FUXINSEMI-FS2301

Part #FUXINSEMI-FS2301
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FUXINSEMI-FS2301
FS2301  
P-Channel SMD MOSFET  
Product Summary  
V

(BR)DSS  

R

DS(on)MAX  

I

D  

120mΩ@-4.5V  
180mΩ@-2.5V  
-20V  
-2.4A  
Feature  
Application  
Advanced trench process technology  
High density cell design for ultra low on-resistance  
Load Switch for Portable Devices  
DC/DC Converter  
Package  
Circuit diagram  
D
S
G
SOT-23  
Marking  
A1SHB  
Page 1  
Ver2.1  

FS2301  
P-Channel SMD MOSFET  
Absolute maximum ratings (Ta=25
℃
unless otherwise noted)  
Parameter  
Symbol  
V

DS  

V

GS  

I

D  

Value  
-20  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
±8  
V
Continuous Drain Current  
Pulsed Drain Current  
Power Dissipation  
-2.4  
A
I

DM  

-10  
A
P

D  

1.2  
W
℃
℃
Junction
T
emperature  
Storage
T
emperature  
T

J  

-55 ~ +150  
-55 ~ +150  
T

STG  

Electrical characteristics (T

A

=25

o

C, unless otherwise noted)  
Parameter  
Symbol  
Test Condition  
Min.  
Typ. Max.  
Unit  
Static Characteristics  
Drain-source breakdown voltage  
Zero gate voltage drain current  
Gate-body leakage current  
Gate threshold voltage  
V

(BR)DSS

V

GS

= 0V, I

D

=-250µA  
-19  
V
µA  
nA  
V
I

DSS  

I

GSS  

V

DS

=-16V,V

GS

= 0V  
V

GS

=±8
V
, V

DS

= 0V  
V

DS

=V

GS

, I

D

=-250µA  
-1  
±100  
-1.5  
V

GS(th)  

-0.4  
120  
180  
140  
200  
V

GS

=-4.5V, I

D

=-2.4A  
Drain-source on-resistance

1)  

R

DS(on)  

mΩ  
V

GS

=-2.5V, I

D

=-2.0A  
Dynamic characteristics

2)  

Input Capacitance  
C

iss  

C

oss  

C

rss  

Q

g  

500  
120  
105  
8.6  
1.5  
2.6  
10  
Output Capacitance  
V

DS

=-10V,V

GS

=0V,f =1MHz  
pF  
nC  
Reverse Transfer Capacitance  
Total Gate Charge  
V

DS

=-10
V
,
V

GS

=-4.5V,  
I

D

=-2.8A  
Gate-Source Charge  
Gate-Drain Charge  
Q

gs  

Q

gd  

t

d(on)  

t

r  

Turn-on delay time  
Turn-on rise time  
18  
V

DD

=-10
V
,
V

GS

=-4.5V,I

D

=-1A,  
R

GEN

=2.5Ω  
nS  
Turn-off delay time  
t

d(off)  

t

f  

55  
Turn-off fall time  
52  
Source-Drain Diode characteristics  
Diode Forward Current

1)  

Diode Forward voltage  
I

S  

-2.4  
-1.2  
A
V
V

DS  

V

GS

=0V, I

S

=-2.4A  
Notes:  
1)  
2)  
Pulse Test: Pulse Width < 300µs, Duty Cycle ≤2%.  
Guaranteed by design, not subject to production testing.  
Page 2  
Ver2.1  

FS2301  
P-Channel SMD MOSFET  
Typical Characteristics  
Output Characteristics  
Transfer Characteristics  
-20  
-16  
-12  
-8  
-18  
-16  
-14  
-12  
-10  
-8  
T

a

=25
℃
 
V

DS

=-3V  
Pulsed  
V

GS

=-4V,-5V,-6V  
Pulsed  
T

a

=25
℃  
V

GS

=-3V  
T

a

=100
℃  
V

GS

=-2V  
-6  
-4  
-4  
V

GS

=-1.5V  
-2  
-0  
-0  
-0  
-1  
-2  
-3  
-4  
-5  
-0.0  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-3.5  
-4.0  
DRAIN TO SOURCE VOLTAGE
 
V

DS

(V)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
R

DS(ON)

V

GS  

——  
R

DS(ON)  

I

D  

——  
150  
120  
90  
300  
200  
100  
0
T

a

=25
℃  
Pulsed  
Pulsed  
I

D

=-2.6A  
V

GS

=-2.5V  
T

a

=100
℃  
T

a

=25
℃  
V

GS

=-4.5V  
60  
30  
-0.5  
-1.0  
-1.5  
-2.0  
-2.5  
-3.0  
-0  
-1  
-2  
-3  
-4  
-5  
DRAIN CURRENT
 
I

D

(A)  
GATE TO SOURCE VOLTAGE
 
V

GS

(V)  
Threshold Voltage  
I

S

——  
V

SD  

-3  
-1.0  
-0.8  
-0.6  
-0.4  
-0.2  
Pulsed  
-1  
I

D

=-250uA  
T

a

=100
℃  
T

a

=25
℃  
-0.1  
-0.0  
-0.4  
-0.8  
-1.2  
-1.6  
25  
50  
75  
100  
125  
SOURCE TO DRAIN VOLTAGE
 
V

SD

(V)  
JUNCTION TEMPERATURE
 
T

j

(
℃
)  
Page 3  
Ver2.1  

FS2301  
P-Channel SMD MOSFET  
SOT-23 Package Information  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
Max.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min.  
Max.  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
c
D
E
E1  
e
0.950 TYP.  
0.550 REF.  
0.037 TYP.  
0.022 REF.  
e1  
L
1.800  
0.300  
2.000  
0.500  
0.071  
0.012  
0.079  
0.020  
L1  
Ver2.1  
Page 4