FUXINSEMI-BC807-25

BC807  

FEATURES  







Ldeally suited for automatic insertion  

SOT-23  

Epitaxial planar die construction  

Complementary NPN type available(BC817)  

MAXIMUM RATINGS (T

a

=25

℃

unless otherwise noted)  

Symbol  

V

CBO  

V

CEO  

V

EBO  

I

C  

Parameter  

Value  

Unit  

V

Collector-Base Voltage  

-50  

V

Collector-Emitter Voltage  

-45  

V

Emitter-Base Voltage  

-5  

Collector Current  

-500  

300  

417  

mA  

mW  

℃

/W  

Collector Power Dissipation  

Thermal Resistance From Junction

T

o Ambient  

P

C  

R

ΘJA  

Operation Junction

 

and  

Storage Temperature Range  

T

J

,

T

stg  

-55

～

+150  

℃

ELECTRICAL CHARACTERISTICS (T

a

=25

℃

unless otherwise specified)  

Parameter  

Symbol  

T

e

st conditions  

Min  

Max  

Unit  

Collector-base breakdown voltage  

V

CBO  

-50  

-45  

-5  

V

I

C

= -10

μ

A, I

E

=0  

Collector-emitter breakdown voltage  

Emitter-base breakdown voltage  

V

CEO  

V

EBO  

I

CBO  

I

C

= -10mA, I

B

=0  

I

E

= -1

μ

A, I

C

=0  

V

CB

= -45

V

,

I

E

=0  

V

EB

= -4

V

,

 

I

C

=0  

V

V

Collector cut-off current  

Emitter cut-off current  

-0.1  

-0.1  

6

00  

μ

A  

μ

A  

I

EBO  

h

FE(1)  

h

FE(2)  

V

CE

= -1

V

,

 

I

C

= -100mA  

100  

DC current gain  

V

CE

= -1

V

,

 

I

C

= –

5

00mA  

4

0  

Collector-emitter saturation voltage  

Base-emitter saturation voltage  

V

CE

(sat)  

I

C

=-500mA, I

B

= -50mA  

I

C

= -500mA, I

B

= -50mA  

-0.7  

-1.2  

V

V

V

BE

(sat)  

V

CE

= -5

V

, I

C

= -10mA  

f=

100MHz  

Transition frequency  

100  

MHz  

f

T  

CLASSIFICATION OF

h

FE  

(1)  

Rank  

Range  

Marking  

BC8

0

7-16  

BC8

0

7-25  

BC8

0

7-40  

250-600  

5

C  

100-250  

160-400  

5

A  

5

B  

Page 1  

Ver2.1  

BC807  

h

FE

—— I

C  

Static Characteristic  

–

–

–

–

–

–

280  

240  

200  

160  

120  

80  

500  

400  

–

–

-1mA  

COMMON  

EMITTER  

T

a

=25

℃

 

T

a

=100

o  

C

-0.9mA  

-0.8mA  

-0.7mA  

-0.6mA  

-0.5mA  

300  

200  

–

T

a

=25

o  

C

–

-0.4mA  

-0.3mA  

-0.2mA  

40  

–

V

CE

= -1V  

– 500  

I

B

=-0.1mA  

0

100  

–

–

–

–

10  

–

100  

0

–

2

4

6

8

–

–

12  

14  

16  

1

10  

–

–

–

–

COLLECTOR CURRENT

 

I

C

(mA)  

COLLECTOR-EMITTER VOLTAGE

 

V

CE

(V)  

V

CEsat

—— I

C  

V

BEsat

—— I

C  

-1.2  

-1.0  

-0.8  

-0.6  

-0.4  

-0.2  

-0.4  

-0.3  

-0.2  

-0.1  

-0.0  

β

=10  

β

=10  

T

a

=25

℃  

T

a

=100

℃  

T

a

=100

℃  

T

a

=25

℃  

-0.1  

-1  

-10  

-100  

– 500  

-0.1  

-1  

-10  

-100  

– 500  

COLLECTOR CURRENT

 

I

C

(mA)  

COLLECTOR CURRENT

 

I

C

(mA)  

I

C

—— V

BE  

C

ob

/ C

ib

—— V

CB

/

V

EB  

-1000  

-100  

-10  

100  

f=1MHz  

I

E

=0 / I

C

=0  

50  

T

a

=25

o  

C

C

ib  

T

a

=100

o  

C

10  

T

a

=25

℃  

-1  

C

ob  

V

CE

=-1V  

-0.1  

1

–

–

0.9  

–

10  

0.3  

0.4  

0.5  

0.6  

0.7  

0.8  

1.0  

–

0

5

–

–

–

–

–

–

REVERSE VOLTAGE  

V

(V)  

BASE-EMITTER VOLTAGE  

V

BE

(V)  

f

T

——  

I

C  

P

c

—— T

a  

0.4  

0.3  

0.2  

0.1  

0.0  

300  

100  

V

CE

=-5V  

T

a

=25

o  

C

10  

–

60  

1

10  

–

0

25  

50  

75  

100  

125  

150  

–

AMBIENT TEMPERATURE

 

T

a

(

℃

)  

COLLECTOR CURRENT

 

I

C

(mA)  

Page 2  

Ver2.1  

BC807  

SOT-23 Package Information  

Dimensions In Millimeters  

Dimensions In Inches  

Symbol  

Min.  

0.900  

0.000  

0.900  

0.300  

0.080  

2.800  

1.200  

2.250  

Max.  

1.150  

0.100  

1.050  

0.500  

0.150  

3.000  

1.400  

2.550  

Min.  

0.035  

0.000  

0.035  

0.012  

0.003  

0.110  

0.047  

0.089  

Max.  

0.045  

0.004  

0.041  

0.020  

0.006  

0.118  

0.055  

0.100  

A

A1  

A2  

b

c

D

E

E1  

e

0.950 TYP.  

0.550 REF.  

0.037 TYP.  

0.022 REF.  

e1  

L

1.800  

0.300  

2.000  

0.500  

0.071  

0.012  

0.079  

0.020  

L1  

Page 3  

Ver2.1  

BC807  

Pinning information  

Pin  

Simplified outline  

Symbol  

C

B

E

Suggested solder pad layout  

SOT-23  

0.037(0.95)  

0.037(0.95)  

0.079(2.0)  

0.035(0.90)  

0.031(0.80)  

Dimensions in inches and (millimeters)  

Reel packing  

INNER  

BOX  

(m/m)  

REEL  

DIA,  

(m/m)  

CARTON  

SIZE  

(m/m)  

COMPONENT  

SPACING  

APPROX.  

BOX  

(pcs)  

PACKAGE  

REEL SIZE  

REEL  

(pcs)  

GROSS WEIGHT  

CARTON  

(pcs)  

(kg)  

(m/m)  

SOT-23  

3,000  

4.0  

30,000 183*123*183  

178  

382*257*387  

240,000  

11.6  

7″  

Page 4  

Ver2.1  

BC807  

Suggested thermal profiles for soldering processes  

1.Storage environment:

T

e

mperature=5

o

C~40

o

C Humidity=55%

 

25%  

2.Reflow soldering of surface-mount devices  

Critical Zone  

TL to TP  

Tp  

TP  

Ramp-up  

TL  

TL  

T

s

max  

T

s

min  

tS  

Preheat  

Ramp-down  

25  

t25

o

C to Peak  

Time  

3.Reflow soldering  

Profile Feature  

Soldering Condition  

Average ramp-up rate(T

L

to T

P

)  

<3

o

C/sec  

Preheat  

–

T

e

mperature Min(

T

s

min)  

–

T

e

mperature Max(

T

s

max)  

-Time(min to max)(t

s

)  

150

o

C  

200

o

C  

60~120sec  

T

s

max to T

L  

-Ramp-upRate  

<3

o

C/sec  

Time maintained above:  

–

T

e

mperature(T

L

)  

-Time(t

L

)  

217

o

C  

60~260sec  

Peak

T

e

mperature(T

P

)  

255

o

C-0/+5

o

C  

Time within 5

o

C of actual Peak  

T

e

mperature(t

P

)  

10~30sec  

Ramp-down Rate  

<6

o

C/sec  

Time 25

o

C to Peak

T

e

mperature  

<6minutes  

Page 5  

Ver2.1