FUXINSEMI-SS8050

Part #FUXINSEMI-SS8050
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FUXINSEMI-SS8050
SS8050  
General Purpose Transistors  
NPN Silicon  
FEATURES  
Complimentary to SS8550  
SOT-23  
MARKING: Y1  
MAXIMUM RATINGS (T

a

=25
℃
unless otherwise noted)  
Symbol  
V

CBO  

V

CEO  

V

EBO  

I

C  

Parameter  
Value  
Unit  
V
Collector-Base Voltage  
40  
V
Collector-Emitter Voltage  
Emitter-Base Voltage  
25  
V
5
Collector Current  
1.5  
A
Collector Power Dissipation  
Thermal Resistance From Junction
T
o Ambient  
Junction
T
e
m
perature  
300  
mW  
P

C  

R

ΘJA  

T

j  

417  
℃
/W  
℃
150  
Storage
T
e
m
perature  
T

stg  

-55
~
+150  
℃
ELECTRICAL CHARACTERISTICS (T
a
=25
℃
unless otherwise specified)  
Parameter  
Symbol  
V

(BR)CBO  

V

(BR)CEO  

V

(BR)EBO  

I

CBO  

Test conditions  
I

C

= 100
μ
A, I

E

=0  
I

C

= 0.1mA, I

B

=0  
I

E

=100
μ
A, I

C

=0  
M
in  
40  
25  
5
T
yp  
Max  
Unit  
V
Collector-base breakdown voltage  
Collector-emitter breakdown voltage  
Emitter-base breakdown voltage  
Collector cut-off current  
V
V
V

CB

=40
V
,
I

E

=0  
0.1  
0.1  
0.1  
400  
μ
A  
μ
A  
μ
A  
Collector cut-off current  
I

CEO  

V

C
E

=20
V
,
I

E

=0  
Emitter cut-off current  
I

EBO  

V

EB

= 5V, I

C

=0  
h

FE(1)  

V

CE

=1
V
,
I

C

= 100mA  
V

CE

=1
V
,
I

C

= 800mA  
I

C

=800mA, I

B

= 80mA  
I

C

=800mA, I

B

= 80mA  
120  
40  
DC current gain  
h

FE(2)  

Collector-emitter saturation voltage  
Base-emitter saturation voltage  
V

CE(sat)  

V

BE(sat)  

0.5  
1.2  
V
V
V

CE

=10
V
,
I

C

= 50mA  
f=30MHz  
Transition frequency  
f

T  

100  
MHz  
CLASSIFICATION OF h

FE  

(1)  
Rank  
L
H
J
120-200  
200-350  
300-400  
Range  
Page 1  
Ver2.1  

SS8050  
General Purpose Transistors  
NPN Silicon  
h

FE

——  
I

C  

Static Characteristic  
140  
120  
100  
80  
1000  
COMMON EMITTER  
V

CE

=1V  
500uA  
COMMON  
EMITTER  
T

a

=25
℃
 
T

a

=100
℃  
T

a

=25
℃  
450uA  
400uA  
300  
100  
350uA  
300uA  
250uA  
200uA  
150uA  
100uA  
I

B

=50uA  
60  
40  
30  
10  
20  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
1
3
10  
100  
1000 1500  
30  
300  
COLLECTOR CURRENT
 
I

C

(mA)  
COLLECTOR-EMITTER VOLTAGE
 
V

CE

(V)  
I

C  

V

BEsat

—— I

C  

V

CEsat

——  
1000  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
300  
100  
T

a

=100
℃  
T

a

=25
℃  
T

a

=25
℃  
30  
10  
T

a

=100
℃  
3
1
β
=10  
β
=10  
1000  
1
3
10  
30  
100  
1
3
10  
30  
100  
300  
1000  
1500  
300  
1500  
COLLECTOR CURRENT
 
I

C

(mA)  
COLLECTOR CURRENT
 
I

C

(mA)  
V

CB

/ V

EB  

I

C  

C

ob

/ C

ib

——  
V

BE

——  
200  
100  
1500  
1000  
f=1MHz  
I

E

=0/I

C

=0  
T

a

=25
℃  
C

ib  

300  
100  
T

a

=100
℃  
30  
10  
C

ob  

30  
10  
T

a

=25
℃  
3
1
3
1
COMMON EMITTER  
V

CE

=1V  
3
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
0.1  
0.3  
1
10  
20  
BASE-EMMITER VOLTAGE
 
V

BE

(V)  
REVERSE VOLTAGE  
V
(V)  
I

C  

f

T

——  
P

C

—— T

a  

1000  
350  
300  
250  
200  
150  
100  
50  
300  
100  
30  
10  
3
1
V

CE

=10V  
T

a

=25
℃  
0
30  
1
10  
100  
0
25  
50  
75  
100  
125  
150  
3
COLLECTOR CURRENT
 
I

C

(mA)  
AMBIENT TEMPERATURE
 
T

a

(
℃
)  
Page 2  
Ver2.1  

SS8050  
General Purpose Transistors  
NPN Silicon  
SOT-23 Package Information  
Dimensions In Millimeters  
Dimensions In Inches  
Symbol  
Min.  
0.900  
0.000  
0.900  
0.300  
0.080  
2.800  
1.200  
2.250  
Max.  
1.150  
0.100  
1.050  
0.500  
0.150  
3.000  
1.400  
2.550  
Min.  
0.035  
0.000  
0.035  
0.012  
0.003  
0.110  
0.047  
0.089  
Max.  
0.045  
0.004  
0.041  
0.020  
0.006  
0.118  
0.055  
0.100  
A
A1  
A2  
b
c
D
E
E1  
e
0.950 TYP.  
0.550 REF.  
0.037 TYP.  
0.022 REF.  
e1  
L
1.800  
0.300  
2.000  
0.500  
0.071  
0.012  
0.079  
0.020  
L1  
Page 3  
Ver2.1  

SS8050  
General Purpose Transistors  
NPN Silicon  
Pinning information  
Pin  
Simplified outline  
Symbol  
C
C
PinB Base  
PinC Collector  
PinE Emitter  
B
E
B
E
Marking  
Type number  
SS8050  
Marking code  
Y1  
Suggested solder pad layout  
SOT-23  
0.037(0.95)  
0.037(0.95)  
0.079(2.0)  
0.035(0.90)  
0.031(0.80)  
Dimensions in inches and (millimeters)  
Reel packing  
INNER  
BOX  
(m/m)  
REEL  
DIA,  
(m/m)  
CARTON  
SIZE  
(m/m)  
COMPONENT  
SPACING  
APPROX.  
BOX  
(pcs)  
PACKAGE  
REEL SIZE  
REEL  
(pcs)  
GROSS WEIGHT  
CARTON  
(pcs)  
(kg)  
(m/m)  
SOT-23  
3,000  
4.0  
30,000 183*123*183  
178  
382*257*387  
240,000  
11.6  
7″  
Ver2.1  
Page 4  

SS8050  
General Purpose Transistors  
NPN Silicon  
Suggested thermal profiles for soldering processes  
1.Storage environment:
T
e
mperature=5

o

C~40

o

C Humidity=55%
 
25%  
2.Reflow soldering of surface-mount devices  
Critical Zone  
TL to TP  
Tp  
TP  
Ramp-up  
TL  
TL  
T
s
max  
T
s
min  
tS  
Preheat  
Ramp-down  
25  
t25

o

C to Peak  
Time  
3.Reflow soldering  
Profile Feature  
Soldering Condition  
Average ramp-up rate(T

L

to T

P

)  
<3

o

C/sec  
Preheat  
–
T
e
mperature Min(
T
s
min)  
–
T
e
mperature Max(
T
s
max)  
-Time(min to max)(t

s

)  
150

o

C  
200

o

C  
60~120sec  
T
s
max to T

L  

-Ramp-upRate  
<3

o

C/sec  
Time maintained above:  
–
T
e
mperature(T

L

)  
-Time(t

L

)  
217

o

C  
60~260sec  
Peak
T
e
mperature(T

P

)  
255

o

C-0/+5

o

C  
Time within 5

o

C of actual Peak  
T
e
mperature(t

P

)  
10~30sec  
Ramp-down Rate  
<6

o

C/sec  
Time 25

o

C to Peak
T
e
mperature  
<6minutes  
Ver2.1  
Page 5