GL-GL4N65FA9

Part #GL-GL4N65FA9
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GL-GL4N65FA9
R
○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
V

DSS

(T

C

=150
℃
)  
650  
4
V
A
General Description
:
 
I

D  

GL4N65FA9,  
the  
silicon  
N-channel  
Enhanced  
P

D

(T

C

=25
℃
)  
R

DS(ON)typ  

30  
1.9  
W
Ω
VDMOSFET, is obtained by the self-aligned planar  
T
e
chnology which reduce the conduction loss, improve  
switching performance and enhance the avalanche energy.  
The transistor can be used in various power switching  
circuit for system miniaturization and higher efficiency. The  
package form is TO-220F, which accords with the RoHS  
standard.  
TO-220F  
Features
:  
Fast Switching  
ESD Improved Capability  
Low ON Resistance(Typical Data:1.9
Ω
)  
Low Gate Charge
 
(Typical Data:14.5nC)  
Low Reverse transfer capacitances(Typical:8.5pF)  
100% Single Pulse avalanche energy
T
e
st  
Applications
:  
Power switch circuit of adaptor and charger  
Absolute
(
T
c
= 25
℃
unless otherwise specified
)
:  
Symbol  
V

DSS  

Parameter  
Drain-to-Source Voltage  
Rating  
Units  
650  
4
V
A
Continuous Drain Current  
Continuous Drain Current T

C

= 100
°C  
Pulsed Drain Current  
I

D  

3.2  
16  
A
a1  
I

DM  

A
V

GS  

Gate-to-Source Voltage  
±
30  
280  
30  
V
a2  
E

AS  

Single Pulse Avalanche Energy  
Avalanche Energy ,Repetitive  
Avalanche Current  
mJ  
mJ  
A
a1  
E

AR  

a1  
I

AR  

2.5  
5.0  
30  
dv/dt

a3

Peak Diode Recovery dv/dt  
V/ns  
W
Power Dissipation  
P

D  

Derating Factor above 25
°C  
0.24  
W/
℃  
℃
T

J

,
T

stg

Operating Junction and Storage Temperature Range  
150
,
–
55 to 150  
T

L  

MaximumTemperature for Soldering  
300  
℃
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R
○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
Electrical Characteristics
(
T
c
= 25
℃
unless otherwise specified
)
:  
OFF Characteristics  
Rating  
Symbol  
V

DSS  

Parameter  
T
e
st Conditions  
Units  
Min. Typ. Max.  
Drain to Source Breakdown Voltage
 
V

GS

=0
V
,
I

D

=250
µ
A  
650 —  
—  
—  
1
V
Δ
BV

DSS

/
Δ
T

J

Bvdss
T
e
mperature Coefficient  
I

D

=250uA,Reference25
℃  
V

DS

=650
V
,
V

GS

=0
V
,
T

a

=25
℃  
—  
—  
0.67  
V/
℃  
—  
—  
I

DSS  

Drain to Source Leakage Current  
µ
A  
V

DS

=520
V
,
V

GS

=0
V
,
T

a

=125
℃  
—  
100  
I

GSS(F)  

I

GSS(R)  

Gate to Source Forward Leakage  
Gate to Source Reverse Leakage  
V

GS

=+30V  
V

GS

=-30V  
—  
—  
—  
—  
1
µ
A  
µ
A  
-1  
ON Characteristics  
Rating  
Symbol  
Parameter  
T
e
st Conditions  
Units  
Min. Typ. Max.  
R

DS(ON)

Drain-to-Source On-Resistance  
V

GS(TH)

Gate Threshold Voltage  
V

GS

=10
V
,
I

D

=2.0A  
—  
1.9  
—  
2.4  
4.0  
Ω
V

DS

=V

GS

,I

D

=
250µA  
2.0  
V
Pulse width tp
≤
30
0µs,δ≤
2%  
Dynamic Characteristics  
Rating  
Symbol  
Parameter  
T
e
st Conditions  
V

DS

=15
V
,
I

D

=2.0A  
Units  
S
Min. Typ. Max.  
g

fs  

C

iss  

C

oss  

C

rss  

Forward
T
r
ansconductance  
Input Capacitance  
—  
—  
—  
—  
3.5  
544  
55  
—  
—  
—  
—  
V

GS

=0V V

DS

=25V  
f=1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
8.5  
Resistive Switching Characteristics  
Rating  
Symbol  
Parameter  
Turn-on Delay Time  
T
e
st Conditions  
Units  
ns  
Min. Typ. Max.  
t

d(ON)  

t

r  

t

d(OFF)  

t

f  

—  
—  
—  
—  
—  
—  
—  
10  
11  
—  
—  
—  
—  
—  
—  
—  
Rise Time  
I

D

=4.0A,V

DD

=325V  
R

g

=4.7
Ω  
Turn-Off Delay Time  
Fall Time  
31  
14  
Q

g  

T
o
tal Gate Charge  
Gate to Source Charge  
Gate to Drain (
“
Miller
”
)Charge  
14.5  
3.0  
6.0  
I

D

=4.0A,V

DD

=325V  
V

GS

=10V  
Q

gs  

Q

gd  

nC  
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○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
Source-Drain Diode Characteristics  
Rating  
Symbol  
Parameter  
T
e
st Conditions  
Units  
Min. Typ. Max.  
I

S  

Continuous Source Current (Body Diode)  
Maximum Pulsed Current (Body Diode)  
Diode Forward Voltage  
—  
—  
—  
—  
—  
—  
4
A
A
I

SM  

V

SD  

t

rr  

16  
1.5  
—  
I

S

=4.0A,V

GS

=0V  
—  
V
Reverse Recovery Time  
430  
ns  
uC  
I

S

=4.0A,T

j

=25
℃  
Q

rr  

Reverse Recovery Charge  
— 1270 —  
dI

F

/dt=100A/us,V

GS

=0V  
Pulse width tp
≤
38
0µs,δ≤
2%  
Symbol  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Typ.  
Units  
R

θ
JC  

R

θ
JA  

4.17  
100  
℃
/W  
℃
/W  

a1

:
Repetitive rating; pulse width limited by maximum junction temperature  

a2

:
L=10.0mH, I

D

=7.6A, Start T

J

=25
℃  

a3

:
I

SD

=4A,di/dt
≤
100A/us,V

D
D

≤
BV

D
S,

Start T

J

=25
℃  
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R
○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
Characteristics Curve
:  
Wuxi Guang Lei electronic technology co., LTD  
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/
6  

R
○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
Wuxi Guang Lei electronic technology co., LTD  
5
/
6  

R
○
GL4N65FA9  
无锡光磊电子科技有限公司  
GL Silicon
 
N-Channel Power MOS
FET  
Company
:
W
uxi Guang Lei electronic technology co., LTD  
TEL
:
1
3961734102  
Mr.yuan  
Wuxi Guang Lei electronic technology co., LTD  
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