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
DUTY=0.5
0.2
0.1
0.1
0.01
0.05
0.01
P
DM
T
ON
T
D =
T
ON
/T
SINGLE
T
Jpeak
=
T
C
+P
D
M
XR
θJC
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.11 Unclamped Inductive Switching Waveform
Fig.10 Switching Time Waveform
Data and specifications subject to change without notice.
www.fetek.com.tw
Ver : A
4
